YSZ基片上Tl-2212超导薄膜的制备及其特性的研究

本文报道了在(001)掺钇氧化锆(YSZ)基片上生长高质量CeO2缓冲层和Tl-2212超导薄膜的制备方法,以及不同厚度的超导薄膜对其特性的影响.XRD和SEM测试表明,在经过合适条件退火的基片和CeO2缓冲层上,所生长的Tl-2212薄膜具有致密的晶体结构、优良的面内和面外取向.最佳样品的临界转变温度(Tc)和临界电流密度为(Jc)可以分别达到107.5 K和 4.24 MA/cm2(77 K,0 T).实验结果表明,采用该工艺所制备的不同厚度Tl-2212超导薄膜的主要指标能满足开发多种超导器件的要求.     

Tl-1223高温超导薄膜在蓝宝石单晶基片上的生长和性能研究

本文报道了采用射频磁控溅射法和快速升温烧结法在R面取向的蓝宝石单晶基片上生长CeO₂缓冲层和Tl-1223超导薄膜，研究了缓冲层生长情况和先驱膜后退火条件对超导薄膜结晶情况和超导特性的影响。AFM和XRD表征结果显示，蓝宝石基片经过退火后其表面形成具有光滑平台的台阶结构，同时基片的晶体质量得到了改善；本文所制备的CeO₂缓冲层和Tl-1223超导薄膜具有较好的c轴生长取向，而且两者呈现良好的ab面内织构。SEM表征结果显示，生长良好的Tl-1223超导薄膜呈层状结构，表面光滑平整、结构致密。在液氮环境下，测得所制备Tl-1223超导薄膜的临界转变温度T_c约为111 K,临界电流密度J_c(77 K,0 T)约为1.3 MA/cm²。     

热处理蓝宝石基片对Tl-2212超导薄膜的影响

本文研究了蓝宝石基片的热处理对Tl-2212薄膜的结晶质量、表面形貌及其超导特性的影响.SEM和XRD研究表明,在经过最佳条件(1000 ℃×20 h)退火后的基片上,可以制作出具有致密的晶体结构、高度c轴取向的外延Tl-2212超导薄膜,其薄膜具有优良的电学性能.     

热分解工艺对溶胶-凝胶法制备Tl-2212超导薄膜特性的影响

研究了在铝酸镧(LAO)基片上TBCCO凝胶膜的热分解条件对Tl2Ba2 CaCu2O8(Tl-2212)薄膜的结晶质量、表面形貌、组分比例的影响.SEM和XRD研究表明,凝胶膜经过适当条件热分解后,可以制作出具有致密的晶体结构、高度c轴取向的外延Tl-2212超导薄膜,其薄膜具有较好的电学性能.其临界温度Tc可达106 K,临界电流密度Jc可达0.83 MA/cm2 (77 K,0T).     

Pechini法合成Bi2Sr2CaCu2O8+δ超导薄膜的研究

采用Pechini法在STO(100)单晶基底上制备Bi2Sr2CaCu2O8+δ(Bi2212)超导薄膜.重点研究了金属离子比例与预处理温度对Bi2212薄膜相组成及表面形貌的影响.结果表明,适当增加初始计量中Ca的摩尔比,有利于纯相的形成.预处理温度不仅影响样品的表面形貌,同时对相纯度的影响也很显著.较佳条件下,1108 K温度下热处理10 min可制备具有c轴外延取向的纯Bi2212相薄膜.     

化学溶液法制备GdBa2Cu3O7-x超导薄膜的研究

将乙酸盐溶解在丙酸中获得无氟的前驱溶液,利用化学溶液沉积(CSD)法在LaAlO3(LAO)(100)单晶衬底上外延生长出GdBa2 Cu3 O7-x(GdBCO)超导薄膜.研究了不同退火温度下获得的薄膜的物相、取向、形貌以及超导电性.结果表明:在817℃下合成的GdBCO薄膜具有很好的双轴取向,其超导转变温度(Tc)为92.5 K;在77 K和自磁场下,临界电流密度(Jc)达到1.33 MA/cm2.     

原子层沉积与磁控溅射法制备TiO2薄膜性能对比研究

分别采用原子层沉积(ALD)和磁控溅射法(MS)在Si和石英衬底上制备TiO2薄膜,并进行退火处理.利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、原子力显微镜(AFM)和紫外分光光度计对这两种方法制备薄膜的晶型结构、表面形貌和光学特性进行分析对比.结果显示,对于沉积态TiO2薄膜,ALD-TiO2和MS-TiO2未能检测到TiO2衍射峰.ALD-TiO2为颗粒膜,其表面粗糙,颗粒尺寸大;MS-TiO2薄膜表面平整.经退火后,两种方法制备的TiO2薄膜能检测到锐钛矿A(101)衍射峰,但结晶质量不高.受薄膜表面形貌和晶型结构等因素影响,退火前后ALD-TiO2透过率与MS-TiO2透过率变化不一致.对于沉积态和退火态薄膜的禁带宽度,ALD-TiO2分别为3.8eV和3.7 eV,吸收边带发生红移,MS-TiO2分别为3.74 eV和3.84 eV,吸收边带发生蓝移.     

缓冲层厚度对MOCVD法生长GaN外延薄膜性能的影响

本文研究了低温GaN(LT-GaN)缓冲层表面形貌,其随厚度的变化规律及对随后生长GaN外延膜各项性能的影响.用场发射扫描电镜(SEM)和原子力显微镜(AFM)研究LT-GaN缓冲层表面形貌,发现随着厚度的增加,其表面由疏松、粗糙变得致密、平整,六角GaN小晶粒的数量减少,且取向较为一致.用X光双晶衍射(XRD)、AFM和Hall测量研究1μm厚本征GaN外延薄膜的结晶质量、表面粗糙度、背底载流子浓度和迁移率等性能,发现随着LT-GaN缓冲层厚度的增加:XRD的半高宽FWHMs增大,表面粗糙度先减小后又略有增大,背底载流子浓度则随之减少,而迁移率的变化则不明显.通过分析进一步确认LT-GaN缓冲层的最优生长时间.     

单质靶溅射制备CZTS薄膜及太阳电池

采用单质靶磁控溅射制备Cu2ZnSnS4 (CZTS)薄膜,研究了薄膜的元素组分、升温速率、硫化温度对薄膜表面平整性以及晶粒尺寸的影响.通过SEM与AFM表征薄膜的表面形貌与表面粗糙度,用EDS检测薄膜的元素组分.所制备的样品的Cu/(Zn+ Sn)、Zn/Sn处于最优范围.通过XRD及Raman检测薄膜的结晶情况以及薄膜中的二次相,经上述测试分析判定CZTS薄膜品质良好.最终制备出以CZTS为吸收层的薄膜太阳电池,并用Ⅰ～V特性检验了CZTS电池性能参数,得到效率为0.83;的CZTS薄膜太阳电池,并通过改进硫化退火工艺将效率提高至1.58;.     

磁控溅射衬底加热温度和后退火温度对制备β-Ga2O3薄膜材料的影响

作为宽禁带半导体材料的一员,结构稳定的β-Ga₂O₃具有比SiC和GaN更宽的禁带宽度和更高的巴利加优值,近年来受到科研人员的广泛关注。本文采用射频(RF)磁控溅射法在C面蓝宝石衬底上生长β-Ga₂O₃薄膜,探究溅射过程中衬底加热温度的影响。溅射完成后通过高温退火处理提升薄膜质量,研究衬底加热温度和后退火温度对氧化镓薄膜晶体结构和表面形貌的影响。利用X射线衍射(XRD)、原子力显微镜(AFM)等测试手段对β-Ga₂O₃薄膜晶体结构、表面形貌等进行分析表征。实验结果表明,随着衬底加热温度的升高,β-Ga₂O₃薄膜表面粗糙度逐渐降低,薄膜晶体质量得到显著提升;在氧气气氛中进行后退火,合适的后退火温度有利于氧化镓薄膜重新结晶、增大晶粒尺寸,能够有效修复薄膜的表面态和点缺陷,对于改善薄膜晶体质量有明显优势。     

MOVPE growth of InN buffer layers on sapphire

We report on the MOCVD growth of InN buffer layers on sapphire substrate for InN growth. The approach used assumes that an optimized InN buffer layer has to exhibit at least the same crystalline quality and sapphire surface coverage than the GaN buffer layers allowing to grow high crystalline quality GaN on sapphire. The buffer layers were characterized by AFM and GID measurements. Sapphire nitridation was investigated: it has a strong influence on in-plane crystalline quality. Two kinds of buffer layers were optimized according to the GaN buffer layer specifications: one of them only presented In droplets at its surface. It was shown that the small amount of In droplets increases the adatoms mobility of the main layer overgrown, leading to a 25% decrease of its in-plane mosaicity, compared to InN films directly grown on sapphire. To achieve a same improvement on InN buffer layer free of In droplets, the InN main layer growth temperature had to be increased from 550 °C. to 600 °C.     

Reduction of the defect density in GaN films using ultra-thin AlN buffer layers on 6H-SiC

A low dislocation density of 10^7–8 cm⁻² in GaN thin films on 6H-SiC(0001) substrates grown by metalorganic chemical vapor deposition was achieved. By considering possible origins of dislocations in the GaN/AlN/Sic structure, two major dislocation reduction routes are proposed; ultra-thin AlN buffer layers and smooth AlN surfaces in an atomic scale. Experimentally, the effects of the surface roughness and structural perfection of the AlN buffer layer on GaN film quality were extensively investigated as a function of AlN film thickness. The reduced dislocation density was realized by using ultra-thin AlN buffer layers having a thickness of 1.5 nm, which is below the critical value for misfit dislocation generation. The smoother surface morphology and enhanced structural quality of ultra-thin AlN buffer layers were found to be the main parameters in reducing the defect density in the GaN film.     

High-quality silicon/insulator heteroepitaxial structures formed by molecular beam epitaxy using Al2O3 and Si

Heteroepitaxial growth of γ-Al₂O₃ films on a Si substrate and the growth of Si films on the γ-Al₂O₃/Si structures by molecular beam epitaxy have been investigated. It has been found from AFM and RHEED observations that, γ-Al₂O₃ films with an atomically smooth surface with an RMS values of ∼3 Å and high crystalline quality can be grown on Si (1 1 1) substrates at substrate temperatures of 650–750°C. Al₂O₃ films grown at higher temperatures above 800°C, did not show good surface morphology due to etching of a Si surface by N₂O gas in the initial growth stage. It has also been found that it is possible to grow high-quality Si layers by the predeposition of Al layer followed by thermal treatment prior to the Si molecular beam epitaxy. Cross-sectional TEM observations have shown that the epitaxial Si had significantly improved crystalline quality and surface morphology when the Al predeposition layer thickness was 10 Å and the thermal treatment temperature was 900°C. The resulting improved crystalline quality of Si films grown on Al₂O₃ is believed to be due to the Al₂O₃ surface modification.     

Investigations on the effect of InSb and InAsSb step-graded buffer layers in InAs0.5Sb0.5 epilayers grown on GaAs (0 0 1)

We report the structural and electrical properties of InAsSb epilayers grown on GaAs (0 0 1) substrates with mid-alloy composition of 0.5. InSb buffer layer and InAs_xSb_1−x step-graded (SG) buffer layer have been used to relax lattice mismatch between the epilayer and substrate. A decrease in the full-width at half-maximum (FWHM) of the epilayer is observed with increasing the thickness of the InSb buffer layer. The surface morphology of the epilayer is found to change from 3D island growth to 2D growth and the electron mobility of the sample is increased from 5.2×10³ to 1.1×10⁴ cm²/V s by increasing the thickness of the SG layers. These results suggest that high crystalline quality and electron mobility of the InAs_0.5Sb_0.5 alloy can be achieved by the growth of thick SG InAsSb buffer layer accompanied with a thick InSb buffer layer. We have confirmed the improvement in the structural and electrical properties of the InAs_0.5Sb_0.5 epilayer by quantitative analysis of the epilayer having a 2.09 μm thick InSb buffer layer and 0.6 μm thickness of each SG layers.     

MOVPE growth of GaAs on Ge substrates by inserting a thin low temperature buffer layer

High quality GaAs layers have been grown by low pressure MOVPE on Ge(001) and Ge(001) 9° off oriented in [110] direction by using a thin low temperature (LT) GaAs layer. Investigations of the initial growth step were performed at different V/III ratios and temperatures. To show the good buffer layer quality solar cell structures were grown on off oriented n‐Ge(001) and n‐GaAs(001) substrates. The surface morphology was studied by atomic force microscopy which showed the step‐flow growth mode on 1.2 µm thick GaAs/Ge structures. The crystalline qualities of this structures and the smooth surface morphology were investigated by double crystal X‐ray diffraction (XRD) and atomic force microscopy (AFM). (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Structural and electrical properties of GaSb, AlGaSb and their heterostructures grown on GaAs by metalorganic chemical vapor deposition

A systematic study of structural and electrical properties of GaSb and AlGaSb grown on GaAs by metalorganic chemical vapor deposition is reported. In general, the results obtained from surface morphologies, X-ray linewidths and Hall properties are consistent with each other and indicate that the optimal growth conditions for GaSb are at 525°C around V/III = 1. A highest hole mobility of 652 cm²/V · s at RT (3208 cm²/V · s at 77 K) and a lowest concentration of 2.8 × 10¹⁶ cm⁻³ (1.2 × 10¹⁵ cm⁻³ at 77 K) were obtained for GaSb grown under this optimal condition. Compared to the GaSb growth, a smaller V/III ratio is needed for the AlGaSb growth to protect the surface morphology. When Al was incorporated into GaSb growth, mobility decreased and carrier concentration increased sharply. The AlGaSb grown at 600°C had a background concentration about one order of magnitude lower than the AlGaSb grown at 680°C. Room-temperature current-voltage characteristics of GaSb/Al_xGa_{1 − x}Sb/GaSb show a rectifying feature when Al composition x is higher than 0.3, suggesting a valence-band discontinuity at the AlGaSb/GaSb interface. A leakage current much higher than the value predicted by the thermionic emission theory is observed at 77 K, presumably due to a large number of dislocations generated by the huge lattice mismatch between GaSb and GaAs.     

MOCVD生长InxGa1-Xn薄膜的表征

本文利用MOCVD方法在(0001)取向的蓝宝石衬底上实现了不同生工艺条件下的InxGa-xN薄膜的制备,并通过XRD、SEM、AFM等测量分析方法系统研究了生长工艺参数对InxGa1-xN薄膜的组分和性质的影响.InxGa1-xN薄膜的制备包括蓝宝石衬底表面上GaN缓冲层的生长以及缓冲层上InxGa1-xN薄膜的沉积两个过程.通过对所制备InxGa1-xN薄膜的XRD、SEM、AFM分析发现,调节生长温度和TMGa的流量可以有效控制InxGa1-xN薄膜中In的组分,并且随着生长温度的升高,InxGa1-xN薄膜的表面缺陷减少.     

4H-SiC衬底表面SiC薄膜的同质外延生长

以4H-SiC为衬底,在不同衬底温度下进行SiC薄膜的同质外延生长。利用反射式高能电子衍射(RHEED)、扫描电子显微镜(SEM)、拉曼(Raman)等测试手段,对生长样品的结构和结晶质量进行了表征。根据测试结果发现,在衬底温度为1200℃时能够得到质量较高的薄膜,在另外两个温度(1100℃和1300℃)条件下得到的薄膜质量是较差的。     

High-quality InP grown by chemical beam epitaxy

InP films were grown by chemical beam epitaxy using trimethylindium (TMI) and pure phosphine (PH₃) in a flow control mode with hydrogen as the carrier gas, with the TMI flow rate fixed at 3 SCCM. Substrate temperatures were varied between 505 and 580°C and V/III ratios from 3 to 9. InP layers with high optical quality (intense and narrow excitonic transition lines) and high crystalline quality (narrow and symmetric X-ray diffraction peaks) could be grown only within a narrow parameter window around a substrate temperature of 545°C (δT_s ≤ 25°C) and a V/III ratio of 5.5 (δ(V/III) ≤ 2). Carrier densities of 8 × 10¹⁴ cm^-3 with mobilities of 70000 cm²/V.s measured at 77 K were obtained for growth conditions close to the edge of this parameter window towards low V/III ratios. The growth rate of inP was also clearly at its maximum in the given parameter window. Leaving the window, by changing either the growth temperature or the V/III ratio, significantly decreased the growth rate. This reduced growth rate was accompanied by a degradation in the crystalline quality. We also demonstrate that for higher TMI flow the parameter window shifts to higher growth temperatures. The InP could be doped effectively with Si in the range from 9 × 10¹⁵ to 3 × 10¹⁸ cm^-3.     

Material characteristics of metalorganic chemical vapor deposition of Bi2Te3 films on GaAs substrates

Metal organic chemical vapor deposition has been investigated for growth of Bi₂Te₃ films on (0 0 1) GaAs substrates using trimethylbismuth and diisopropyltelluride as metal organic sources. The results of surface morphology, electrical and thermoelectric properties as a function of growth parameters are given. The surface morphologies of Bi₂Te₃ films were strongly dependent on the deposition temperatures. Surface morphologies varied from step-flow growth mode to island coalescence structures depending on deposition temperature. In-plane carrier concentration and electrical Hall mobility were highly dependent on precursor's ratio of VI/V and deposition temperature. By optimizing growth parameters, we could clearly observe an electrically intrinsic region of the carrier concentration at the temperature higher than 240 K. The high Seebeck coefficient (of −160 μVK⁻¹) and good surface morphology of this material is promising for Bi₂Te₃-based thermoelectric thin film and two-dimensional supperlattice device applications.