Fabrication of Siloxane Hybrid Material With High Adhesion and High Refractive Index for Light Emitting Diodes (LEDs) Encapsulation

A novel inorganic-organic siloxane hybrid material with self-adhesion ability and high refractive index for high-power light emitting diodes (LEDs) encapsulation is introduced. Under the catalysis of an anion exchange resin, the hybrid material was synthesized by a sol-gel condensation process from methacryloxy propyl trimethoxyl silane (MPTS), γ-(2, 3-epoxypropoxy)propytrimethoxysilane (EPTS) and diphenylsilanediol (DPSD). This hybrid material was characterized by Fourier-transform infrared spectroscopy and ¹H-NMR. The resin-type encapsulation material was then prepared by hydrosilylation of the newly synthesized inorganic-organic siloxane hybrid material and methylphenyl hydrogen-containing silicone resin. The cured silicone resin-type encapsulation material can be used as a LEDs encapsulant, owing to high refractive index (n = 1.544), high transparency, appropriate hardness, and excellent thermal stability, as well as good adhesive strength between the encapsulating material and the substrate of LED lead frame.     

High refractive index adamantane‐based silicone resins for the encapsulation of light‐emitting diodes

The encapsulation of high power light emitting diode (LED) needs the silicone resins to have relative high refractive index and thermal‐aging properties. Herein, high refractive index adamantane‐based phenyl epoxy‐silicone (APES) resins for LED encapsulation were synthesized by the sol‐gel condensation of 1‐adamantane methanol propyltrimethoxysilane‐3‐urethane, γ‐(2,3‐epoxypropoxy)propytrimethoxysilane and diphenylsilanediol. These adamantane‐based silicone resins have multifunctional groups including adamantyl group, phenyl group, and epoxy group in order to meet the various requirements for LED encapsulation. Importantly, the adamantane group in the silicone resins benefits for high refractive index and anti‐thermal properties. These APES resins were characterized by proton nuclear magnetic resonance and Fourier transform infrared spectroscopy. When APES resins were cured by methylhexahydrophthalic anhydride, they showed relatively high refractive index of 1.56, high hardness, and high thermal resistance. The encapsulated LED demonstrated high adhesion properties by red‐ink tests. These merits make adamantane‐based silicone resins promising candidates as LED encapsulation materials.     

Preparation of ZrO2/silicone hybrid materials for LED encapsulation via in situ sol‐gel reaction

Organic silicones have been used as encapsulant materials for light‐emitting diodes (LEDs) for many years, while their performances need to be improved in order to satisfy the requirements of high‐power LEDs. A ZrO₂/silicone hybrid resin (ZHR) was synthesized for LEDs encapsulation by in situ sol‐gel reactions. The oligosiloxane was synthesized as polymeric matrix by nonaqueous sol‐gel condensation using diphenylsilanediol (DPSD), vinyltrimethoxysilane (VTMS), and 3‐methacryloxy propyl trimethoxysilane (MPTMS) as monomers. Then zirconium propoxide was added into this polymeric matrix to be hydrolyzed to obtain the hybrid resin with a uniform dispersion of ZrO₂ nanoparticles. The Si–O–Zr covalent bond was detected and benefited for excellent dispersibility of the ZrO₂ nanoparticles and the well compatibility between organic and inorganic phases. The cured ZHR with 5 wt% ZrO₂ content showed high light transmittance (greater than 80% in visible light range), high refractive index (=1.56), and high thermal stability (no yellowing at 150°C for 240 hours). The luminous flux of the LED chip with ZHR encapsulant was 10% higher than that of the pure silicone resin, suggesting that ZHR has great application potential in the field of LED packaging.     

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Addition‐cure silicone resin is considered as a good choice for light emitting diodes (LEDs); however, it has very poor adhesion to the substrate, which limits its practical application. A novel polysiloxane with self‐adhesion ability and higher refractive index for the encapsulating of high‐power LEDs is prepared and characterized. This polysiloxane containing vinyl groups, phenyl groups, and epoxy groups was synthesized by a sol‐gel condensation process from methacryloxy propyl trimethoxyl silane, γ‐(2,3‐epoxypropoxy)propytrimethoxysilane, and diphenylsilanediol under the catalysis of an anion exchange resin. Then, the resin‐type encapsulation material was prepared by hydrosilylation of methylphenyl hydrogen‐containing silicone resin and the newly synthesized polysiloxane material. The novel polysiloxane was characterized by ¹H‐NMR and Fourier transform infrared spectroscopy. On the basis of higher refractive index, higher transparency, excellent thermal stability, and appropriate hardness, as well as good adhesive strength between the encapsulating material and the LED lead frame (polyphthalamide), the curable silicone resin‐type encapsulation material can be used as an encapsulant for LEDs. Copyright © 2014 John Wiley & Sons, Ltd.     

Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.     

功率型LED封装用高分子材料的研究进展

随着发光二极管(LED)亮度和功率的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料,要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。     

Potential of low-temperature post processing of silica gel for high-temperature stable LED encapsulant

In this study, a low-temperature post processing of silica gel for high-temperature stable LED encapsulant was developed. The results indicated that the silica gels prepared by 1st post heat treatment at 300?°C for 5?h and then 2nd post processing at 80?°C for 50?h can have similar low weight loss and high transmittance as the silica gels were processed at 800?°C for 5?h. The result of such low processing temperature implies it may be possible to encapsulate inorganic gel on LED as the convenient potting method is being used in silicone encapsulation technology. However, the processing time can be greatly reduced if vacuum oven is used. Further surface impermeability improvement is also possible by additional local surface heat treatment. The advantages of adopting silica encapsulant in LED modules include higher thermal stability and better optical performance consistency in lumen, color temperature, etc. in new applications.     

一种高折光率发光二极管封装硅树脂的研制

将甲基苯基二氯硅烷(MePhSiCl₂)与二甲基二氯硅烷(Me₂SiCl₂)、 甲基乙烯基二氯硅烷(MeViSiCl₂)和苯基三氯硅烷(PhSiCl₃)等共水解后, 在KOH催化下共缩聚, 以三甲基氯硅烷(Me₃SiCl)为封端剂, 制备了含有甲基苯基硅氧链节的甲基苯基乙烯基硅树脂, 并利用FTIR, ¹H NMR和热重分析(TGA)对产物进行了表征. 将所得甲基苯基乙烯基硅树脂与甲基苯基含氢硅油按一定配比, 在铂络合物催化下硫化成型, 制成发光二极管(LED)封装A/B胶, 用于LED封装. 所得LED封装硅树脂固化后在可见光范围内具有非常高的透光率. 对LED的封装结构进行优化, 获得的LED具有高光效、 高光通量、 窄显色指数和高色温一致性等优点, 可满足功率型LED封装要求.     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Thermo-mechanical Properties of In-situ Silica Filled Silicone Resins

Silicone resins were investigated as a replacement of silica filled organic polymers for microelectronic packaging. Self-curable silicone resins containing up to 40 mol% of in-situ generated silica-like species were prepared by a novel process involving controlled hydrolysis-condensation of SiH moieties without gelation. These in-situ Q filled resins are stable and easy to process compared to post-filled organic polymers. The thermo-mechanical properties upon self-addition and condensation cure of the in-situ filled silicone resins are superior to conventional addition and condensation cured silicone resins and are in the range of organic polymers with the added advantage of high thermal and moisture resistance critical in microelectronic. Storage modulus and plateau modulus as high as 3.5 GPa with a very low fall in modulus below 5% were demonstrated. Coefficients of thermal expansion were as low as 55 to 65 ppm/K in the application temperature up to 170 °C.     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Synthesis and characterization of siloxane resins derived from silphenylene‐siloxane copolymers bearing benzocyclobutene pendant groups

Two bis(dimethylamimo)silanes with benzocyclobutene (BCB) groups, bis(dimethylamino)methyl(4′‐benzocyclobutenyl)silane ( 2 ) and bis(dimethylamino)methyl [2′‐(4′‐benzocyclobutenyl)vinyl]silane ( 4 ), were synthesized from different synthetic routes, which were then employed to prepare two novel silphenylene‐siloxane copolymers (SiBu and SiViBu) bearing latent reactive BCB groups by polycondensation procedure with 1,4‐bis(hydroxydimethylsilyl)benzene. At elevated temperatures these copolymers were readily converted to highly crosslinked films and molding disks with network structures by polymer chain crosslinking, which followed the first‐order kinetic reaction model. The final resins of SiBu and SiViBu demonstrated excellent thermal stability with high glass transition temperatures (218 and 256 °C) and high temperatures at 5% weight loss (553 and 526 °C in N₂, 530 and 508 °C in air). After aging at 300 °C in air for 100 h, the cured resins showed weight loss lower than 4%. The films of cured SiBu and SiViBu also exhibited relatively low dielectric constants of 2.66 and 2.64, low dissipation factors of 2.23 and 2.12 × 10^?3, low water absorptions (≤0.28%), and high transparence in the visible region with cutoff wavelengths of 321 and 314 nm. Moreover, the aged films exhibited good dielectric properties and low water absorptions. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7868–7881, 2008     

Bismaleimides chain-extended by imidized benzophenone tetracarboxylic dianhydride and their polymerization to high temperature matrix resins

Heat-resistant polymers were obtained by thermal polymerization of several bismaleimides or their substituted derivatives. The chain of the polymer precursors was extended by incorporation of imidized benzophenone tetracarboxylic dianhydride between the maleimide rings in order to impart a degree of flexibility in the polymers. The bismaleimides and their corresponding tetraamic acids were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. The differential thermal analysis (DTA) thermograms of the monomers showed exotherms at 200–340°C attributed to the thermally induced polymerization reactions. The influence of different substituents in the maleic double bond on the curing temperature was investigated. The thermal stability of the cured resins was evaluated by thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). They were stable up to 367–433°C both in nitrogen and air atmosphere and afforded 57–68% char yield at 800°C under anaerobic conditions. The structure of the aromatic and aliphatic diamines utilized for imidization was correlated with the thermal stability of the cured resins. The bismaleimide derived from p-phenylenediamine gave the most heat-resistant resin because of its higher rigidity.     

Synthesis of methacrylic copolymers with nona‐1‐butoxy trititanosiloxane as side groups and its application as a thermosetting resin

Methacrylic copolymers with a hydroxyl group on one end of the main chain and nona‐1‐butoxytrititanosiloxane as side groups (called methacrylic hybrid copolymers) were synthesized for use as baked‐finish‐type coating resins. The chemical structures of the side groups in the methacrylic hybrid copolymers were confirmed with the ash weight of the copolymers after combustion, the elemental ratio analysis of Si and Ti in the ash determined by inductively coupled plasma emission spectrometry, and the characteristic absorption band determined by Fourier transform infrared spectrophotometry. The methacrylic hybrid copolymers were cured at temperatures less than 150 °C in the absence of a curing accelerator. The cured copolymers exhibited a high thermal stability. The curing temperature of the copolymers was determined by the change in the absorption peak strength (peak area) of the 1655 cm⁻¹ band in the IR difference spectrum. The thermal stability of the copolymers was evaluated as the thermal‐degradation temperature measured by thermogravimetric analysis. The methacrylic hybrid copolymers were then be used as effective curing resins. The mixture, consisting of thermoplastic methacrylic terpolymer with hydroxyl and carboxyl groups and the methacrylic hybrid copolymers, were cured at less than 150 °C in the absence of a curing accelerator and exhibited a higher thermal‐degradation temperature than the copolymers. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 1090–1098, 2001     

High flow addition curing polyimides

A new series of high flow PMR-type addition curing polyimides was developed, which employed the substitution of 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (BTDB) for p-phenylenediamine (p-PDA) in a PMR-II formulation. These thermoset polyimides, designated as 12F resins, were prepared from BTDB and the dimethyl ester of 4,4′-(hexafluoroisopropylidene)-diphthalic acid (HFDE) with either nadic ester (NE) or p-aminostyrene (PAS) as the endcaps for addition curing. The 12F prepolymers displayed lower melting temperatures in DSC analysis, and higher melt flow in rheological studies than the corresponding PMR-II polyimides. Long-term isothermal aging studies showed that BTDB-based 12F resins exhibited comparable thermo-oxidative stability to p-PDA based PMR-II polyimides. The noncoplanar 2- and 2′-disubstituted biphenyldiamine (BTDB) not only lowered the melt viscosities of 12F prepolymers, but also retained reasonable thermal stability of the cured resins. The 12F polyimide resin with p-aminostyrene endcaps showed the best promise for long-term, high-temperature application at 343°C (650°F). © 1994 John Wiley & Sons, Inc.     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Preparation and Characterization of High‐Temperature Non‐Flowing Diurea/Paraffin/Oil Composites as Form‐Stable Phase Change Materials

A series of form‐stable phase change materials (FSPCMs ) comprising paraffin as the latent heat storage material, diurea as the supporting material and base oil as the performance improvement agent were prepared. The diurea was synthesized in the system of paraffin/oil directly. A series of characterization was carried out for a deep understanding of shape stability and material properties of diurea‐FSPCMs . The results showed that paraffin and base oil were packaged in the three‐dimensional supra‐molecular structures network which was formed by diurea. The dropping point of the prepared FSPCMs could reach 256 °C and the oil separation rate was as low as 1.19% at 100 °C for 30 h. The results of thermal properties tests showed that the prepared FSPCMs exhibited excellent thermal stability and the FSPCMs remained solid‐like state in the temperature range from 25 to 200 °C. This study proposes a novel method to prepare high‐temperature non‐flowing FSPCMs composites and methods to detect the thermal stability and shape stability of FSPCMs , which is helpful in understanding the shape stability mechanism and broadening the potential application of FSPCMs .     

Synthesis and characterization of thiocarbonohydrazone-based epoxy resins

Novel epoxy resins of various thiocarbonohydrazones have been synthesized by reacting the aldehyde or ketone derivatives of thiocarbohydrazide with excess of epichlorohydrin. The resins have been characterized by elemental analyses, epoxy equivalents, ¹H-NMR and IR spectra, thermal analyses, and viscosity measurements. Curing of the resins has been carried out by mixing with thiocarbohydrazide or ethylenediamine and heating at 80°C for 48 h. A comparison of the thermal stability of the cured resin samples has been made.