双材料界面Ⅰ型扩展裂纹尖端的弹黏塑性场

双材料界面中存在材料黏性效应, 对界面裂纹尖端场的分布和界面本身性能 的变化起着重要的影响. 考虑裂纹尖端的奇异性, 建立了双材料界面扩展裂纹尖端的弹黏塑 性控制方程. 引入界面裂纹尖端的位移势函数和边界条件, 对刚性-弹黏塑性界面I型界面 裂纹进行了数值分析, 求得了界面裂纹尖端应力应变场, 并讨论了界面裂纹尖端场随各影响 参数的变化规律. 计算结果表明, 黏性效应是研究界面扩展裂纹尖端场时的一个主要因素, 界面裂纹尖端为弹黏塑性场, 其场受材料的黏性系数、马赫数和奇异性指数控制.     

正交异性双材料半无限界面裂纹尖端场分析

通过构造含两个实奇异指数的应力函数,利用复合材料断裂复变方法对正交异性双材料界面裂纹进行了研究。在特征方程组的判别式都小于零的情况下,通过求解一类广义重调和方程组边值问题,在双材料工程参数满足适当的条件下,推出了正交异性双材料半无限界面裂纹尖端的应力场和位移场。研究表明:其结果没有振荡奇异性;当上下半平面材料参数相同时,可获得正交异性单材料的应力场。并通过有限元算例进行比较,验证了理论结果的正确性。     

纯弯正交异性双材料界面裂纹尖端应力场

对纯弯曲载荷作用的正交异性双材料界面裂纹尖端应力场进行了解析研究。通过复合材料断裂力学复变函数方法,构造了特殊的挠度函数;将控制方程化为广义重调和方程,基于边界条件得到了两个八元齐次线性方程组,推出了含两个实奇异指数的应力函数及界面裂纹尖端附近的弯矩、扭矩、应力、应变的计算公式。     

压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件

研究了压电双材料界面钝裂纹附近螺型位错的屏蔽效应与发射条件.应用保角变换技术,得到了复势函数与应力场的封闭形式解,讨论了位错方位、双材料电弹常数及裂纹钝化程度对位错屏蔽效应和发射条件的影响.结果表明,Burgers矢量为正的螺型位错可以降低界面钝裂纹尖端的应力强度因子(屏蔽效应),屏蔽效应随位错方位角及位错与裂纹尖端距...     

含共线双半无限裂纹的正交异性复合材料板平面弹性问题的解析解

运用广义复变函数方法,通过构造适当的广义保角映射研究了含有共线双半无限裂纹的正交异性复合材料板的平面弹性问题,得出了部分裂纹面上受均匀面内载荷时应力场与两裂纹尖端处应力强度因子的解析解。结果表明:应力场的大小不仅与材料的几何构型及外载荷有关,还与材料的弹性常数有关,这是正交异性复合材料不同于各向同性材料的显著特征;两裂纹尖端处应力强度因子的大小只与材料的几何构型及外载荷有关;当两裂纹尖端的距离趋于无穷大时,所得到的解析解可退化为已有的正交异性复合材料板中半无限裂纹问题的解,通过将其与已有文献中的结果进行对比,验证了本文解析解的正确性。并通过数值算例分析了裂纹面上的受载长度、两裂纹尖端的距离对应力强度因子的影响规律以及两裂纹之间的相互作用。     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

双材料梁界面力学及其应用:综述

双材料结构在工程中得到了广泛应用,如薄膜涂层、压电材料、复合材料层合板和夹层板、粘结接头、FRP加固混凝土结构等;然而,这些结构的破坏通常是从界面及其附近开始的.通常利用损伤力学的方法(材料强度的方法)来预测裂纹的萌生,利用断裂力学的方法来预测裂纹的扩展;因此,开展双材料结构的界面应力分析和具分层双材料结构的断裂以及相关分析是至关重要的.首先介绍双材料梁粘结界面应力分析的基本模型,从而为预测裂纹的萌生提供了有力工具.然后综述双材料梁界面断裂力学分析的基本方法,并详细介绍解析解求解的裂纹尖端法及其相关模型,重点强调裂纹尖端变形对分析结果的影响.最后介绍界面分层对双材料结构其它力学特性的影响,例如屈曲和振动特性.     

正交异性材料平面裂纹尖端应力场

根据正交各向异性材料力学性能确定出了用应力函数表示的弹性力学基本方程,利用坐标变换和复变函数方法求解了正交异性材料平面裂纹体的应力边值问题。借鉴一般断裂力学解法构造了I型和II型裂纹问题的应力函数,推导出了正交各向异性板裂纹尖端区的奇异应力场。通过数值计算说明了裂纹尖端应力表达式的正确性,验证了裂尖前沿应力变化规律,即σx与材料特征参数h2成正比,而σy和τxy不随材料特性变化。     

多亚层柔性节点模型及其在双材料4ENF试件界面分析中的应用

提出了多亚层柔性节点模型用于分析双材料裂纹尖端的应力和变形。该模型考虑了胶层的变形,各亚层视为独立的剪切变形梁,采用两个界面柔度系数考虑界面应力对各亚层界面变形的影响,界面变形包括双材料界面和胶层的变形。通过对FRP-混凝土末端切口四点弯试件(Four-point bending end-notched flexure specimen,简称4ENF)进行界面分析,并与其他模型和有限元分析对比表明:刚性节点模型忽略了裂纹尖端的应力和变形集中,只能粗略地估计构件的整体变形和界面应力;半刚性节点容许裂纹尖端的转动,对裂纹尖端的变形估计优于刚性节点模型,但精度依然不高;多亚层柔性节点模型反映了裂纹尖端的应力和变形集中,与数值分析结果吻合很好,该研究对进行双材料结构的工程设计具有理论指导和参考价值。     

云纹干涉法研究复合材料构件的应力强度因子

本文采用贴片云纹干涉法，测试并研究了正交异性板纯弯试件及拉伸试件的应力强度因子。文中给出了复合材料纤维加强方向不同时位移与应力强度因子的关系式，通过测试得出受力模型的全场位移，给出云纹图，进而由裂纹尖端位移场推算出应力强度因子Ｋ１及Ｋ值。试验结果与有限元计算结果吻合良好。     

Development of a Hybrid Method of Reflection Photoelasticity for Crack Problems in Anisotropic Plates

Reflection type photoelastic experiment can be used more effectively than a transmission type photoelastic experiment especially in industrial fields. Moreover, composite materials have been widely used in engineering applications and structures because of their outstanding advantages which individual isotropic components do not have. The development of these materials requires a promising technique such as reflection photoelasticity to analyze their behaviors in service. Unfortunately, there are few experimental studies based on this technique. Therefore, a hybrid method based on this technique was developed in this research to analyze the fracture behavior of opaque anisotropic materials. The application of this method will help to understand the fracture behaviors of anisotropic materials used in engineering components and structures. The validity of this method was verified by comparison of the results obtained from this method with ones obtained from the hybrid methods for isotropic material on the same isotropic specimen. The reflection type photoelastic experiment for orthotropic materials was then applied to orthotropic plates with a central crack of various inclination angles. Using this hybrid method for anisotropic materials, stress intensity factors and separated stress components were obtained at the vicinity of the crack-tip in orthotropic plates from only the isochromatic fringe patterns of the isotropic coating material.     

Photoelastic modeling of the fracture of viscoelastic orthotropic plates with a crack

The well-known equations of photoelasticity of linear viscoelastic bodies are used to describe the photoelastic behavior of a viscoelastic orthotropic plate with a crack. Expressions for the stress intensity factors (SIFs) at the crack tip are obtained using photoelastic measurements. The time dependence of the SIFs is analyzed and shown to be determined by the angles between directions of the crack and tension     

粘弹性双材料界面裂缝的缝端位移场及动态断裂分析

本文研究的是经常在实际工程中遇到的粘弹性双材料界面裂缝的动断裂问题.由于粘弹性自身的复杂性,使得粘弹性双材料界面裂缝缝端应力的奇异性较弹性呈现出更为复杂的形式,从而使动断裂问题的分析变得更为困难.根据此情况,本文采用复阻尼理论反映粘弹性体的运动规律,用复势理论和平面问题复变函数解答的科洛索夫公式推导了粘弹性双材料界面裂缝缝端位移场及动态应力强度因子的求解公式,利用特解边界元进行了粘弹性双域耦合动力响应计算,按求得的公式用位移外推法计算了单边裂纹板在动荷载作用下的动态应力强度因子.分析了粘性,弹模比和缝长对动态应力强度因子的影响,得出了一些有益的结论.     

Analysis of stress intensity factor in orthotropic bi-material mixed interface crack

Adopting the complex function approach, the paper studies the stress intensity factor in orthotropic bi-material interface cracks under mixed loads. With consideration of the boundary conditions, a new stress function is introduced to transform the problem of bi-material interface crack into a boundary value problem of partial differential equations. Two sets of non-homogeneous linear equations with 16 unknowns are constructed. By solving the equations, the expressions for the real bi-material elastic constant εt and the real stress singularity exponents λt are obtained with the bi-material engineering parameters satisfying certain conditions. By the uniqueness theorem of limit,undetermined coefficients are determined, and thus the bi-material stress intensity factor in mixed cracks is obtained. The bi-material stress intensity factor characterizes features of mixed cracks. When orthotropic bi-materials are of the same material, the degenerate solution to the stress intensity factor in mixed bi-material interface cracks is in complete agreement with the present classic conclusion. The relationship between the bi-material stress intensity factor and the ratio of bi-material shear modulus and the relationship between the bi-material stress intensity factor and the ratio of bi-material Young's modulus are given in the numerical analysis.     

复合材料光弹性分析的近似方法

本文提出了一种用于光弹性复合材料的简化应变——光学定律。按照这一简化定律。模型材料的主应变差和主应变方向只要利用光弹性实验测出的等差线与等倾线即可求得。些是一种正交异性光弹性分析的近似方法,这一方法所得结果与实验数据比较,最大误差在10％左右。由于采用简化应变——光学定律使得正交异性光弹性分析工作大为简便,因此它是一种适合于工程应用的近似方法。     

Singular stress field near interface edge in orthotropic/isotropic bi-materials

Based on the asymptotic fields near the singular points in two-dimensional isotropic and orthotropic elastic materials, the eigenequation as well as the displacement and singular stress fields near the interface edge, with an arbitrary wedge angle for the orthotropic material, in orthotropic/isotropic bi-materials are formulated explicitly. The advantages of the developed approach are that not only the eigenequation is directly given in a simple form, but also the eigenvector is no longer needed for the determination of the asymptotic fields near the interface edge. This approach differs from the known methods where the eigenequation is constantly expressed in terms of a determinant of matrix, and the eigenvector is required for the determination of the asymptotic fields. Therefore, the solution proposed in this paper is more convenient and effective for the analysis of the singular stresses near the interface edge in the orthotropic/isotropic bi-material. To demonstrate the validity of the presented formulae, an example is selected for the comparison of analytical and FEM results. According to the theoretical analyses, the influences of the wedge angle and material constant of the orthotropic material on the singular stresses near the interface edge are discovered clearly. The results obtained may give some references to certain engineering designs such as the structural repair or strengthening.     

A new photoelastic model for studying fatigue crack closure

The photoelastic analysis of crack tip stress intensity factors has been historically developed for use on sharp notches in brittle materials that idealize the cracked structure. This approach, while useful, is not applicable to cases where residual effects of fatigue crack development (e.g., plasticity, surface roughness) affect the applied stress intensity range. A photoelastic model of these fatigue processes has been developed using polycarbonate, which is sufficiently ductile to allow the growth of a fatigue crack. The resultant stress field has been modeled mathematically using the stress potential function approach of Muskhelishvili to predict the stresses near a loaded but closed crack in an elastic body. The model was fitted to full-field photoelastic data using a combination of a generic algorithm and the downhill simplex method. The technique offers a significant advance in the ability to characterize the behavior of fatigue cracks with plasticity-induced closure, and hence to gain new insights into the associated mechanisms.     

Theoretical transient analysis and wave propagation of piezoelectric bi-materials

The transient response of piezoelectric bi-materials subjected to a dynamic anti-plane concentrated force or electric charge with perfectly bonded interface is examined in the present study. The problem is solved by using the Laplace transform method and the inverse Laplace transform is evaluated by means of Cagniard’s method. Exact transient full-field solutions of the contribution for each wave are expressed in explicit closed forms. The transient behavior of field quantities is examined in detail by numerical calculations. The existence condition of a propagating surface wave along the interface is discussed in detail. A surface wave can be guided by the interface of two semi-infinite materials in contact if one, at least, of these two materials is piezoelectric. The propagation velocity of the surface wave is explicitly expressed and is found to be less than the lower shear wave velocity of the two materials. The existence of the surface wave for piezoelectric–piezoelectric bi-materials is restricted to the situation that the shear waves of the two piezoelectric materials are very close. The possibility for the existence of the surface wave for piezoelectric–elastic bi-materials is much greater than that of the piezoelectric–piezoelectric bi-materials.     

Singularities of an interface crack in electrostrictive materials

In the present work, the singularities of an interface crack between two dissimilar electrostrictive materials under electric loads are investigated. Within the framework of two-dimensional deformation, the problem is solved using the complex variable method. Three crack models, that is, permeable, impermeable and conducting crack models are considered individually. Complex potentials and intensity factors of total stresses are derived by considering both the Maxwell stresses in the surrounding space at infinity and inside the crack. It is found that, for the above three crack models, the singularities of total stress are the same as those in traditional bi-materials with an interface crack; however, the intensities of the total stress depend on the actual crack model used.     

Thermal weight functions for bi-material interface crack system using energy principles

In this study, Betti’s reciprocal theorem and the principle of superposition are used to obtain weight functions in a two-dimensional bi-material interface crack system for any loading, in general and thermal loading, in particular. It is shown that the general expression of weight functions for bi-materials interface crack problems is of the same type as that found in a homogeneous mixed mode loading case. Furthermore, a computational approach has been developed for calculation of thermal stress intensity factors for bi-material interface cracks subjected to thermal loading under quasi-static uncoupled thermo-elasticity assumption. The thermal weight function (TWF) expression and computational scheme have been validated using three examples given in the available literature.