氢气浸泡辐照加速方法在3DG111器件上的应用及辐射损伤机理分析

本文以~(60)Co为辐照源,针对3DG111型晶体管,利用半导体参数分析仪和深能级缺陷瞬态谱仪,研究高/低剂量率和有/无氢气浸泡条件下,电性能和深能级缺陷的演化规律.试验结果表明,与高剂量率辐照相比,低剂量率辐照条件下,3DG111型晶体管的电流增益退化更加严重,这说明该器件出现了明显的低剂量率增强效应;无论是高剂量率还是低剂量率辐照条件下,3DG111晶体管的辐射损伤缺陷均是氧化物正电荷和界面态陷阱,并且低剂量率条件下,缺陷能级较深;氢气浸泡后在高剂量率辐照条件下,与未进行氢气处理的器件相比,辐射损伤程度明显加剧,且与低剂量率辐照条件下器件的损伤程度相同,缺陷数量、种类及能级也相同.因此,氢气浸泡处理可以作为低剂量率辐射损伤增强效应加速评估方法的有效手段.     

Effect of bias condition on heavy ion radiation in bipolar junction transistor

The characteristic degradations in silicon NPN bipolar junction transistor (BJT) of 3DG142 type are examined under the irradiation with 40-MeV chlorine (Cl) ions under forward, grounded, and reverse bias conditions, respectively. Different electrical parameters are in-situ measured during the exposure under each bias condition. From the experimental data, larger variation of base current (I_B) is observed after irradiation at a given value of base-emitter voltage (V_BE), while the collector current is slightly affected by irradiation at a given V_BE. The gain degradation is affected mostly by the behaviour of the base current. From the experimental data, the variation of current gain in the case of forward bias is much smaller than that in the other conditions. Moreover, for 3DG142 BJT, the current gain degradation in the case of reverse bias is more severe than that in the grounded case at low fluence, while at high fluence, the gain degradation in the reverse bias case becomes smaller than that in the grounded case.     

速度和载荷对脂润滑2Cr13钢离子渗氮层摩擦学行为的影响

利用销-盘式摩擦磨损试验机对不同速度和载荷条件下 PFPE脂润滑2Cr13钢离子渗氮层进行了系统的真空滑动摩擦磨损试验.采用扫描电子显微镜(SEM)、X射线光电子能谱仪(XPS)和傅里叶变换红外光谱(FTIR)分别对磨损表面的形貌、化学状态及润滑脂的成分进行分析.结果表明:随着载荷和滑动速度的增加,脂润滑渗氮层的磨损机制由轻微磨损向轻微复合磨损机制转变.在真空摩擦磨损过程中2Cr13钢离子渗氮层与PFPE润滑脂发生化学反应,并有FeF3生成,促进PFPE润滑脂发生降解,形成酸性的氟化物.增加载荷和速度会加速渗氮层与润滑脂之间的反应,进一步促进润滑脂的降解.     

纳米Ni在77 K温度下压缩行为的研究

利用低温力学测试系统研究了电化学沉积纳米Ni在77 K温度下的压缩行为. 室温下纳米Ni 的屈服强度为 2.0 GPa, 77 K温度下的屈服强度为3.0 GPa, 压缩变形量则由室温的10%左右下降到5%. 借助应变速率敏感指数、激活体积、扫描电子显微和高分辨透射电子显微分析, 对纳米Ni的塑性变形机制进行了表征. 研究表明, 在77 K温度下的塑性变形主要是由晶界-位错协调变形主导, 晶界本征位错弓出后无阻碍地在晶粒内无位错区运动, 直至在相对晶界发生类似切割林位错行为. 同时分析了弓出位错的残留位错部分在协调塑性变形时起到的增加应变相容性和减小应力集中的作用. 利用晶界-位错协调机制和残留位错运动与温度及缺陷的相关性揭示了纳米Ni室温和77 K温度压缩性能差异的内在原因. 关键词： 塑性变形 强度 位错     

Effect of bias condition on heavy ion radiation in bipolar junction transistors

The characteristic degradations in a silicon NPN bipolar junction transistor(BJT) of 3DG142 type are examined under irradiation with 40-MeV chlorine(Cl) ions under forward,grounded,and reverse bias conditions,respectively.Different electrical parameters are in-situ measured during the exposure under each bias condition.From the experimental data,a larger variation of base current(I B) is observed after irradiation at a given value of base-emitter voltage(V BE),while the collector current is slightly affected by irradiation at a given V BE.The gain degradation is affected mostly by the behaviour of the base current.From the experimental data,the variation of current gain in the case of forward bias is much smaller than that in the other conditions.Moreover,for 3DG142 BJT,the current gain degradation in the case of reverse bias is more severe than that in the grounded case at low fluence,while at high fluence,the gain degradation in the reverse bias case becomes smaller than that in the grounded case.     

Radiation effects of 50-MeV protons on PNP bipolar junction transistors

The effects of radiation on 3CG110 PNP bipolar junction transistors (BJTs) are characterized using 50-MeV protons, 40-MeV Si ions, and 1-MeV electrons. In this paper, electrical characteristics and deep level transient spectroscopy (DLTS) are utilized to analyze radiation defects induced by ionization and displacement damage. The experimental results show a degradation of the current gain and an increase in the types of radiation defect with increasing fluences of 50-MeV protons. Moreover, by comparing the types of damage caused by different radiation sources, the characteristics of the radiation defects induced by irradiation show that 50-MeV proton irradiation can produce both ionization and displacement defects in the 3CG110 PNP BJTs, in contrast to 40-MeV Si ions, which mainly generate displacement defects, and 1-MeV electrons, which mainly produce ionization defects. This work provides direct evidence of a synergistic effect between the ionization and displacement defects caused in PNP BJTs by 50-MeV protons.     

温度和应变速率耦合作用下纳米晶Ni压缩行为研究

本文利用低温力学测试系统研究了电化学沉积纳米晶Ni在不同温度和宽应变速率条件下的压缩行为. 借助应变速率敏感指数、激活体积、扫描电子显微镜及高分辨透射电子显微镜方法, 对纳米晶Ni的压缩塑性变形机理进行了表征. 研究表明, 在较低温度条件下, 纳米晶Ni的塑性变形主要是由晶界位错协调变形主导, 晶界本征位错引出后无阻碍的在晶粒内无位错区运动, 直至在相对晶界发生类似切割林位错行为. 并且, 在协调塑性变形时引出位错的残留位错能够增加应变相容性和减小应力集中; 在室温条件下, 纳米晶Ni的塑性变形机理主要是晶界-位错协调变形与晶粒滑移/旋转共同主导. 利用晶界位错协调变形机理和残留位错运动与温度及缺陷的相关性揭示了纳米晶Ni在不同温度、不同应变速率条件下力学压缩性能差异的内在原因.     

Incident particle range dependence of radiation damage in a power bipolar junction transistor

The characteristic degradations in silicon NPN bipolar junction transistors(BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon(C),40-MeV silicon(Si),and 40-MeV chlorine(Cl) ions respectively.Different electrical parameters are measured in-situ during the exposure of heavy ions.The experimental data shows that the changes in the reciprocal of the gain variation((1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C,40-MeV Si,and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence.The(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence,a little smaller when the device is irradiated by 40-MeV Si ions,and smallest in the case of the 40-MeV Cl ions irradiation.The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage.     

Radiation effects on MOS and bipolar devices by 8 MeV protons, 60 MeV Br ions and 1 MeV electrons

The radiation effects of the metal-oxide-semiconductor (MOS) and the bipolar devices are characterised using 8~MeV protons, 60~MeV Br ions and 1~MeV electrons. Key parameters are measured {\it in-situ} and compared for the devices. The ionising and nonionising energy losses of incident particles are calculated using the Geant4 and the stopping and range of ions in matter code. The results of the experiment and energy loss calculation for different particles show that different incident particles may give different contribution to MOS and bipolar devices. The irradiation particles, which cause larger displacement dose within the same chip depth of bipolar devices at a given total dose, would generate more severe damage to the voltage parameters of the bipolar devices. On the contrary, the irradiation particles, which cause larger ionising damage in the gate oxide, would generate more severe damage to MOS devices. In this investigation, we attempt to analyse the sensitivity to radiation damage of the different parameter of the MOS and bipolar devices by comparing the irradiation experimental data and the calculated results using Geant4 and SRIM code.     

晶粒尺寸对1 MeV电子在金属Ni中能量沉积的影响

采用脉冲电沉积方法制备出高致密、高质量的纳米晶Ni, 并对其密度、组织成分和微观结构进行了表征. 利用高能粒子加速器产生的1 MeV高能电子为辐照源, 研究高能电子在纳米晶Ni和常规粗晶Ni中的能量损失. 通过辐照过程中放置的吸收剂量片来准确表征其电子的能量沉积. 结果表明, 晶粒尺寸对高能电子在材料中的能量沉积有明显的影响, 1 MeV电子在穿过一定厚度的金属Ni后, 在晶粒尺寸细小的纳米晶Ni中测得总的吸收剂量较大, 证明了高能电子在纳米材料中的总能量沉积较小, 从而表现出纳米材料抗辐照的优异性能. 关键词： 高能电子 纳米金属 辐射损伤