6H-SiC衬底片的表面处理

相比于蓝宝石,6H-SiC是制作GaN高功率器件更有前途的衬底.本文研究了表面处理如研磨、化学机械抛光对6H-SiC衬底表面特性的影响.用显微镜、原子力显微镜、拉曼光谱、卢瑟福背散射谱表征了衬底表面.结果表明经过两步化学机械抛光后提高了表面质量.经第二步化学机械抛光后的衬底具有优异的表面形貌、高透射率和极小的损伤层,其表面粗糙度RMS是0.12nm.在该衬底上用MOCVD方法长出了高质量的GaN外延膜.     

蓝宝石衬底的化学机械抛光技术的研究

介绍了蓝宝石衬底的化学机械抛光工艺,概述了化学机械抛光原理和设备,讨论分析了影响蓝宝石衬底化学机械抛光的因素,阐述了CMP的主要发展趋势:能定量确定最佳CMP工艺,系统地研究CMP工艺过程参数,建立完善的CMP理论模型,满足不同的工艺要求和应用领域,有效降低成本,提高产量.     

高温超导薄膜衬底材料LaAlO3单晶的超光滑表面抛光研究

本文以化学机械抛光为手段,以原子力显微镜(AFM)为工具,对高温超导薄膜衬底材料LaAlO3单晶的超光滑表面抛光进行研究.既观察到了由传统光学表面向超光滑表面过渡的过程,又观察到了超光滑表面加工的结果-表面的本征化.显示了超光滑表面抛光对外延衬底表面的重要性.     

化学抛光和退火对钛酸锶基片表面改性研究

本文运用原子力显微镜检测传统机械抛光和化学机械抛光以及退火前后的钛酸锶(STO)衬底表面,研究了化学机械抛光和退火对钛酸锶(STO)基片表面形貌的影响,结果表明化学抛光可以使表面粗糙度达到0.214 nm,明显优于机械抛光.对比测量退火前后钛酸锶(STO)基片的双晶摇摆曲线,表明退火可以明显改善晶体质量,有利于实现超光滑STO基片的加工.     

4H-SiC的强氧化液化学机械抛光

研究了一种新型的化学机械抛光方法,使用以KMnO4作为氧化剂的强氧化性化学机械抛光液(SOAS)进行化学机械抛光.研究了在4H-SiC硅面和碳面的化学机械抛光过程中,SOAS溶液中KMnO4的浓度对抛光质量的影响.使用原子力显微镜(AFM)和精密电子天平,分别测试了表面粗糙度和去除率.结果表明,适量的KMnO4可以大幅度提高4H-SiC的化学机械抛光去除率,同时可提高4H-SiC衬底的表面抛光质量.     

无位错Te-GaSb(100)单晶抛光衬底的晶格完整性

采用液封直拉(LEC)法批量生长的直径2英寸(1英寸=2.54 cm)n型Te-GaSb(100)单晶的位错腐蚀坑密度(EPD)通常低于300 cm^-2,达到无位错水平。本文利用X射线摇摆曲线以及倒易空间图(RSM)对这种GaSb单晶抛光衬底的晶格完整性和亚表面损伤情况进行了分析表征,结果表明经过工艺条件优化的化学机械抛光处理,GaSb单晶衬底表面达到原子级光滑,不存在亚表面损伤层。利用分子束外延在这种衬底上可稳定生长出高质量的Ⅱ类超晶格外延材料并呈现出优异的红外探测性能。在此基础上,对CaSb衬底材料的物性、生长制备和衬底加工条件之间的内在关系进行了综合分析。     

不同磨料对蓝宝石晶片化学机械抛光的影响研究

本文制备了几种含不同磨料(SiC、Al2O3不同粒径SiO2)的抛光液,通过纳米粒度仪分析磨料粒径分布,采用原子力显微镜观察磨料的粒径大小.研究了不同磨料对蓝宝石晶片化学机械抛光(CMP)的影响,利用原子力显微镜检测抛光前后蓝宝石晶片表面粗糙度.实验结果表明,在相同的条件下,采用SiC、Al2O3作为磨料时,材料去除速率与表面粗糙度均不理想;而采用含1;粒径为110 nm SiO2的抛光液,材料的去除速率最高为41.6 nm/min,表面粗糙度Ra=2.3 nm;采用含1;粒径为80 nm SiO2的抛光液,材料的去除速率为36.5 nm/min,表面粗糙度最低Ra=1.2 nm.     

阳离子表面活性剂对A向蓝宝石晶片化学机械抛光效率的影响

为了探究阳离子表面活性剂对A向(1120)蓝宝石晶片化学机械抛光效率的影响,采用失重法计算蓝宝石的材料去除率(MRR)、原子力显微镜观察抛光后蓝宝石晶片表面粗糙度(Ra).结果表明:纯二氧化硅磨粒抛光液中,蓝宝石晶片的MRR在pH8时最优(MRR=1984/h),此时Ra为0.867 nm;添加一定浓度的阳离子表面活性剂可以提高蓝宝石晶片的抛光效率,其MRR在pH =9时达到最大(MRR=2366 nm/h),此时Ra =0.810 nm.通过粒径和Zeta电位分析,阳离子表面活性剂改变了二氧化硅磨粒表面的Zeta电位值,进而改变了磨粒与磨粒及磨粒与蓝宝石晶片的作用力,且在碱性条件下可以获得较高的MRR.     

c向提拉法生长的四英寸蓝宝石单晶缺陷研究

采用提拉法沿[0001]方向成功生长出了四英寸蓝宝石单晶。X射线摇摆曲线测试结果表明晶体具有较好的晶格完整性。采用化学腐蚀法并借助光学显微镜观察了(0001)面的位错及形貌。研究了腐蚀温度、腐蚀时间、机械抛光和化学抛光对位错密度及形貌的影响。计算得到平均位错密度为6190 cm-2,优于一般提拉法生长的蓝宝石单晶。     

腐蚀法测量研磨蓝宝石亚表面损伤的实验研究

化学腐蚀法是一种简单有效的蓝宝石亚表面损伤深度检测方法.利用高温熔融KOH对蓝宝石工件的化学腐蚀作用,开展W40固结磨料研磨后蓝宝石工件的化学腐蚀实验,设计耐高温陶瓷夹具固定腐蚀液中工件位置,并用称重法测算腐蚀速率和腐蚀厚度,揭示亚表面损伤的形成机理.结果表明:采用陶瓷夹具固定工件可使腐蚀面积的均匀性大大提高,平均腐蚀速率提高9.21;左右.蓝宝石工件的腐蚀速率和腐蚀厚度逐渐减小,最后趋于稳定,其亚表面损伤深度约为8.41 μm.天平称重法可有效提高腐蚀速率和腐蚀厚度的测算精度,为蓝宝石亚表面损伤的有效测量提供帮助.     

Homo-epitaxial GaN growth on exact and misoriented single crystals: suppression of hillock formation

GaN single crystals were used as substrates for MOCVD growth. The ( ) plane of the substrate crystals was polished to obtain off-angle orientations of 0, 2, and 4° towards the [ ] direction. The highest misorientation resulted in a reduction of the hexagonal hillock density by nearly two orders of magnitude as compared with homo-epitaxial films grown on the exact ( ) surface. The features that are still found on the 4° off-angle sample after growth can be explained by a model involving the interaction of steps, introduced by the misorientation, and the hexagonal hillocks during the growth process. Following from this explanation it could be concluded that surface diffusion is found to be not important during growth on the N-side. The material quality of the N-side was examined by photoluminescence (PL) measurements. The PL spectrum measured at 5 K shows dominant donor bound excitons with a FWHM of 1.4 meV as well as free excitonic transitions.     

Influence of surface topography on the multilayer film formation

The relationship between the topography of substrates and multilayer films deposited on these substrates (which are used in ring laser gyroscopes) has been investigated. The surfaces were studied by atomic-force microscopy. The statistical properties of the surface topography are analyzed within the approach based on a comparative analysis of the power spectral density functions of roughness calculated for the substrate and film. The degree of correlation between the substrate nanotopography and multilayer film is determined, and the influence of the substrate roughness on the optical characteristics of the deposited mirrors is established.     

不锈钢衬底的抛光处理对碳纳米管薄膜场发射性能的影响

在抛光的和未抛光的不锈钢衬底上,利用微波等离子体化学气相沉积(MPCVD)方法从甲烷和氢气的混合气体中沉积碳纳米管薄膜,并对其场发射性能进行了研究.实验发现,不锈钢衬底的机械抛光能降低碳纳米管膜的开启场强,增大它的发射电流密度.在同一场强7.5 V/μm下,衬底未抛光样品的电流密度为2.9 mA/cm2,而衬底抛光样品的电流密度达到5.5 mA/cm2.低开启场强和大发射电流密度意味着β增大,说明机械抛光能使碳纳米管膜的β增大.     

Influence of textured c-Si surface morphology on the interfacial properties of heterojunction silicon solar cells

For the HIT solar cells, the properties of interface between intrinsic thin film and c-Si are critical for the resulting device. The interfacial properties mainly depend on the surface passivation quality of c-Si, which is found to be affected by the morphology of textured surfaces. In this study, four kinds of textured c-Si substrates are fabricated: large pyramids without chemical polished (CP), large pyramids with CP, small pyramids without CP and small pyramids with CP. We investigated the effects of textured-surface morphology on the passivation of c-Si, the thin layer coverage and the interfacial properties of heterojunction prepared by HWCVD. Minority carrier lifetime measurements show that the wafer with small pyramids leads to better surface passivation than the one with large pyramids. The good coverage and contact between the thin film and the substrate can be achieved and no epitaxial growth occurs on the wafer with small pyramids through the study of TEM. Dark I-V measurements reveal that the heterojunction on wafer with small pyramids and CP has low recombination at the a-Si:H/c-Si interface. Our results indicate that the surface with small pyramids and low surface roughness is beneficial to the performance of HIT solar cells.     

Analysis of IBAD silicon oxynitride film for anti-reflection coating application

A SOI-based optoelectronic device needs a high-quality anti-reflection coating on both faces of the device to minimize the optical reflectance from the face. In this work amorphous silicon oxynitride films were deposited on silicon substrates by ion beam assisted deposition (IBAD). The main purpose was to use silicon oxynitride film as single layer anti-reflection coating for SOI-based optoelectronic devices. This application is primarily based on the ability to tune the silicon oxynitride optical functions to the values optimal by changing deposition parameters. The chemical information was measured by X-ray photoelectron spectroscopy (XPS). Spectroscopic ellipsometry (SE) was applied to measure the refractive index and thickness. Single-side polished silicon substrate that was coated with silicon oxynitride film exhibited low reflectance. Double-side polished silicon substrate that was coated with silicon oxynitride film exhibited high transmittance. The results suggested silicon oxynitride film was a very attractive single layer anti-reflection coating for SOI-based optoelectronic device.     

基于抛光基材的热蒸镀铜箔生长高平整单层石墨烯薄膜

在石墨烯的化学气相沉积工艺中,铜箔是决定石墨烯薄膜质量的重要因素。传统铜箔由于制备工艺的限制,存在大量的缺陷,导致石墨烯薄膜的成核密度较高。本工作选用抛光铝板、抛光不锈钢板、微晶玻璃和SiO₂/Si作为基材,用热蒸镀法制备了不同粗糙度的铜箔,并详细讨论了以该系列铜箔生长高平整度石墨烯薄膜的条件及铜箔对石墨烯薄膜品质的影响。实验结果表明,铜箔以(111)取向为主,与基材分离后,表面具有纳米级平整度。在生长石墨烯后,从SiO₂/Si剥离的铜箔成核密度是4种基材中最小的。同时,从SiO₂/Si剥离的铜箔晶体结构变化最不明显,具有良好的结晶性,表面几乎不存在铜晶界缺陷。当压强为3 000 Pa,氢气和甲烷流速分别为300 mL/min和0.5 mL/min时,可以获得约1 mm横向尺寸的石墨烯单晶晶畴。     

基底加热温度对ITO薄膜的性能影响研究

氧化铟锡(ITO)薄膜被广泛用作光电器件中的透明导电电极,其透光率、导电性、表面粗糙度、与基底的功函数匹配及其电流传输特性都会对光电器件的性能造成影响。本文采用射频(RF)磁控溅射方法制备ITO薄膜,系统研究了基底加热温度对其各方面性能的影响,并确认了最佳基底温度。实验采用锡掺氧化铟陶瓷为靶材,组分摩尔比为m(In₂O₃)∶m(SnO₂)=90∶10。采用XRD、SEM对所制备的薄膜进行表征,系统分析不同基底温度对ITO薄膜结晶性能、形貌的影响;采用紫外可见分光光度计、霍尔效应测试仪、紫外光电子谱仪(UPS)、电流电压曲线系统研究了基底温度对薄膜光电特性、载流子浓度、薄膜功函数以及电流传输特性的影响。研究结果表明,基底温度200 ℃为最佳,此时ITO薄膜结晶良好、表面平整、可见光波段平均透过率超过80%,导电性能和电流传输特性均较佳,且薄膜组分与靶材组分一致。     

抛光铜箔衬底上石墨烯可控生长的研究

本文报导以固态聚苯乙烯为碳源,经机械抛光和电化学抛光双重处理的铜箔为衬底,用CVID法进行石墨烯可控生长的研究结果.用光学显微镜、原子力显微镜、拉曼光谱、光透射谱、扫描隧道显微镜和场发射扫描电镜对生长的石墨烯进行了表征.研究发现经过抛光处理的铜箔由于其平整的表面和很低的表面粗糙度,在其上生长的石墨烯缺陷少,结晶质量高.而未经抛光处理的铜箔在石墨烯生长过程中,铜箔不平整的表面台阶会破坏其上生长的石墨烯的微观结构,在生长的石墨烯二维结构中产生高密度晶界和缺陷.还在双重抛光处理的铜箔上实现了石墨烯的层数可控生长,结果表明固态碳源聚苯乙烯的量为15 mg时可生长出单层石墨烯,通过控制固态源重量得到了1～5层大面积石墨烯.     

Effects of surface reconstruction on CdTe/GaAs(001) interface structure

CdTe/GaAs(001) heterostructures were fabricated by molecular beam epitaxy on chemically etched and thermally deoxidized GaAs(001) substrates, as well as GaAs(001) (3×1) buffer layers grown in situ by molecular beam epitaxy. Different growth protocols were also explored, leading to Te-induced (6×1) or (2×1) surface reconstructions during the early growth stage. High-resolution cross-sectional transmission electron microscopy was used to examine the final interface structure resulting from the different substrate preparations, and surface reconstructions. The (2×1) surface reconstruction led to pure (001) growth, while the (6×1) reconstruction led to an interface which included small (111)-oriented inclusions. In addition, deposition on etched and deoxidized GaAs(001) wafers led to preferential CdTe growth within etch pits and resulted in a macroscopically rough interface region.