Microelectronics packaging has been developing rapidly due to the demands for faster, lighter and smaller products. Printed circuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved development of the structural integrity models for predicting lifetime under thermal environmental exposure; however the theoretical models need verification by the experiment.
The objective of the current work is the development of an optical system and testing procedure for evaluation of the thermal deformation of PCBs in the wide temperature range. Due to the special requirements of the specimen and test condition, the existing technologies and setups were updated and modified. The discussions on optical methods, thermal loading chambers, and image data processing are presented. The proposed technique and specially designed test bench were employed successfully to measure the thermal deformations of PCB in the −40°C to +160°C temperature range. The video-based moiré interferometry was used for generating, capturing and analysis of the fringe patterns. The obtained information yields the needed coefficients of thermal expansion (CTE) for tested PCBs. 相似文献
The optimisation of a printed circuit board assembly line is mainly influenced by the constraints of the surface mount device (SMD) placement machine and the characteristics of the production environment. This paper surveys the characteristics of the various machine technologies and classifies them into five categories (dual-delivery, multi-station, turret-type, multi-head and sequential pick-and-place), based on their specifications and operational methods. Using this classification, we associate the machine technologies with heuristic methods and discuss the scheduling issues of each category of machine. We see the main contribution of this work as providing a classification for SMD placement machines and to survey the heuristics that have been used on different machines. We hope that this will guide other researchers so that they can subsequently use the classification or heuristics, or even design new heuristics that are more appropriate to the machine under consideration. 相似文献
A convenient assembly recently proposed for screen printed gold electrodes (SPEs) suitable for measurements in gaseous samples is here tested for the analysis of the ethanol content in alcoholic drinks. This assembly involves the use of a circular crown of filter paper, soaked in the room temperature ionic liquid (RTIL) 1-butyl-3-methylimidazolium hydrogen sulfate, which is simply placed upon a disposable screen printed cell, so as to contact the outer edge of the gold disc working electrode, as well as peripheral counter and reference electrodes. The electrical contact between the paper crown soaked in RTIL and the SPE electrode is assured by a gasket and all components are installed in a polylactic acid holder. This assembly provides a portable and disposable electrochemical platform, assembled by the easy immobilization onto a porous and inexpensive supporting material such as paper of a RTIL characterized by profitable electrical conductivity and negligible vapor pressure. The electroanalytical performance of this device was assayed for the flow injection analysis of the ethanol concentration in some real samples of wine and beer and the results obtained are compared with the alcoholic degree reported in the relevant bottle-labels, thus highlighting a substantially satisfactory agreement. Repeatable sharp peaks (RSD=6–8 %) were detected for ethanol over a wide linear range (1–20 % v/v in water) and a detection and quantitation limit of 0.55 % v/v and 1.60 % v/v were inferred for a signal-to-noise ratio of 3 and 10, respectively. 相似文献
Novel materials and a metallization technique for the printed electronics were studied. Insulator inks and conductive inks were investigated. For the conductive ink, the nano-sized copper particles were used as metallic sources. These particles were prepared from a copper complex by a laser irradiation process in the liquid phase. Nano-sized copper particles were consisted of a thin copper oxide layer and a metal copper core wrapped by the layer. The conductive ink showed good ink-jettability. In order to metallize the printed trace of the conductive ink on a substrate, the atomic hydrogen treatment was carried out. Atomic hydrogen was generated on a heated tungsten wire and carried on the substrate. The temperature of the substrate was up to 60 °C during the treatment. After the treatment, the conductivity of a copper trace was 3 μΩ cm. It was considered that printed wiring boards can be easily fabricated by employing the above materials. 相似文献
A planning and scheduling model is developed for the onsertion-phase in printed circuit board (PCB) assembly. PCBs are manufactured by machines that mount components, such as chips, on a PCB. On an onsertor machine, a certain number of component types can be stored. These components are subsequently used for the production of a certain PCB batch type. This research develops a production planning and scheduling formulation to determine the component–machine allocations, as well as a PCB sequence. Two strategies are proposed; one focusing on minimal number of changeovers (C-strategy), and the other on minimal process time (P-strategy). Both strategies were validated in a pilot study with real company data, with encouraging results for potential implementation. 相似文献