反向流动垂直喷淋式MOCVD反应器设计与数值模拟

本文分析了现有的MOCVD反应器存在的不足,提出了一种新型的反向流动垂直喷淋式反应器:反应气体从基片上方的许多平行小喷管喷入反应区,反应后的尾气又从基片上方出口排出,从而减少了反应物浓度沿衬底径向的不均匀性.通过对反应器进行三维数值模拟,改变喷管的中心距、喷管端与衬底的距离、流量、气体压强等参数,确定了反应室内衬底上方温度场与浓度场为最佳时的参数组合.     

氮化镓生长反应模型与数值模拟研究(Ⅱ)

本文运用提出的MOCVD生长GaN的核心反应模型,耦合化学反应动力学和输运过程,对新型切向喷射式MOCVD反应器,进行了三维数值模拟。得到反应器内部温场、流场、反应产物以及GaN的生长速率的分布。数值模拟得到的生长速率与文献中的实验值较为吻合,验证了模型的可行性。与传统垂直喷射式进行对比,发现优化后的新型反应器对反应源的利用率较高,在一定区域内沉积速率更为均匀。此外,文中还发现新型反应器适应生长预反应强烈的薄膜材料。     

多片式热壁 MOCVD 反应器的设计与数值模拟分析

本文提出一种多反应腔并联的水平热壁 MOCVD 反应器,反应器上下(左右)壁面都采用高温,减少了热泳力的排斥作用,提高了衬底上方的 TMG 浓度.由于取消了传统反应器的冷壁,减少了寄生产物的凝结,提高了反应前体的利用率和 GaN 的生长速率.可以多个反应腔并联生长,从而实现反应器的扩容.针对这种热壁式反应器,结合 GaN 的 MOCVD 生长进行了二维数值模拟,计算了不同流速、高度、长度和压力时反应器内流场、温场、浓度场分布以及生长速率,发现存在一个最佳的气体流速、反应器高度和长度条件,在此条件下,反应前体的产生与沉积达到平衡,从而有效抵消反应前体的沿程损耗,实现均匀的 GaN 生长.     

径向三重流MOCVD反应器生长GaN的数值模拟

采用计算流体力学方法对生长半导体材料GaN的重要设备三重进口行星式MOCVD (金属有机物化学气相沉积) 反应室中的输运过程进行了二维数值模拟.从浓度场的角度分析反应器内衬底上方NH3和TMGa的浓度影响因素.根据对模拟结果的分析,发现较均匀的流场对应衬底上方的反应物浓度较高,降低反应器内压强,也可获得衬底上方较高的反应物浓度,由于MOCVD反应器内有较大的温差,因此热扩散效应不能忽视.     

垂直转盘式MOCVD反应器中GaN化学反应路径的影响研究

对垂直转盘式MOCVD反应器生长GaN的气相化学反应路径进行研究.结合反应动力学模型,分别采用预混合进口但改变反应腔高度,以及采用环形分隔进口,对反应器的温场、流场和浓度场进行CFD数值模拟,由此确定反应器结构参数对化学反应路径的影响.通过观察主要含Ga粒子的浓度分布以及不同反应路径对生长速率的贡献,判断该反应器可能采取何种反应路径.研究发现,RDR反应器的主要反应路径是TMG热解为DMG,DMG为薄膜沉积的主要前体.反应腔高度变化对反应路径影响较小,但生长速率略有增大;当从预混合进口改为环形分隔进口时,生长更倾向于TMG热解路径,同时生长速率增大,但均匀性变差.     

一种多喷淋头式MOCVD反应器的设计与数值模拟

提出了一种多喷淋头式MOCVD反应器.针对新型反应器,对GaN生长的MOCVD过程进行了数值模拟,模拟考虑了热辐射和化学反应,计算了反应器内流场、温场和浓度场,导流(筒)壁面的寄生沉积以及GaN生长速率,并分析了反应室几何因素对生长均匀性的影响.模拟结果显示,衬底表面大部分区域具有均匀的温场和良好的滞止流.通过对浓度场和GaN生长速率的分析,得出MMGa是薄膜生长的主要反应前体.通过对反应器高度H、导流筒与托盘间距h、导流筒半径R等参数的优化,给出了提高薄膜生长速率和均匀性的条件.     

行星式MOCVD反应器进口结构对AlN生长的气相反应和生长速率的影响

针对行星式MOCVD(Metal Organic Chemical Vapor Deposition)反应器进口结构对AlN生长的化学反应路径和生长速率的影响进行数值模拟研究,通过改变反应器进口形式、数量以及隔板位置发现,二重进口反应器倒置进口(即Ⅲ族在下,Ⅴ族在上)时,衬底前端的含Al粒子浓度明显升高,尤其是MMAl的浓度比传统进口反应器高两个数量级,气相反应中热解路径占主导,薄膜生长速率明显提高.在倒置进口的基础上优化隔板位置,生长速率略微降低,但薄膜均匀性明显改善.当反应器进口数量从二重变为三重和五重,反应从热解路径占主导变为热解路径和加合路径共同作用,薄膜生长速率逐渐增加,而均匀性明显改善.     

垂直式MOCVD反应器中热泳力对浓度分布的影响分析

从分子动力学理论出发,推导出垂直式MOCVD反应器中热泳力和热泳速度与温度、温度梯度、压强、粒子直径的关系式,以及热泳速度与扩散速度、动量速度平衡时的关系式.在典型的生长条件下,计算得到在温度T=605K时,热泳速度与扩散速度、动量速度动量平衡,TMGa浓度达到最大.然后在不考虑化学反应和考虑化学反应两种情况下,针对垂直式MOCVD反应器内的热泳力对粒子浓度分布和沉积的影响进行数值模拟,模拟给出反应粒子在反应器不同进口温度、衬底温度时的温度分布、浓度分布和反应速率.并与文献中的实验值进行对比,模拟结果与实验值有很好的吻合.     

径向流动MOCVD输运过程的数值模拟和反应器优化

针对三重进口径向流动行星式MOCVD反应器的输运过程进行二维数值模拟研究,探讨有关行星式反应器流道高度和托盘直径能否继续扩大,如何控制基片上方温场和浓度场为最佳分布这样一些本质问题,同时寻找反应器的优化条件.模拟结果发现:(1)通过对反应器形状进行优化,使进口处流道趋向于流线的形状,可以大大地削弱甚至消除由流道扩张引起的涡旋;(2)在影响对流涡旋的几何参数中,反应腔高度起主要作用,而反应腔直径影响较小.对于优化后的反应器,发生对流涡旋的临界高度提高到2～2.5cm,对应的反应器直径增加到40cm;(3)在相同温差、不同衬底温度的条件下,反应器内的流动形态不同.衬底温度高,对流涡旋较弱;衬底温度低,对流涡旋较强.其原因在于气体的粘滞力随温度升高从而抑制了浮升力的作用;(4)衬底上方均匀的流场对应均匀的温场和较高的反应物浓度,热扩散则使TMGa在衬底处的浓度降低.     

垂直转盘式MOCVD反应器进口温度对GaN生长的影响

针对垂直转盘式MOCVD反应器进口温度对GaN生长的影响进行数值模拟研究,分别考虑预混合进口和分隔进口两种情况.通过对包含主要化学反应路径的气体输运过程的模拟,对比不同进口温度下衬底前沿的反应前体浓度及其对应的生长速率的变化,从而确定进口温度对化学反应路径及生长速率的影响关系.结果表明,两种进口情况下,随着进口温度的升高,生长速率均呈现先增大后减小的趋势.预混合时,进口温度约500 K时生长速率最大;分隔进口时,进口温度约800 K时生长速率最大.这主要是由于,生长速率取决于衬底上方边界层内含Ga粒子的浓度梯度.预混合时,衬底前沿的含Ga粒子主要为MMGa,其浓度随进口温度的变化趋势与生长速率的变化趋势一致.分隔进口时,衬底前沿的含Ga粒子MMGa和DMGaNH2浓度处于同一数量级.随进口温度的升高,前者略有增加,而后者明显增大.当预混合的进口温度超过500 K、分隔进口的进口温度超过800 K时,衬底前沿的MMGa和DMGaNH2的峰值或明显下降、或明显离开衬底,使得含Ga粒子的浓度梯度显著下降,造成生长速率下降.     

The chemistry and transport phenomena of chemical vapor deposition of silicon from SiCl4

The chemical vapor deposition (CVD) of silicon is among the most important synthesis methods in electronic industry. We developed and applied novel methods of characterization to studies of CVD of Si from SiCl₄. In particular, we studied the chemistry of the Si-Cl-H system as well as transport phenomena, such as the momentum, heat, and mass transport in a horizontal CVD reactor. A flow visualization was used to study the flow dynamics, i.e., the momentum transport in the reactor. The heat transport was studied by measuring temperatures at various points in the reactor as a function of flow-rates and susceptor temperatures. A specially designed movable probe was used for a mass spectrometric sampling in the reactor. In these experiments, we were able to determine quantitatively partial pressures of reactants and products at some desired location in the reactor, thus studying the mass transport during the CVD of Si. The conducted studies of transport phenomena were used to establish a model which can be used to predict the efficiency and uniformity of the deposition.     

西门子CVD还原炉内硅棒生长环境的数值模拟

考虑包括热辐射在内的质量传递、动量传递、热量传递三维模型,利用流体力学计算软件,对18对棒西门子多晶硅CVD还原炉实际情况进行数值模拟.考察了两种进气方式下还原炉内的流场和温度场分布.计算结果表明,为了实现硅棒均匀沉积,与底盘上分散进气、中心集中出气的还原炉结构相比,中心集中进气、中环与外环之间分散出气的流场及温度场分布更为合理.后者可能有效避免气体在进出口间的“短路”现象,又使炉内各处温度分布更为均匀,减小硅棒不均匀生长现象.模拟结果还表明,采用典型工况的数据,还原炉中总能量损失占能量输入的78.9;,辐射热损失占总能量损失的70.9;,产品单位质量能耗为72.8 kWh/·kg-1,与很多其他研究结果及实际相一致.     

整体硬质合金铣刀上制备CVD金刚石涂层的系统三维流场研究

本文通过建立整体硬质合金立铣刀上制备CVD金刚石涂层时CVD沉积系统流场的三维模型,研究了进气口分布对该系统流场均匀性的影响,优化了进气口的分布;在仿真的基础上开展了整体硬质合金立铣刀上制备CVD金刚石涂层的验证实验,采用SEM和Raman对制备的CVD金刚石涂层进行了分析测试.结果表明:优化后的流场可以用于制备高质量的CVD金刚石涂层,且批量制备出的在衬底不同位置上的铣刀表面CVD金刚石涂层的质量均匀一致.     

Computational studies of the transient behavior of horizontal MOVPE reactors

Dynamic models of the mass transfer in horizontal reactors used for metalorganic vapor phase epitaxy (MOVPE) of compound semiconductors have been developed and used to study the duration of transients on the substrate during the growth of heterostructures. Dispersion of reactants during gas switching can be detrimental to the abruptness of the interfaces. A solution to this problem is the operation of MOVPE reactors at very high flow rates and low pressures, but this leads to low conversions of the expensive precursors. Our simulations indicate that critical Péclet numbers can be identified, beyond which no significant reduction in the duration of transients on the substrate occurs when increasing the gas velocity. The substrate always reached a new steady state much faster than the entire reactor. Symmetry of filling and purging with respect to transients was also observed. Performance diagrams connecting optimal operating conditions with reactor geometry have been constructed. Time-dependent models of the MOVPE process can help identify optimal operating conditions and reactor shapes leading to abrupt interfaces with maximum precursor utilization.     

Design and operating considerations for a water-cooled close-spaced reactant injector in a production scale MOCVD reactor

In a previous paper, we described experimental results of the growth of a wide range of III–V materials using a water-cooled close-spaced injector that permits organometallic and hydride reactants to be injected 1 cm above the hot wafer. In this paper, we describe important design and operating considerations for this new metalorganic chemical vapor deposition (MOCVD) injector, including construction details, deposition efficiency and process window considerations. Our theoretical modeling indicates that the gas flow patterns are very different from those in a typical rotating disk reactor. By making analytical approximations for the velocity and temperature profiles, we have developed a flow stability parameter and find that the thermal stability depends on the square of the injector-to-substrate gap.     

Mechanisms of chemical vapor deposition of silicon

The distribution in the silicon epitaxial growth from SiCl₄ and hydrogen are observed in situ by IR absorption spectroscopy. Two methods are used complementarily, one is IR spectroscopy of reactants extracted from the reactor by a fine quartz tube which is not disturbing the reactions, and gives knowledge about the local distribution, the other is direct IR spectroscopy of hot reactants in the reactor which is useful to ascertain the results at the real high temperature situation. The intermediate species are SiHCl₃, SiH₂Cl₂ which is estimated from the induced emission bands at 500 and 570 cm^-1. HCl is a dominant waste product and contributes to reverse reactions. To investigate the reaction, HCl is intentionally injected into the reacting gas. This kind of injection method may also be very effective to analyze the reactions using other reactants such as SiCl₄, SiHCl₃ and SiH₂Cl₂.     

Uniformity investigation of MOCVD‐grown LED layers

Doped or undoped gallium nitride compounds (GaN/InGaN), usually grown by metal‐organic chemical vapor deposition (MOCVD) method, are at the heart of blue and green light emitting diodes (LEDs). Growth uniformities, such as the excited wavelength, luminous intensity and film thickness, critically influence their application in LED devices. In this paper, growth of GaN compounds in a MOCVD reactor, capable of a one‐time production of 36 × 2” wafers of nitrides, has been investigated. To examine growth uniformity across the wafer and from wafer to wafer, the reactor is divided into Zone A, Zone B and Zone C according to distance to the center of the graphite susceptor. Comparative analysis of each zone offers a straightforward view of the mean excitation wavelength, luminous intensity, film thickness and their standard deviations. Conformity of the growth uniformity in each zone is further checked comprehensively through averaging across‐wafer and wafer‐to‐wafer variables and their standard deviations. Zone B is found to retain excellent wavelength uniformity, since it is located at the middle of the susceptor with weaker effects of the susceptor edge and of the inlet gas flow. Zone A, at the center of the reactor, has the best mean intensity and thickness uniformities due to a well control of the infrared temperature measurement during the growth. And Zone C is worst in all uniformities and should be the main focus when optimizing the reactor. The above experimental analysis reveals the principles common to the MOCVD technique, and provides a basic for further optimization of the process window to improve the cycles with considerable reduction of the costs.