排序方式: 共有62条查询结果,搜索用时 15 毫秒
41.
理论上分析了PPMgLN光参量振荡波长调谐特性,计算了泵浦阈值和转换效率。准相位匹配情况下,周期调谐是获得中红外波长调谐有效方法之一。采用高斯光束泵浦,当泵浦功率密度超过阈值泵浦功率密度约6.5倍时,可以获得最高转换效率,约71%。采用1 064 nm激光泵浦多周期PPMgLN晶体,实验上获得了波长调谐范围2.7~4.8 mm,当泵浦功率为8 W时,在波长3.7 mm处激光输出功率超过1.6 W,斜效率超过20%,相应的转换效率约为69%,与理论分析基本一致。 相似文献
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流变性能;流变行为;极低剪切速率下聚丙烯酰胺溶液在毛细管中的流变特性 Ⅱ.毛细管尺寸和盐浓度对流变性能的影响 相似文献
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采用水热-共沉淀法在氧化锌表面包覆锡化合物,利用扫描电子显微镜(SEM)、X射线衍射(XRD)和能谱分析对制备的包覆ZnO材料进行表征。结果表明:XRD表明附着在氧化锌表面的是Sn6O4(OH)4,且结晶度较好;SEM测试显示在pH=12条件下,Sn6O4(OH)4能够很好地附着在氧化锌颗粒表面;能谱分析显示组成物中的元素包含Zn、Sn、O三种元素。利用循环伏安曲线、电化学阻抗谱(EIS)、倍率充放电技术对包覆ZnO材料进行了电化学性能的测试,结果表明:包覆Sn6O4(OH)4的ZnO可以提高锌负极的耐蚀性能,增大电荷转移电阻(Rct);锌电极覆Sn6O4(OH)4量为3%时充放电效率最佳,在0.2C充放循环40次后充放电循环保持率仍有70%。 相似文献
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A reduced surface electric field in an AlGaN/GaN high electron mobility transistor(HEMT) is investigated by employing a localized Mg-doped layer under the two-dimensional electron gas(2-DEG) channel as an electric field shaping layer.The electric field strength around the gate edge is effectively relieved and the surface electric field is distributed evenly as compared with those of HEMTs with conventional source-connected field plate and double field plate structures with the same device physical dimensions.Compared with the HEMTs with conventional sourceconnected field plates and double field plates,the HEMT with a Mg-doped layer also shows that the breakdown location shifts from the surface of the gate edge to the bulk Mg-doped layer edge.By optimizing both the length of Mg-doped layer,L m,and the doping concentration,a 5.5 times and 3 times the reduction in the peak electric field near the drain side gate edge is observed as compared with those of the HEMTs with source-connected field plate structure and double field plate structure,respectively.In a device with V GS = -5 V,L m = 1.5 μm,a peak Mg doping concentration of 8×10 17cm-3 and a drift region length of 10 μm,the breakdown voltage is observed to increase from 560 V in a conventional device without field plate structure to over 900 V without any area overhead penalty. 相似文献
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冰晶石-氧化铝熔液是由各类离子质点组成的相当复杂的混合物,研究此熔盐系的离子结构对探讨铝电解机理和氧化铝在冰晶石熔液中的溶解机理具有重要意义[1],由于冰晶石-氧化铝的熔点高和腐蚀严重,一些衍射技术难以用于此熔盐系液态微观结构性质的研究。 相似文献
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综述了砷对冶金、环境以及人类的危害,阐述了冶金工业中含砷物料的除砷技术的发展现状,介绍了各种技术的原理、应用,分析了各种技术的优缺点,展望了除砷技术的发展方向。 相似文献
48.
A novel 4H-SiC lateral bipolar junction transistor structure with high voltage and high current gain 下载免费PDF全文
In this paper, a novel structure of a 4H-SiC lateral bipolar junction transistor (LBJT) with a base field plate and double RESURF in the drift region is presented. Collector-base junction depletion extension in the base region is restricted by the base field plate. Thin base as well as low base doping of the LBJT therefore can be achieved under the condition of avalanche breakdown. Simulation results show that thin base of 0.32 μm and base doping of 3×1017 cm-3 are obtained, and corresponding current gain is as high as 247 with avalanche breakdown voltage of 3309 V when the drift region length is 30 μm. Besides, an investigation of a 4H-SiC vertical BJT (VBJT) with comparable breakdown voltage (3357 V) shows that the minimum base width of 0.25 μm and base doping as high as 8×1017 cm-3 contribute to a maximum current gain of only 128. 相似文献
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An AlGaN/GaN HEMT with enhanced breakdown and a near-zero breakdown voltage temperature coefficient 下载免费PDF全文
An AlGaN/GaN high-electron mobility transistor(HEMT) with a novel source-connected air-bridge field plate(AFP) is experimentally verified.The device features a metal field plate that jumps from the source over the gate region and lands between the gate and drain.When compared to a similar size HEMT device with a conventional field plate(CFP) structure,the AFP not only minimizes the parasitic gate to source capacitance,but also exhibits higher OFF-state breakdown voltage and one order of magnitude lower drain leakage current.In a device with a gate to drain distance of 6 μm and a gate length of 0.8 μm,three times higher forward blocking voltage of 375 V was obtained at VGS =-5 V.In contrast,a similar sized HEMT with a CFP can only achieve a breakdown voltage no higher than 125 V using this process,regardless of device dimensions.Moreover,a temperature coefficient of 0 V/K for the breakdown voltage is observed.However,devices without a field plate(no FP) and with an optimized conventional field plate(CFP) exhibit breakdown voltage temperature coefficients of-0.113 V/K and-0.065 V/K,respectively. 相似文献
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