HgCdTe薄膜的输运特性及其应力调控

窄禁带直接带隙半导体材料碲镉汞(Hg1–xCdxTe)是一种在红外探测与自旋轨道耦合效应基础研究方面都具有重要应用意义的材料.本文对单晶生长的体材料Hg0.851Cd0.149Te进行阳极氧化以形成表面反型层,将样品粘贴在压电陶瓷上减薄后进行磁输运测试,在压电陶瓷未加电压时观察到了明显的SdH振荡效应.对填充因子与磁场倒数进行线性拟合,获得样品反型层二维电子气的载流子浓度为ns=1.25×10^16m^-2.在不同磁场下,利用压电陶瓷对样品进行应力调控,观测到具有不同特征的现象,分析应是样品中存在二维电子气与体材料两个导电通道.零磁场下体材料主导的电阻的变化应来源于应力导致的带隙的改变;而高场下产生类振荡现象的原因应为应力导致的二维电子气能级的分裂.     

负带隙HgCdTe体材料的磁输运特性研究

通过单晶生长了Cd组分为0.1的p型HgCdTe体材料,并制备了具有倒置型能带序的HgCdTe场效应器件.通过磁输运测试,在负带隙HgCdTe体材料中观察到明显的量子霍尔平台效应和Shubnikov-de Haas(SdH)振荡效应,证明样品具有较好的质量.利用SdH振荡对1/B关系的快速傅里叶变换,得到了样品的零场自旋分裂能约为26.55 meV,证明样品中存在强自旋-轨道耦合作用.进一步分析SdH中的拍频节点估算了样品中的有效g因子约为–11.54.     

Effect of Nitridation on Morphology, Structural Properties and Stress of AlN Films

We investigate effects of nitridation on AlN morphology, structural properties and stress. It is found that 3min nitridation can prominently improve AlN crystal structure, and slightly smooth the surface morphology. However, 10min nitridation degrades out-of-plane crystal structure and surface morphology instead. Additionally, 3-min nitridation introduces more tensile stress （1.5 GPa） in AlN films, which can be attributed to the weaker islands 2D coalescent. Nitridation for lOmin can introduce more defects, or even forms polycrystallinity interlayer, which relaxes the stress. Thus, the stress in AlN with 10 min nitridation decreases to -0.2 GPa compressive stress.     

缓冲层厚度对MOCVD法生长GaN外延薄膜性能的影响

本文研究了低温GaN(LT-GaN)缓冲层表面形貌,其随厚度的变化规律及对随后生长GaN外延膜各项性能的影响.用场发射扫描电镜(SEM)和原子力显微镜(AFM)研究LT-GaN缓冲层表面形貌,发现随着厚度的增加,其表面由疏松、粗糙变得致密、平整,六角GaN小晶粒的数量减少,且取向较为一致.用X光双晶衍射(XRD)、AFM和Hall测量研究1μm厚本征GaN外延薄膜的结晶质量、表面粗糙度、背底载流子浓度和迁移率等性能,发现随着LT-GaN缓冲层厚度的增加:XRD的半高宽FWHMs增大,表面粗糙度先减小后又略有增大,背底载流子浓度则随之减少,而迁移率的变化则不明显.通过分析进一步确认LT-GaN缓冲层的最优生长时间.     

Influence of Different Interlayers on Growth Mode and Properties of InN by MOVPE

We grow InN epilayers on different interlayers by metal organic vapour phase epitaxy （MOVPE） method, and investigate the effect of interlayer on the properties and growth mode of InN films. Three InN samples were deposited on nitrided sapphire, low-temperature InN （LT-InN） and high-temperature GaN （HT-GaN）, respectively. The InN layer grown directly on nitrided sapphire owns the narrowest x-ray diffraction rocking curve （XRC） width of 300 aresee among the three samples, and demonstrates a two-dimensional （2D） step-flow-like lateral growth mode, which is much different from the three-dimensional （3D） pillar-like growth mode of LT-InN and HT-GaN buffered samples. It seems that mismatch tensile strain is helpful for the lateral epitaxy of InN film, whereas compressive strain promotes the vertical growth of InN films.