金属Cu熔化结晶过程的分子动力学模拟

采用常温、常压分子动力学模拟技术,研究了在周期性边界条件下,由864个Cu原子构成的模型系统的熔化、结晶过程。原子间相互作用势采用EAM势。模拟结果表明：在连续升温过程中,金属Cu在1520 K熔化;以不同的冷速进行冷却,在较慢冷却条件下,液态Cu在1010 K结晶;当冷速较快时,液态Cu形成非晶态。分析了升降温过程中熔体偶分布函数、原子体积、能量、MSD随温度的变化特征。     

小尺寸金属团簇熔化过程的分子动力学模拟

运用分子动力学方法模拟了小尺寸金属团簇的熔化过程, 原子之间的作用采用嵌入原子法(EAM)模型, 计算了均方根键长涨落δ随温度的变化, 以及升温过程中团簇热容的变化. 包含55、56个原子的面心立方(FCC)结构Au团簇的熔化过程是基本相同的. 而同样结构和数目Cu团簇的熔化过程却呈现出不同的趋势. Cu55、Cu56在模拟过程中都出现了FCC结构到二十面体结构的转变. 但由于表面多出了一个原子, Cu56的热容曲线比Cu55多了一个峰, 体系出现了预熔化现象. 这表明小尺寸团簇的固液转变的过程与团簇的原子类型、几何结构和原子数目密切相关.     

原子尺寸差异与非晶形成能力

采用分子动力学模拟技术，研究了纯Au及AuCu合金的熔化、非晶化和晶化过程.模拟结果表明,在冷却速率为5×1011 K•s－1至4×1012 K•s－1的范围内，液态Au总是形成晶体，且冷速越快，结晶温度越低；而AuCu合金则形成非晶，且冷速越快，非晶转变温度越高.验证了原子尺寸的不匹配有利于非晶形成这一规律.     

中介尺度Au纳米团簇熔化的分子动力学模拟

采用分子动力学模拟技术，研究了原子个数为16～8628的 Au纳米团簇的熔化过程.采用 Johnson的EAM (embedded atom method) 模型,模拟结果表明，金属纳米团簇存在一中介尺度区域.对Au纳米团簇而言，当原子个数N >456时，团簇的热力学性质与团簇尺寸呈线性关系，熔化首先从表面开始，逐步向中心区域推进，且满足Tmb－Tmc(N)＝aN(－1/3)的关系.另外，计算了中介区域的团簇的尺寸、熔化温度、表面能、熵、焓等热力学量以及均方根位移（RMSD）等动力学量，为研究纳米团簇提供定量数据.     

金属Cu低指数表面熔化行为的分子动力学模

采用Mishin镶嵌原子势, 通过分子动力学方法模拟了金属Cu的低指数表面在不同温度的表面熔化行为, 分析了熔化过程中系统结构组态的变化以及固-液界面迁移情况. 金属Cu的(100)和(110)表面在低于熔点发生预熔化, 而(111)表面存在明显的过热现象. 准液体层的厚度随温度升高而增加, 热稳定性与表面的密排顺序一致, 按(111)、(100)、(110)顺序增大. 当温度高于热力学熔点时, 固液界面的移动速度与温度成正比, 外推得到热力学熔点约为1360～1380 K, 与实验结果1358 K吻合良好. 动力学系数定义为界面移动速度与过热程度的比值, 表现为明显的各向异性: k100=39 cm•s−1•K−1, k110=29 cm•s−1•K−1, k111=20 cm•s−1•K−1. k100与k110之间的比例符合collision-limited理论, (111)密排面有与其它低指数表面不同的熔化方式.     

升温速率对金属铅的熔化和过热行为的影响

采用分子动力学方法和QSC(quantum Sutton-Chen)力场研究了升温速率对金属铅的熔化和过热行为的影响.模拟中考虑了缺陷和表面对熔化和过热行为的作用.结果表明，升温速率对金属铅的熔化和过热行为影响很大，随着升温速率的升高，金属铅的熔点有所升高.快的升温速率会导致金属铅体系内部无序化程度增加，进而使体系能量增加，降低了熔化相变的能垒.升温速率导致的金属铅的过热极限大约为780 K.     

Pt-Au合金团簇热力学性质分子动力学模拟研究

采用分子动力学方法和原子嵌入法模型势模拟了Pt原子和Au原子合金纳米团簇的熔化过程,研究了这些金属原子纳米团簇熔点与团簇组分的关系,发现不同组分纳米团簇的熔点不是单调变化的,同时均出现了负热容现象.通过对各种团簇溶化前后结构的比较研究,分析了导致这种现象的原因.     

丙烯腈在Cu(100)表面化学吸附的密度泛函理论研究

利用密度泛函方法, 模拟金属铜原子簇Cu₁₄(9,4,1)的(100)表面, 对丙烯腈(CH₂＝CHCN)在Cu(100)面上不同吸附位的吸附状况进行了理论研究. 结果表明: 丙烯腈分子通过端位N原子垂直吸附在金属表面上为弱化学吸附, 部分电荷从丙烯腈分子转移至铜金属簇; 由N原子的孤对电子与金属铜形成弱σ共价键; 顶位是最佳吸附位, 吸附能为40.7391 kJ•mol^－1, N原子与金属表面间的平衡距离为0.2279 nm; 其次为桥位和穴位, 吸附能分别为36.2513和30.2158 kJ•mol^－1, 平衡距离为0.2194和0.2886 nm; 吸附后C≡N键的强度降低, 活化了丙烯腈分子. 化学吸附使体系的熵减小, 是由于丙烯腈分子的平动和转动因吸附而被限制.     

金属银在高升温速率下的熔化和过热行为

采用分子动力学方法和QSC(quantum Sutton-Chen)力场研究了升温速率对金属银的熔化和过热行为的影响.模拟中考虑了缺陷和表面对熔化和过热行为的影响.研究结果表明,升温速率对金属银的熔化和过热行为有很大影响,随着升温速率的升高,金属银的熔点有所升高.高的升温速率会导致金属银体系内部无序化程度增加,降低了熔化相变的能垒.升温速率导致的银完美晶体的过热极限大约为1450 K.     

液铜快速冷却过程微观结构演变的计算机模拟

利用计算机模拟了在周期性边界条件下由500个原子构成的液态Cu模型系统以 4.2 * 10~(13) K/s的速率快速凝固的全过程。模拟在FS相互作用势的基础上，通 过双体分布函数、键对分析技术、键取向序等多种方法，对液Cu快冷凝固过程的微 观结构转变特性作了分析，给出了连续快速冷凝过程中液Cu原子间依靠相互作用力 形成的独特的微观结构图像。模拟结果重现了实验值，且表明在快速冷却过程中液 Cu没有形成body center cubic结构的倾向。     

Simulations of Metal Cu in Heating Process

Introduction In order to study the short-range order as well as thermodynamic properties, two distinct techniques of computer simulation, namely, the molecular dynamics and Monte Carlo methods, are most frequently em-ployed. In both techniques, the interaction potential is the primary input for computation. Mitra and co-workers1 have used a two-body model with Coulombic interac-tions and a power-law repulsion, fitted to the short- range structure and melting temperature of cristobalite. Thre…     

金属Cu晶化与玻璃化行为的分子动力学模拟

A series of simulations of the crystallization and vitrification processes for metal Cu were carried out by means of the molecular dynamics technique. The radial distribution function, common neighbors, internal energy and volume of the system were recorded during the processes. The atomic internal energy, atomic Voronoi volume and atomic stress field of the relax system were analyzed at zero temperature. The interaction between atoms in the system is described using the embedded atom potential as proposed by Mishin. The simulation results show that crystalline and non-crystalline phases form at lower and higher cooling rates respectively. In comparison to nanocrystals, it is found that metallic glass has higher internal energy and larger volume. The intrinsic stress field is induced by distortion of the lattice.     

Infuence of New Interaction Potential on MD Simulation of MgSiO3 Perovskite Thermodynamic Properties

The interaction potential plays an important role in molecular dynamics (MD) simulations. Pair potentialhas been used to simulate the melting temperature of MgSiO3 perovskite in previous studies, but considerablediscrepancy of melting temperature exists between these simulations. Comparisons of potential energy curvesare performed to explain the discrepancy. To further investigate the infuence of the interaction potentialparameters on the MD simulation result, a new set of potential parameters is developed based on two fitting potential parameters of previous studies, and is applied in the present study. The simulated molar volume MgSiO3 perovskite agrees well with the study by Belonoshko and Dubrovinsky at ambient condition. The equations of state, constant-pressure heating capacity and the constant-pressure thermal expansivity of MgSiO3 perovskite are close to the experimental data. Calculated melting temperatures are also comparable with those derived from previous studies.     

Molecular dynamics simulations of semicrystalline polymers: Crystallization,melting, and reorganization

Large‐scale molecular dynamics (MD) simulations of semicrystalline entangled polymers are carried out to explore crystallization and melting processes. Semicrystalline polymers are obtained from disordered melts via homogeneous nucleation. In the early stage of the crystallization process, the collective scattering does not show the emergence of nuclei seeds. Although the crystallization process is thermodynamically simple, the melting process is complex resulting in multiple‐peaked melting endotherms. The molecular origin is found to be the different thermal stabilities of microcrystalline domains (MCDs). Coexistence of melting and growth of different MCDs during sufficiently slow heating enlarges the difference of their thermal stabilities. An increase of stem length close to the melting point is assisted by disorder effects in particular in the surface regions of the MCDs. The number of trans–trans states is decreasing, which increases the flexibility and mobility of the crystalline stems. We have also investigated self‐seeding processes, and we show how these can be used to obtain single lamellar crystals in MD simulations. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2010     

Origin of double melting peaks in drawn nylon 6 yarns

The differential scanning calorimetry (DSC) melting curves of drawn nylon 6 were studied from the standpoint of reorganization of the crystals during the heating process. A new method was presented to obtain the DSC curve associated with the growth and melting of the original crystals, and that with the recrystallization and final melting process, separately. The results obtained show that, in the case of a heating rate of 10°C/min, the original crystals in the sample start perfecting themselves at temperatures far below their initial melting temperature and melt out below 222°C, recrystallization starts at about 210°C, and the newly emerged crystals melt out at 228°C. The superposition of two such constructed DSC curves reproduces the observed DSC curve well. Therefore, the double melting peaks of the sample are considered to be the result of superposition of three processes which occur successively during heating; perfection of the original crystals, melting of the perfected crystals concurrently with recrystallization, and melting of the recrystallized crystals.     

Molecular dynamics study of atomic transport properties in rapidly cooling liquid copper

Based on Mei's embedded atom model molecular dynamics simulations have been performed to investigate the rapidly cooling processes of Cu. The atomic transport property, namely the self-diffusion coefficient, is computed in the liquid state, and the results near the melting point of Cu are in good agreement with experimental data and other computational values. The atom diffusion movements during the long period of relaxation have been also studied around the solidification temperature Tc. To describe the complex microstructural evolutions during the rapidly cooling processes and the long relaxation processes, the pair correlation function and the pair analysis technique are used. It is demonstrated that the crystallization of amorphous Cu is caused by the atomic diffusion.     

Molecular dynamics simulation of copper nano-cluster melting on the graphite substrate

The melting processes of different-sized copper nano-clusters supported on graphite (0001) plane are investigated by the molecular dynamics method. In this work, the melting point is predicted through the caloric curve. The simulation results show that the melting point of the supported copper nano-cluster is higher than that of the isolated one with the same Cu atoms. In the heating process, the copper nano-particle will adhere to the (0001) face of graphite with its (111) face. Pair analysis results show that the copper atoms close to the graphite can keep with order arrangement even when the temperature is higher than the melt point of the isolated nano-cluster.     

金属Ni熔化前后结构变化的分子动力学模拟

使用Tight-binding势函数, 对FCC-Ni升温熔化过程的结构变化进行了分子动力学模拟. 在定压条件下模拟得到的Ni的熔点在1850 K与1900 K之间. 计算得到了体系在各温度下的径向分布函数和配位数分布等静态结构信息以及动力学性质. 计算得出的液体Ni的扩散系数在1900 K时约为5.02×10−9 m2•s−1, 与实验数据相符. 对液态体系中FCC短程有序结构可能发生的畸变以及由此导致的H-A键型变化进行了分析, 结合配位体构型搜索和键对分析方法计算了各温度下不同短程有序结构的分布. 计算表明, Ni在熔化之后仍保留有部分晶态短程结构, 但发生了较大的畸变, 同时液态中有少量的缺陷二十面体结构存在. 而液体Ni中大多数的配位体的几何构型介于FCC与缺陷二十面体之间.