1,2-双(四甲基环戊二烯基)四甲基二硅烷与六碳基钼的反应

1,2-双(四甲基环戊二烯基)四甲基二硅烷与正丁基锂作用生成(四甲基二硅撑)双(四甲基环戊二烯基负离子盐),后者随即与六碳基钼反应形成1,1'-(四甲基二硅撑)双(四甲基环戊二烯基铝负离子盐)-(Me₂SiSiMe₂)[Me₄CpMo(CO)₃-Li⁺]₂(I),I与冰醋酸作用,随即分别与CCl₄,NBS及I₂反应,生成相应的铝卤化合物(Me₂SiSiMe₂)[Me₄CpMo(CO)₃X]₂[X=Cl(1),Br(2),I(3)].I与CH₃I反应,在钼原子上发生烃基化,得到产物(Me₂SiSiMe₂)[Me₄CpMo(CO)₃Me]₂(4);I与单质I₂直接反应,生成脱硅桥产物Me₄Cp(CO)>₃I(5).经元素分析、IR及¹HNMR表征了化合物1-5的结构。     

柄型茂金属化合物(Ⅲ)──四甲基二硅桥连二(1-茚基和四氢茚基)钛和锆化合物的合成及催化乙烯聚合

1,2二(1茚基)四甲基二硅烷相继与丁基锂及MCl₄·2THF作用,生成四甲基二硅桥连二(1茚基)钛和锆化合物(Me₂SiSiMe₂)[Ind]₂MCl₂[M=Ti(1),Zr(2)].对其进行催化氢化,得到相应的四氢茚基化合物(Me₂SiSiMe₂)[IndH₄]₂MCl₂[M=Ti(3),Zr(4)].通过元素分析、MS和1HNMR谱表征了化合物的分子结构,并研究了在MAO(MethylAluminoxane)的助催化下,化合物3和4对乙烯聚合的催化性能.同锆化合物4相比,钛化合物3活性较低,但得到聚乙烯的分子量却相当高.催化剂的活性和聚乙烯的分子量都具有明显的温度效应.     

四甲基二硅桥连二(1-苯基环己基环戊二烯基)四羰基二铁的合成、结构及热重排反应研究

1,2-二(1-苯基环己基环戊二烯基)四甲基二硅烷与Fe(CO)₅在二甲苯中加热回流生成二铁化合物(Me₂SiSiMe₂)[(1-Ph-c-C₆H₁₀C₅H₃)Fe(CO)]₂(μ-CO)₂(2).通过柱层析分离到化合物2的顺反异构体2c和2t,并分别进行热重排反应,发现顺式底物2c重排生成反式重排产物[Me₂Si(c-C₆H₁₀PhC₅H₃)Fe(CO)₂]₂(3t),而反式底物2t重排则生成顺式重排产物3c.这表明重排反应是立体专一性的.通过X射线衍射分析测定了化合物2c和3t的晶体结构.     

第ⅢA族金属叠氮多聚体结构和性质的理论研究

在DFT-B3LYP/SDD水平上计算研究了第A族金属叠氮多聚体(Me₂MN₃)_n(n=1～3,M=Ga,Al)的结构和性质.多聚体(Me₂MN₃)₂,3的各优化构型均为环状,通过一子体系叠氮基的α-N和另一子体系的金属Ga或Al相连.二聚体(Me₂MN₃)₂中含M2N2平面四元环结构,三聚体(Me₂MN₃)₃具有结合能相近的扭船式和椅式两种构象,均含M₃N₃六元环结构.与单体相比,多聚体的几何参数变化较大.报道了它们在不同温度下的热力学性质,发现叠氮二甲基镓和铝体系以二聚体形式存在.     

铑催化吲哚与乙烯基三乙氧基硅烷的C—H烯基化反应

研究了铑催化N-嘧啶吲哚与乙烯基三乙氧基硅烷的C—H烯基化反应. 在以二氯（五甲基环戊二烯基）合铑(Ⅲ)二聚体{[RhCp*Cl₂]₂(Cp*: 五甲基环戊二烯基)}为催化剂, Cu(OAc)₂为氧化剂, AgF为添加剂, 1,2-二氯乙烷为溶剂及反应温度为90 ℃条件下, 以42%~88%的收率得到末端吲哚乙烯衍生物. 动力学同位素效应实验结果为K_H/K_D=5.7∶1, 表明C—H键断裂可能是反应过程中的决速步骤. 竞争性实验结果表明, 含有供电子取代基的底物比吸电子取代基的底物反应活性高, 反应可能经历亲电性C—H键活化过程. 推测了可能的反应机理, 主要包括配位、 C—H键活化、 转金属化、 还原消除和氧化等步骤. 将此方法应用于一种δ-咔啉衍生物的制备.     

碳锗双桥连二环戊二烯与羰基铁的反应

碳锗双桥连二环戊二烯(Me₂C)(Me₂Ge)(C₅H₄)₂(1)与五羰基铁在回流甲苯及二甲苯中的反应,得到正常的Fe-Fe键化合物(Me₂C)(Me₂Ge)[(η⁵-C₅H₃)Fe(CO)]₂(μ-CO)₂(3)和脱锗桥产物(Me₂C)[(η⁵-C₅H₄)Fe(CO)]₂(μ-CO)₂(4)以及一个结构新颖的化合物(Me₂C)[(η⁵-C₅H₃)[(Me₂Ge)Fe(CO)₂](η¹,η⁵-C₅H₃)[Fe(CO)₂](2).用X射线衍射分析測定了化合物3的晶体结构,并提出了可能的生成机理.     

联苯基桥连双核茂锆化合物的合成及催化乙烯聚合

4,4′-二溴联苯与n-BuLi反应得到对-联苯基二锂,再与四甲基环戊烯酮进行羰基加成,酸催化脱水,一步得到对-联苯基桥连四甲基环戊二烯配体4-(C₅Me₄H)C₆H₄-C₆H₄(C₅Me₄H)-4(1).配体1相继与n-BuLi和ZrCl₄反应得到相应的联苯基桥连双(单茂三氯化锆)4-(C₅Me₄ZrCl₃)C₆H₄-C₆H₄(C₅Me₄ZrCl₃)-4,不经分离直接与环戊二烯基锂或茚基锂反应得到相应的双核锆化合物4-(C₅MeZrCl₂Cp′)C₆H₄-C₆H₄·(C₅Me₄ZrCl₂Cp′)-4[Cp′=C₅H₅(2),C₉H₇(3)].研究了在MAO(MethylAluminoxane)助催化下,化合物2和3对乙烯聚合的催化性能.化合物2和3都显示了非常高的催化活性,并在较高的温度下达到最高活性.     

硅桥连双(三甲硅基环戊二烯基)钛化合物的合成及脱硅基反应

硅桥连双(三甲硅基环戊二烯基)双锂盐与TiCl₄·2THF反应,生成相应的钛化合物[E(C₅H₃SiMe₃)₂]TiCl₂[E=Me₂SiSiMe₂(3),Me₂SiOSiMe₂(5)],同时还分离到了脱一个三甲硅基的产物[E(C₅H₄)(C₅H₃SiMe₃)]TiCl₂[E=Me₂SiSiMe₂(4),Me₂SiOSiMe₂(6)].其中四甲基二硅氧桥连配体更容易发生这种脱硅基反应.通过元素分析、MS和¹HNMR谱表征了化合物3-6的分子结构.     

过渡金属钌、铑配合物在室温离子液体中催化硅氢加成反应的研究

研究了在室温离子液体以及室温离子液体/有机溶剂复合介质体系中, Rh(PPh₃)₃Cl, Ru(PPh₃)₃Cl₂等催化烯烃与三乙氧基硅烷的硅氢加成反应. 实验结果表明, 在乙二醇二甲醚/离子液体1-丁基-3-甲基咪唑六氟磷酸盐(BMImBF₆) (V/V＝1/4)介质中, 于90 ℃下, 己烯与三乙氧基硅烷反应的转化率为100%, β加成物的选择性可达89.0%. 而用Rh(PPh₃)₃Cl作为反应的催化剂, 在纯离子液体BMImPF₆中, 就可以高效催化烯烃与三乙氧基氢硅烷的加成反应. 过渡金属Rh(PPh₃)₃Cl, Ru(PPh₃)₃Cl₂催化剂/离子液体BMImPF₆催化体系, 不仅解决了产物与催化剂分离困难这一难题, 同时, 离子液体BMImPF₆的存在提高了过渡金属Rh(PPh₃)₃Cl, Ru(PPh₃)₃Cl₂催化硅氢加成反应的活性, 特别是β加成物的选择性. 反应结束后, 催化剂/离子液体与产物易于分离, 并且可以重复使用.     

双异丙烯基二茂金属(Sn,Ti)的合成

虽然,廿多年来各同学者对二茂铁衍生物进行了深入的研究,但却极少报道合成二茂锡衍生物,仅见1959年Wilkinson等合成双甲熬二茂锡以及Cowley等合成(Me₃SiC₅H₄)₂Sn和[(i-Pr₂N)₂PC₅H₄]₂sn,二茂钛衍生物的报道较多,但除Rausch等报道过合成低产率的乙烯基二氯二茂钛(Ⅳ)外,几乎没有报道过类似的烯烃二茂钛(Ⅳ)的合成。     

Fabrication of Siloxane Hybrid Material With High Adhesion and High Refractive Index for Light Emitting Diodes (LEDs) Encapsulation

A novel inorganic-organic siloxane hybrid material with self-adhesion ability and high refractive index for high-power light emitting diodes (LEDs) encapsulation is introduced. Under the catalysis of an anion exchange resin, the hybrid material was synthesized by a sol-gel condensation process from methacryloxy propyl trimethoxyl silane (MPTS), γ-(2, 3-epoxypropoxy)propytrimethoxysilane (EPTS) and diphenylsilanediol (DPSD). This hybrid material was characterized by Fourier-transform infrared spectroscopy and ¹H-NMR. The resin-type encapsulation material was then prepared by hydrosilylation of the newly synthesized inorganic-organic siloxane hybrid material and methylphenyl hydrogen-containing silicone resin. The cured silicone resin-type encapsulation material can be used as a LEDs encapsulant, owing to high refractive index (n = 1.544), high transparency, appropriate hardness, and excellent thermal stability, as well as good adhesive strength between the encapsulating material and the substrate of LED lead frame.     

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Addition‐cure silicone resin is considered as a good choice for light emitting diodes (LEDs); however, it has very poor adhesion to the substrate, which limits its practical application. A novel polysiloxane with self‐adhesion ability and higher refractive index for the encapsulating of high‐power LEDs is prepared and characterized. This polysiloxane containing vinyl groups, phenyl groups, and epoxy groups was synthesized by a sol‐gel condensation process from methacryloxy propyl trimethoxyl silane, γ‐(2,3‐epoxypropoxy)propytrimethoxysilane, and diphenylsilanediol under the catalysis of an anion exchange resin. Then, the resin‐type encapsulation material was prepared by hydrosilylation of methylphenyl hydrogen‐containing silicone resin and the newly synthesized polysiloxane material. The novel polysiloxane was characterized by ¹H‐NMR and Fourier transform infrared spectroscopy. On the basis of higher refractive index, higher transparency, excellent thermal stability, and appropriate hardness, as well as good adhesive strength between the encapsulating material and the LED lead frame (polyphthalamide), the curable silicone resin‐type encapsulation material can be used as an encapsulant for LEDs. Copyright © 2014 John Wiley & Sons, Ltd.     

Performance of methylphenyl hydrogen-containing silicone oils for LED encapsulation

Three-dimensional light-emitting diodes (LEDs) are the preferred light source for bulb lamps due to their 360° illumination. Addition curing silicone resins have usually been used to encapsulate LEDs. LED-filament encapsulation needs silicone resins having high thermal performance and thixotropy. Herein, a low refractive index and highly anti-thermal aging silicone oil was synthesized by hydrolysis and co-condensation method, and used to prepare an encapsulation material for high-power LED-filament. The cured silicone materials were characterized by thermogravimetric analysis (TGA) and thermal aging test under 180°C and 250°C. The results demonstrated that the thermal stability of the cured silicone resins with short-chain phenyl silicone as a crosslinker was higher than that with long-chain methyl silicone oil crosslinker. Owing to the excellent thermal stability, appropriate hardness, high transparency and photoelectric efficiency, this LED encapsulation material is a promising candidate for high-power LED package.     

High refractive index adamantane‐based silicone resins for the encapsulation of light‐emitting diodes

The encapsulation of high power light emitting diode (LED) needs the silicone resins to have relative high refractive index and thermal‐aging properties. Herein, high refractive index adamantane‐based phenyl epoxy‐silicone (APES) resins for LED encapsulation were synthesized by the sol‐gel condensation of 1‐adamantane methanol propyltrimethoxysilane‐3‐urethane, γ‐(2,3‐epoxypropoxy)propytrimethoxysilane and diphenylsilanediol. These adamantane‐based silicone resins have multifunctional groups including adamantyl group, phenyl group, and epoxy group in order to meet the various requirements for LED encapsulation. Importantly, the adamantane group in the silicone resins benefits for high refractive index and anti‐thermal properties. These APES resins were characterized by proton nuclear magnetic resonance and Fourier transform infrared spectroscopy. When APES resins were cured by methylhexahydrophthalic anhydride, they showed relatively high refractive index of 1.56, high hardness, and high thermal resistance. The encapsulated LED demonstrated high adhesion properties by red‐ink tests. These merits make adamantane‐based silicone resins promising candidates as LED encapsulation materials.     

功率型LED封装用高分子材料的研究进展

随着发光二极管(LED)亮度和功率的不断提高,封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料,要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。     

Preparation of ZrO2/silicone hybrid materials for LED encapsulation via in situ sol‐gel reaction

Organic silicones have been used as encapsulant materials for light‐emitting diodes (LEDs) for many years, while their performances need to be improved in order to satisfy the requirements of high‐power LEDs. A ZrO₂/silicone hybrid resin (ZHR) was synthesized for LEDs encapsulation by in situ sol‐gel reactions. The oligosiloxane was synthesized as polymeric matrix by nonaqueous sol‐gel condensation using diphenylsilanediol (DPSD), vinyltrimethoxysilane (VTMS), and 3‐methacryloxy propyl trimethoxysilane (MPTMS) as monomers. Then zirconium propoxide was added into this polymeric matrix to be hydrolyzed to obtain the hybrid resin with a uniform dispersion of ZrO₂ nanoparticles. The Si–O–Zr covalent bond was detected and benefited for excellent dispersibility of the ZrO₂ nanoparticles and the well compatibility between organic and inorganic phases. The cured ZHR with 5 wt% ZrO₂ content showed high light transmittance (greater than 80% in visible light range), high refractive index (=1.56), and high thermal stability (no yellowing at 150°C for 240 hours). The luminous flux of the LED chip with ZHR encapsulant was 10% higher than that of the pure silicone resin, suggesting that ZHR has great application potential in the field of LED packaging.     

Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.     

含磷有机硅杂化环氧树脂固化体系性能研究

通过磷酸与γ-环氧丙氧基三甲氧基硅烷反应得到含磷有机硅氧烷,并加入到环氧树脂/4,4'-二氨基二苯基甲烷体系中混合,通过溶胶-凝胶的方法制备了含磷有机硅杂化环氧树脂固化物.对固化体系进行了玻璃化转变温度、热失重、阻燃、拉伸强度、冲击强度测试分析.结果表明,该固化体系的阻燃性得到提高,极限氧指数在25.8～29.3,玻璃化转变温度得到提高,在161～179℃;虽然初始分解温度比纯环氧树脂固化物低,但800℃残炭率可以达到26.5%,提高了36%;拉伸强度得到提高,在71～94 MPa,冲击强度可以达到14.36 kJ/m2,提高了14%.该固化体系具有较好的阻燃性能和热性能,同时具有较好的力学性能.     

Oligo-fluoropolymer Modified Cycloaliphatic Epoxy Resins with Excellent Compatibility,Waterproof and Mechanical Properties for LED Encapsulation

An oligo-fluoropolymer(PFM) with functional cycloaliphatic epoxy and fluorinated groups was obtained via free radical polymerization and applied to the modification of cycloaliphatic epoxy resins(CE). The chemical structure of PFM was characterized by Fourier transform infrared(FTIR) spectroscopy, gel permeation chromatography(GPC) and nuclear magnetic resonance(NMR) spectroscopy, and the effects of different PFM concentrations(0.5%—6%, mass fraction) on the thermal resistance, mechanical properties, surface dewettability, light transmission, refractive index and various cured polymer properties were studied in detail. The DSC and TGA results demonstrate that the modified epoxy resins possess a higher thermal resistance than the neat epoxy resin. The improvements in the surface dewettability and water resistance are caused by the high crosslinking density and the enrichment of the oligo-fluorinated random copolymers dispersed in the matrix. The fracture surface morphologies of the thermosets were investigated by scanning electron microscopy(SEM) and transmission electron microscopy(TEM). It was observed that the optical transmittance of the composites was maintained even though microphase separation occurred during the curing process. With respect to the corresponding properties of the neat epoxy resins, the 2 phr(parts per hundreds of resin) PFM thermoset exhibited relatively better comprehensive properties, making the cured material a good candidate for light-emitting diode(LED) encapsulation.     

THE EFFECT OF THE ACID CATALYST ON THE PREPARATION OF MQ SILICONE RESINS

MQ silicone resins were prepared through hydrolytic condensation of ethyl polysilicate ortetraethoxysilane and hexamethyl disiloxane. The unit ratio of the MQ resins was determined by ~(29)Si-NMR.The relationship of the unit ratio of the product resins with that in the feed was studied. When the reactionwas catalyzed by aqueous hydrochloric acid, and the unit ratio of M to Q in the feed was more than 1, the unitratio of the product was usually lower than that of the feed. The MQ silicon with an unit ratio of M/Q>2could not be obtained. However, if the reaction was catalyzed by concentrated sulfuric acid and the reversehydrolysis process was employed, MQ silicone resin with very high M/Q ratio was successfully prepared.