热丝CVD法沉积固态扩散源制备晶硅太阳电池p+/n+发射极研究

为进一步提高晶硅太阳能电池发射极的性能,本文提出了一种新的发射极制备技术-低温CVD法沉积固态薄膜扩散源并进行高温扩散.采用热丝化学气相沉积法(HWCVD)在单晶硅片上沉积重掺杂硅基薄膜作为固态扩散源,然后在空气氛围下的管式炉中进行高温扩散,最后用稀HF溶液去除表面的BSG/PSG.通过掺磷薄膜扩散在P型单晶硅片上制备了方阻在50～250 Ω/□范围内可控的n+型发射极;通过掺硼薄膜扩散在N型硅片上制备了方阻在150 ～600Ω/□□范围内可控的p+型发射极.并且通过在源气体中加入CO2作为氧源,实现了扩散后硅片表面残留扩散源层的彻底去除.     

高效背结异质结太阳电池硼掺杂非晶硅发射极研究

晶硅/非晶硅异质结(HJT)太阳电池由于具有高开压、高转换效率和低温度系数等优点而备受关注，其中硼掺杂p型非晶硅(p-a-Si∶H)发射极是高转换效率电池中不可忽视的重要部分，改变其硼掺杂浓度，可以调节p-layer薄膜的电学特性，从而直接影响电池转换效率。本文采用等离子体增强化学气相沉积(PECVD)设备制备HJT太阳电池，通过改变B₂H₆的掺杂浓度，对电池中p-a-Si∶H层进行优化，使HJT电池获得0.75%的相对效率提升。进一步地，将发射极设置为梯度掺杂的双层结构，经过优化，少子寿命(@Δn=5×10¹⁵ cm^-3)和隐开路电压(@1-Sun)分别提升400μs和3 mV,最终具有梯度掺杂发射极的电池其平均效率相对提升2.03%,主要表现为FF和V_oc的明显增加，实现了高效HJT电池p型发射极的工艺优化。     

n型IBC太阳电池选择性发射极工艺研究

为提升n型叉指背接触(IBC)太阳电池的光电转换效率,采用丝网印刷硼浆和高温扩散的方式形成选择性发射极结构,研究了硼扩散和硼浆印刷工艺对电池发射极钝化性能和接触性能的影响。实验结果表明,在硼扩散沉积时间和退火时间一定的条件下,硼扩散通源(BBr₃)流量为100 mL/min,沉积温度为830 ℃,退火温度为920 ℃时,发射极轻掺杂(p⁺)区域的隐开路电压达到710 mV,暗饱和电流密度为12.2 fA/cm²。发射极局部印刷硼浆湿重为220 mg时,经过高温硼扩散退火,重掺杂(p⁺⁺)区域的隐开路电压保持在683 mV左右,该区域方块电阻仅46 Ω/□,金属接触电阻为2.3 mΩ·cm². 采用该工艺方案制备的IBC电池最高光电转换效率达到24.40%,平均光电转换效率达到24.32%,相比现有IBC电池转换效率提升了0.28个百分点。     

La-Mn共掺杂的钛酸钡陶瓷还原再氧化研究

以MnO2为受主,La2O3为施主,采用传统高温固相法对钛酸钡陶瓷进行掺杂,并对还原气氛下烧结的样品分别在900 ℃和1000 ℃的温度下进行再氧化处理.采用XRD和电性能测试研究了镧锰共掺杂和再氧化工艺对于钛酸钡陶瓷阻温特性及微观结构的影响.结果表明:钛酸钡陶瓷的阻温特性与施主、受主的掺杂比例和烧结气氛有关;与在空气下烧结相比,在还原气氛下烧结能明显的提高施主掺杂的临界浓度,同时随着再氧化温度从900 ℃提高到1000 ℃,PTC效应明显增强.BaTiO3晶粒尺寸随着施主掺杂浓度的提高而变小.Mn离子的掺入使钛酸钡晶格结构更为紧密,阻碍了晶格内部氧离子向外部的扩散,导致了明显的PTC效应.     

衬底温度对磁控溅射法制备掺Ta氧化锌薄膜性能的影响

采用射频磁控溅射法,在不同的衬底温度下制备了钽(Ta)掺杂的氧化锌(ZnO)薄膜,采用X射线能谱(EDS)、X射线衍射(XRD)、扫描电镜(SEM)、紫外-可见分光光度计和光致发光(PL)光谱研究了衬底温度对制备的Ta掺杂ZnO薄膜的组分、微观结构、形貌和光学特性的影响.EDS的检测结果表明,Ta元素成功掺入到了ZnO薄膜;XRD图谱表明,掺入的Ta杂质是替代式杂质,没有破坏ZnO的六方晶格结构,随着衬底温度的升高,(002)衍射峰的强度先增大后降低,在400℃时达到最大;SEM测试表明当衬底温度较高时(400℃和500℃),Ta掺杂ZnO薄膜的晶粒明显变大;紫外-可见透过光谱显示,在可见光范围,Ta掺杂ZnO薄膜的平均透光率均高于80;,衬底不加热时制备的Ta掺杂ZnO的透光率最高;制备的Ta掺杂ZnO薄膜的禁带宽度范围为3.34~3.37eV,衬底温度为500℃时制备的Ta掺杂ZnO薄膜的禁带宽度最小,为3.34eV.PL光谱表明衬底温度为500℃时制备的Ta掺杂ZnO薄膜中缺陷较多,这也是造成薄膜禁带宽度变小的原因.     

ECR-PECVD制备n型微晶硅薄膜的研究

用电子回旋共振等离子体增强化学气相沉积(ECR-PECVD)的方法制备了磷掺杂微晶硅薄膜材料.通过Hall,Raman光谱和XRD的测试分析,研究了衬底温度和磷烷流量对掺杂薄膜组织结构和电学性能的影响.根据AFM照片分析了薄膜的表面形貌,进而推测了薄膜的内部组成.实验发现:衬底温度在250 ℃时,磷烷的加入会大大降低薄膜的晶化率.衬底温度提高到350 ℃后这种影响明显下降.薄膜的载流子浓度和电导率受薄膜晶化率影响明显,衬底温度的升高对薄膜电学性能提高有较大帮助.     

全TOPCon电池正面多晶硅层硼掺杂工艺

为提升隧穿氧化层钝化接触(TOPCon)电池光电转换效率,本文通过高温扩散在n型TOPCon电池正面制作p型隧穿氧化层钝化接触结构,提升发射极钝化性能,减少正面金属复合。本文研究了不同沉积时间、推进温度、推进时间等工艺参数对实验样品钝化性能及掺杂曲线的影响。实验结果表明,当沉积时间为1 500 s,推进温度为920℃,推进时间为20 min时,掺硼多晶硅层可获得较优的钝化性能及掺杂浓度,其中样品多晶硅层硼掺杂浓度达到1.40×10²⁰ cm^-3,隐开路电压(iV_oc)大于720.0 mV。依据该参数制备的TOPCon电池光电转换效率可达23.89%,对应的短路电流密度为39.36 mA/cm²,开路电压(V_oc)达到726.4 mV,填充因子(FF)为83.54%。     

高温扩散工艺制备带隙可调的β-(AlxGa1-x)2O3薄膜

β-(Al_xGa_1-x)₂O₃因其优异的抗击穿及带隙可调节性在现代功率器件及深紫外光电探测等领域展现出巨大的应用前景，然而传统直接生长工艺的复杂性和难度限制了其进一步的发展。因此，本文采用较为简单的高温扩散工艺在c面蓝宝石衬底上成功制备了β-(Al_xGa_1-x)₂O₃纳米薄膜。利用X射线衍射、原子力显微镜、扫描电子显微镜和紫外-可见分光光度计对其进行了表征。由于高温下蓝宝石衬底中的Al原子向Ga₂O₃层扩散，β-Ga₂O₃薄膜将转变为Al、Ga原子比例不同的β-(Al_xGa_1-x)₂O₃薄膜。实验结果显示：当退火温度从1 010℃增加到1 250℃时，薄膜中Al的平均含量从0.033增加到0.371;当退火温度从950℃增加到1 250℃时...     

V5+掺杂CaCu3 Ti4 O12陶瓷的 低温合成及烧结性能

采用传统固相反应法以V2O5为V5+掺杂源合成制备了CaCu3Ti4-xVxO12(CCTVO,x=0;,1;,3;,5;)陶瓷粉体,研究了V掺杂量对CaCu3Ti4O12(CCTO)物相低温合成及其低温烧结性能的影响,并对V掺杂CCTO陶瓷的低温合成机理和烧结机理进行了分析.XRD结果表明:当V掺杂量为≥1;时,在870℃煅烧20h可以完全获得CCTO物相,而未掺杂的样品则含有明显杂相,这说明V掺杂可以实现CCTO物相在低温下的合成制备.但差热分析表明,V掺杂后会提高CCTO发生固相反应的起始温度.分析认为低温下之所以实现CCTO的制备主要得益于V掺杂后会在高温煅烧过程中形成液相而增强了扩散气质和热传递效应.V掺杂量为3;的粉体在920℃相对较低温度下烧结后,具有较大的晶粒尺寸和高达92.4;的致密度,所得陶瓷在20Hz的低频率下介电常数高达2.28×105.     

硫铁矿烧渣制备导电陶瓷的工艺研究

采用全铁含量21.89;,Fe2O3含量29.80;的硫铁矿烧渣,在高温还原气氛下以少量还原剂还原,制备了电阻率较低的高强导电陶瓷.研究了烧结温度、保温时间、矿化剂种类及掺杂量对导电陶瓷强度及电阻率的影响.结果表明:导电陶瓷的强度随烧结温度的升高而增加,保温时间的延长而降低,矿化剂掺杂量的增加而增加;而电阻率的变化趋势正好与强度变化相反.当还原剂与硫铁矿烧渣比值为0.1,1400℃保温60 min,萤石掺杂量5.4;,导电陶瓷电阻率达到58 Ω·cm,强度87 MPa;而当Na2O掺杂量达到4;,电阻率为88 Ω·cm,强度为84MPa.     

电势诱导衰退和湿热衰退P-PERC太阳能电池的修复与增效

针对P型钝化发射极背面接触(PERC)太阳能电池在服役期间受到电势衰退和湿热诱导衰退影响而引起光电转换效率降低的问题,本文通过光电注入和热退火工艺对已衰退电池进行修复并研究其增效机制。实验结果表明:在光照强度为3倍标准太阳光、电注入电流为10 A、退火温度为150 ℃、工艺50 min实验条件下,对180片已衰退电池进行修复实验,其中94.32%的已衰退电池的光电转换效率得到修复,实验后电池光电转换效率平均提升8.96%。光致发光光谱和量子效率分析表明,光电注入和热退火工艺可有效减少电池因电势诱导衰退和湿热衰退形成的内部缺陷和背表面缺陷,提升衰退电池片的光电转换效率。     

超薄多晶硅的掺杂、钝化及光伏特性研究

本文对70 nm超薄多晶硅的掺杂工艺、钝化性能及光伏特性进行了研究。确定了70 nm超薄多晶硅的掺杂工艺,研究表明当离子注入剂量为3.2×10¹⁵ cm^-3,在855 ℃退火20 min时,70 nm超薄多晶硅的钝化性能可以达到与常规120 nm多晶硅相当的水平,且70 nm多晶硅的表面掺杂浓度达到5.6×10²⁰ atoms/cm³,远高于120 nm掺杂多晶硅的表面掺杂浓度(2.5×10²⁰ atoms/cm³)。基于70 nm超薄多晶硅厚度减薄和高表面浓度掺杂的特点,较低的寄生吸收和强场钝化效应使得在大尺寸(6英寸)直拉单晶硅片上加工的N型TOPCon太阳能电池的光电转换效率得到明显提升,主要电性能参数表现为:电流I_sc升高20 mA,串联电阻R_s降低,填充因子FF增加0.3%,光电转换效率升高0.13%。     

Phosphorus gettering of precipitated Cu in single crystalline silicon based on rapid thermal process

In this paper, we have investigated the effect of phosphorus diffusion gettering on the precipitated Cu in silicon via rapid thermal process (RTP). It is found that, for dot-like or star-like precipitates, the RTP-based phosphorus diffusion technique is efficient for gettering out the precipitated Cu. A two-step RTP gettering process is much more effective than a single-step RTP process. Furthermore, the choice of oxygen ambient can enhance the Cu gettering efficiency due to the involvement of considerable self-interstitial silicon atoms. The minority carrier lifetime of the sample subjected to RTP-based phosphorus gettering has also been verified to be significantly enhanced. These results are of interest for the gettering engineering of high-efficiency silicon solar cells.     

Crystallization of n-doped amorphous silicon PECVD films: comparison between SPC and RTA methods

Amorphous silicon films are deposited by radio-frequency plasma-enhanced chemical-vapor deposition (RF-PECVD) with different n-doping rates. The amorphous films are subsequently crystallized using either solid phase crystallization (SPC) or rapid thermal annealing (RTA). We compare the effect of the n-doping rate on some properties of the microcrystalline silicon films obtained with both techniques. In the SPC process, the time required for the beginning of the crystallization decreases with increasing phosphorus doping. Moreover, doped films present slightly higher crystal size than intrinsic films but the doping rate does not significantly influence the grain size. For RTA, the doping rate decreases the crystallization temperature and increases significantly the crystal size. Whatever the doping rate, the average grain sizes obtained by RTA are larger than those obtained by SPC. The electrical resistance of the crystallized films also depends on the crystallization process: RTA films present a lower dark conductivity than SPC films. These results are discussed taking into account the different kinetics of both crystallization techniques and the role played by the silicon dangling bonds and their charge states on the crystal growth.     

Enhancement effect of nitrogen co-doping on oxygen precipitation in heavily phosphorus-doped Czochralski silicon during high-temperature annealing

Oxygen precipitation in conventional and nitrogen co-doped heavily phosphorus (P)-doped Czochralski silicon (CZ-Si) crystal subjected to various high-temperature annealing in the range of 1000–1150 °C was comparatively investigated. It was revealed that oxygen precipitates hardly generated in conventional heavily P-doped CZ-Si; while they remarkably generated in the nitrogen co-doped one. Moreover, nitrogen doping could enhance oxygen precipitation during the prolonged annealing with a rapid thermal process (RTP) pre-treatment, but it has neglectable influence on oxygen precipitation for short-time annealing. It was believed that nitrogen co-doped heavily P-doped CZ-Si possesses nitrogen-related complexes that act as heterogeneous nuclei for super-saturated interstitial oxygen and then enhanced oxygen precipitation. Finally, it was found that nitrogen doping could hardly enhance oxygen precipitation in heavily P-doped CZ-Si at 1200 °C.     

低温热处理温度对SiC衬底上CuAlO2薄膜特性的影响

为了解决双极型碳化硅(SiC)功率器件中由于p型SiC在室温下难以完全电离所导致的p+n发射结注入效率低的问题,提出将p型CuAlO₂与n型SiC形成的异质结作为发射结以提高该结的注入效率。本文利用溶胶凝胶(sol-gel)方法,在4H-SiC衬底上制备了CuAlO₂薄膜,研究了低温热处理温度对CuAlO₂薄膜晶体结构、表面形貌、光学特性的影响。结果表明:较高的热处理温度可以促进中间产物CuO的生成,进而在固相反应阶段促进CuAlO₂相的产生,最终制备的CuAlO₂薄膜主要以CuAlO₂相的(012)晶向择优取向。随着低温热处理温度的升高,薄膜的表面均匀致密,空位缺陷含量降低,结晶质量提高。当低温热处理温度为300 ℃时,CuAlO₂薄膜晶粒尺寸约为35 nm。此外,CuAlO₂薄膜在可见光范围内的透过率超过70%,且随着预处理温度升高,薄膜光学带隙略有增加。     

Intrinsic gettering in germanium-doped Czochralski crystal silicon crystals

The intrinsic gettering (IG) of germanium-doped Czochralski (GCZ) silicon with different concentrations of germanium has been investigated in this paper. The conventional Czochralski (CZ) and the GCZ silicon samples were annealed using a one-step high temperature process followed by a sequence of low–high temperature annealing cycles. It was found that the good defect-free denude zones in the near surface of the GCZ silicon could be achieved using simply a one-step high temperature annealing process. Furthermore, the density of bulk microdefects as IG sites was higher than that in the CZ silicon, as a result of germanium enhancing oxygen precipitation during three-step annealing. Meanwhile, the experimental results showed that germanium also enhanced the out-diffusion of oxygen. Furthermore, it is believed that germanium doping can increase the ability of IG in CZ silicon wafers.     

Comparison of photoluminescence and capacitance spectroscopies as efficient tools for interface characterisation of heterojunction solar cells

The correlation between diffusion capacitance and photoluminescence as a method of interface-defect density characterisation in amorphous silicon/crystalline silicon heterojunction solar cells is explored by numerical modelling and experimentally. At open circuit, the influence of the defect density at the front amorphous silicon/crystalline silicon interface and the surface recombination velocity of the minority carriers in the bulk depend on the doping level of the crystalline silicon and the critical contribution of the majority carriers. Experimental illustration is given for five series of solar cells with different doping levels, interface properties and back contacts. We observe agreement between simulation and experimental results and a correlation between the two methods of measurement of interface defects.     

LPCVD法制备TOPCon太阳能电池工艺研究

本文主要对低压化学气相沉积(LPCVD)法制备N型高效晶硅隧穿氧化层钝化接触(TOPCon)电池工艺进行研究。分析LPCVD法制备隧穿氧化层及多晶硅层的影响因素，研究了不同氧化层厚度、多晶硅厚度及多晶硅层中P掺杂量对太阳能电池转换效率的影响。结果表明：当隧穿氧化层厚度在1.55 nm时，钝化效果最佳；多晶硅层厚度120 nm时V_oc达到最高值；多晶硅层厚度在90 nm时E_ff最高。当P掺杂量为3.0×10¹⁵ cm^-2时可获得较高的V_oc,原因是随着P掺杂量的增加，多晶硅层场钝化效果提高。