I型定常扩展裂纹尖端的弹黏塑性场

考虑材料在扩展裂纹尖端的黏性效应，假设黏性系数与塑性应变率的幂次成反比，对幂硬化材料中平面应变扩展裂纹尖端场进行了弹黏塑性渐近分析，得到了不含间断的连续解，并讨论了I型裂纹数值解的性质随各参数的变化规律. 分析表明应力和应变均具有幂奇异性，并且只有在线性硬化时，尖端场的弹、黏、塑性才可以合理匹配. 对于I型裂纹，裂尖场不含弹性卸载区. 当裂纹扩展速度趋于零时，动态解趋于准静态解，表明准静态解是动态解的特殊形式；如果进一步考虑硬化系数为零的极限情况，便可退化为Hui和Riedel的非线性黏弹性解.     

某抽水蓄能电站地下洞室围岩岩体质量特征分析

考虑材料的黏性效应建立了II型动态扩展裂纹尖端的力学模型,假设黏性 系数与塑性等效应变率的幂次成反比,通过分析使尖端场的弹、黏、塑性得到合理匹配,并 给出边界条件作为扩展裂纹定解的补充条件,对理想塑性材料中平面应变扩展裂纹尖端场进 行了弹黏塑性渐近分析,得到了不含间断的连续解,并讨论了II型裂纹数值解的性质随各参 数的变化规律. 分析表明应力和应变均具有幂奇异性,对于II型裂纹,裂尖场不含弹性卸载 区. 引入Airy应力函数,求得了II型准静态裂纹尖端场的控制方程,并进行了数值分析, 给出了裂纹尖端的应力应变场. 当裂纹扩展速度($M\to 0$)趋于零时,动态解趋 于准静态解,表明准静态解是动态解的特殊形式.     

Ⅱ型动态扩展裂纹尖端的弹黏塑性渐近场

考虑材料的黏性效应建立了Ⅱ型动态扩展裂纹尖端的力学模型,假设黏性系数与塑性等效应变率的幂次成反比,通过分析使尖端场的弹、黏、塑性得到合理匹配,并给出边界条件作为扩展裂纹定解的补充条件,对理想塑性材料中平面应变扩展裂纹尖端场进行了弹黏塑性渐近分析,得到了不含间断的连续解,并讨论了Ⅱ型裂纹数值解的性质随各参数的变化规律.分析表明应力和应变均具有幂奇异性,对于Ⅱ型裂纹,裂尖场不含弹性卸载区.引入Airy应力函数,求得了Ⅱ型准静态裂纹尖端场的控制方程,并进行了数值分析,给出了裂纹尖端的应力应变场.当裂纹扩展速度(M→0)趋于零时,动态解趋于准静态解,表明准静态解是动态解的特殊形式.     

压-剪混合型定常扩展裂纹尖端的弹黏塑性场

假定黏性系数与塑性等效应变率的幂次成反比，考虑其黏性和裂纹面摩擦接触效应 建立了压-剪混合型定常扩展裂纹尖端弹黏塑性场的渐近方程，求得了裂纹尖端场不含应力、应变间 断的数值解. 并讨论了压-剪混合型裂纹数值解随各个参数的变化规律，计算结果 和分析表明，压-剪混合型裂纹尖端场是满塑性的，不含有弹性卸载区，黏性效应是研究扩展裂纹尖端场时的一个重要因素. 无论混合裂纹趋近I型还是趋近II型，静水压力随摩擦系数的增加都是增加的,裂纹面摩擦 效应是阻止裂纹扩展速度的因素，且摩擦作用越强，裂纹尖端场的韧性越高.     

动态裂纹尖端弹粘塑性场的研究

本文利用弹一粘一塑性材料力学模型，对动态扩展裂纹尖端的指数奇异性和对数奇异性进行了渐近分析。文中假定，弹性阶段的粘性效应可以略去，仅在塑性应变中粘性才起作用，对于这种模型，推导出了其率敏感型的本构关系。以Ⅱ型裂纹为例，进一步推导了两种奇异性下裂纹尖端场的渐近微分控制方程，并进行了数值仿真分析。同时讨论了粘性系数α、马赫数M^2对裂纹尖端应力应变场的影响，即，弹粘塑性材料扩展裂纹的奇异性取决于其粘性系数和马赫数，粘性系数较大时，裂纹尖端场具有对数奇异性；粘性系数较小时，裂纹尖端场具有指数奇异性。修正了文献中对数奇异性区域的大小；解释了文献中过渡区的成因；给出了过渡区尖端应力场解的形式，从而建立了裂纹尖端场的统一解。     

蠕变硬化材料中Ⅱ型扩展裂纹尖端场特性研究

采用弹牯塑性力学模型,对蠕变硬化材料中平面应变扩展裂纹尖端场进行了渐近分析.假设人工粘性系数与等效塑性应变率的幂次成反比,通过量级匹配表明应力和应变均具有幂奇异性,奇异性指数由粘性系数中等效塑性应变率的幂指数唯一确定.通过数值计算讨论了Ⅱ型准静态扩展裂纹尖端场的分区构造以及裂纹尖端应力和应变场的特性随各材料参数的变化规律,结果表明裂尖场由材料的粘性和塑性共同主导.当硬化系数为零时裂尖场可退化为相应的HR场.     

稳恒扩展裂纹尖端的弹粘塑性场

采用弹粘塑性力学模型代替通常的弹塑性模型，对于I型和Ⅱ型问题，分别求得了不可压缩材料中平面应变动态扩展裂纹尖端的指数奇异性场和对数奇异性场，消除了弹塑性解中存在的塑性激波。通过数值计算，分别求得了两种奇异属性的分界线，建立起统一的裂纹尖端奇异性场。     

裂纹面摩擦接触引起的断裂韧性增长的研究

采用弹黏塑性的材料本构关系, 建立了压、剪混合型裂纹常速准静 态扩展的力学模型, 求得了裂纹面摩擦接触条件下裂纹尖端场的数值解, 并基于数 值结果讨论了扩展裂纹的摩擦效应. 计算和分析表明, 裂纹面的摩擦效应主要表现 在两个方面. 第一方面是摩擦会导致裂纹尖端区材料的断裂韧性增高, 并且裂纹面间的摩擦作用越强, 增韧效果越显著. 摩擦增韧的机制可以解释为裂纹 面间的摩擦作用导致裂纹尖端塑性区尺寸变大, 使裂纹尖端场的塑性变形能增加, 从而使得裂纹尖端区材料增韧. 摩擦生热并不是导致材料断裂韧性增长的根本机制. 第二方面是摩擦会导致``断裂延缓'. 利用裂纹面的摩擦来提高构件的承载能力和延长构件的服役寿命具有较大的工程实用价值.     

压剪载荷作用下界面裂纹尖端场的研究

建立了弹性-幂律蠕变双材料界面裂纹准静态扩展的力学模型，求得了裂纹尖端应力、应变和位移场分离变量形式的解及其数值结果；讨论了材料性能参数对裂纹尖端场的影响；计算和分析了界面裂纹的摩擦效应，并且得出了给定条件下裂尖场的轮廓图形．     

蠕变材料Ⅰ型动态扩展裂纹尖端场

为了研究黏性效应作用下的动态扩展裂纹尖端渐近场，建立了蠕变材料Ⅰ型动态扩展裂纹的 力学模型.首先，依据在稳态蠕变阶段，弹性变形和黏性变形同时在裂纹尖端场中占主导地 位，由量级协调可知，应力和应变具有相同的奇异量级，即(σ,ε)∝/ r- 1/(n-1). 其次，通过渐近分析推导出动态扩展裂纹尖端场的控制方程并求得了裂纹尖端应 力、应变和位移分离变量形式的渐近解.最后，采用双参数打靶法求得了裂纹尖端应力、应 变的数值结果.数值计算表明，裂尖场主要受材料的蠕变指数n和马赫数M的控制；在Ⅰ 型动态扩展裂纹前方，环向应变达到最大值，可据此建立断裂准则. 由于裂纹稳定扩展与非稳定扩展的主奇异项相同，因此对于稳定扩展裂纹的渐近分析方 法，同样适用于非稳定的裂纹扩展问题.     

Steady-state growing crack-tip field characteristics of mode Ⅲ elastic-viscoplastic/rigid interface cracks

The existence of viscosity effect at the interface of double dissimilar materials has an important impact on the distribution of the interface crack-tip field and the properties variety of the interface itself. The singularity and viscosity are considered in the crack-tip. The elastic-viscoplastic governing equations of double dissimilar materials at the interface crack-tip field are established. The displacement potential function and boundary condition of interface crack-tip are introduced. The numerical analysis of elastic-viscoplastic/rigid interface for mode Ⅲ is worked out. The stress-strain fields are obtained at the crack-tip and the variation rules of solutions are discussed according to each parameter. The numerical results show that the viscosity effect is a main factor of the interface propagating in the crack-tip field, and the interface crack-tip is a viscoplastic field governed by the viscosity coefficient, Mach number (Ma), and singularity exponent.     

双材料界面裂纹复应力强度因子的正则化边界元法

双材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性, 许多用于表征经典平方根($r^{1/2})$和负平方根($r^{-1/2})$渐近物理场的传统数值方法失效, 给界面裂纹复应力强度因子($K_{1} +{i}K_{2} )$的精确求解增加了难度. 引入一种含有复振荡因子的新型"特殊裂尖单元", 可精确表征裂纹尖端渐近位移和应力场的振荡特性, 在避免裂尖区域高密度网格剖分的情况下, 可实现双材料界面裂纹复应力强度因子的精确求解. 此外, 结合边界元法中计算近奇异积分的正则化算法, 成功求解了大尺寸比(超薄)双材料界面裂纹的断裂力学参数. 数值算例表明, 所提算法稳定, 效率高, 在不增加计算量的前提下, 显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性.      

双材料界面裂纹的改进广义有限差分法

采用数值方法进行断裂力学分析时,裂纹尖端奇异区域处理的好坏直接关系到最终断裂力学参数的求解精度。与传统均匀介质不同,复合材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性,许多用于表征经典的平方根和负平方根物理场渐近性的传统方法也因此失效。论文提出了一种改进的广义有限差分法,该方法基于多元函数泰勒级数展开和移动最小二乘法的思想,将节点变量的各阶导数由相邻点集函数的加权线性累加来近似,具有无网格、无数值积分、数据准备简单、稀疏矩阵快速求解等优点。为提高该方法求解断裂力学问题的计算精度和数值稳定性,论文引入了裂尖奇异区域局部点簇的自动创建技术和一种基于局部点簇几何尺寸的矩阵正则化算法。数值算例表明,所提算法稳定,效率高,在不增加计算量的前提下,显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性。     

Stress field near interface crack tip of double dissimilar orthotropic composite materials

In this paper, double dissimilar orthotropic composite materials interfacial crack is studied by constructing new stress functions and employing the method of composite material complex. When the characteristic equations＇ discriminants △1 〉 0 and △2 〉0, the theoretical formula of the stress field and the displacement field near the mode I interface crack tip are derived, indicating that there is no oscillation and interembedding between the interfaces of the crack.     

On the crack-tip stress singularity of interfacial cracks in transversely isotropic piezoelectric bimaterials

In this paper, characteristics of the interface crack-tip stress and electric displacement fields in transversely isotropic piezoelectric bimaterials are studied. The authors have proven, within the framework of the generalized Stroh formalism for piezoelectric bimaterials, that there is no coexistence of the parameters (oscillating) and κ (non-oscillating) in the interface crack-tip generalized stress field for all transversely isotropic piezoelectric bimaterials. This leads to the classification of piezoelectric bimaterials into one group that exhibits the oscillating property in the interface crack-tip generalized stress field and the other that does not. Fifteen (15) pair-combinations of six (6) piezoelectric materials PZT-4, PZT-5H, PZT-6B, PZT-7A, P-7, and BaTiO₃, which are commonly used in practice, are numerically analyzed in this study, and the results backup the above theoretical conclusions. Moreover, the associated eigenvectors for such material systems (with either =0 or κ=0) are also obtained numerically, and the result show that there still exist four linear independent associate eigenvectors for each bimaterial.     

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the interface crack tip for mode Ⅱ of double dissimilar orthotropic composite materials are studied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized bi-harmonic equations,the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions,a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about himaterial engineering parameters. According to the uniqueness theorem of limit,both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same,the stress singularity exponents,stress intensity factors and stresses for mode Ⅱ crack of the orthotropic single material are obtained.     

Crack propagation along the interface of piezoelectric bimaterial

This paper is concerned with the propagation of a crack along the interface of a piezoelectric bimaterial, which can travel at subsonic or intersonic speed. The inertial effects are taken into account while the static approximation is applied to the electric fields. The effect of piezoelectricity on the asymptotic crack-tip field is discussed for an interface crack propagating subsonically and intersonically. An alternative method is used to avoid solving for the eigenvectors. This paper provides a unified method to analyze the crack-tip field of a crack propagating along a piezoelectric bimaterial interface.     

Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials

Plane thermoelasticity solutions are presented for the problem of a crack in bonded materials with a graded interfacial zone. The interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermoelastic moduli between dissimilar, homogeneous half-planes. The crack is assumed to exist in one of the half-planes at an arbitrary angle to the graded interfacial zone, disturbing uniform steady-state heat flows. The Fourier integral transform method is employed in conjunction with the coordinate transformations of field variables in the basic thermoelasticity equations. Formulation of the current nonisothermal crack problem lends itself to the derivation of two sets of Cauchy-type singular integral equations for heat conduction and thermal stress analyses. The heat-flux intensity factors and the thermal-stress intensity factors are defined and evaluated in order to quantify the singular characters of temperature gradients and thermal stresses, respectively, in the near-tip region. Numerical results include the variations of such crack-tip field intensity factors versus the crack orientation angle for various combinations of material and geometric parameters of the dissimilar media bonded through the thermoelastically graded interfacial zone. The dependence of the near-tip thermoelastic singular field on the degree of crack-surface partial insulation is also addressed.     

Singular stress field near the edge of interface of bonded dissimilar materials with an interlayer

For bonded dissimilar materials, the free-edge stress singularity usually prevails near the intersection of the free-surface and the interface. When two materials are bonded by using an adhesive, an interlayer develops between the two bonded materials. When a ceramic and a metal are bonded, the residual stress develops because of difference in the coefficient of thermal expansion. An interlayer may be inserted between the two materials to defuse the residual stress. Stress field near the intersection of the interface and free-surface in the presence of the interlayer is then very important for evaluating the strength of bonded dissimilar materials.In this study, stress distributions on the interface of bonded dissimilar materials with an interlayer were calculated by using the boundary element method to investigate the effect of the interlayer on the stress distribution. The relation between the free-edge singular stress fields of bonded dissimilar materials with and without an interlayer was investigated numerically. It was found that the influence of the interlayer on the stress distributions was confined within a small area of the order of interlayer thickness around the intersection of the interface and the free-surface when the interlayer was very thin. The stress distribution near the intersection of the interface and the free-surface was controlled by the free-edge stress singularity of the bonded dissimilar materials without the interlayer. In this case, the interlayer can be called free-edge singularity-controlled interlayer. If a stress distribution on the interface is known for one thickness of an interlayer h, stress distributions on the interface for other values of h can be estimated.     

双材料界面端附近的奇异应力场

本文利用弹性力学中的Ｇｏｕｒｓａｔ公式，具体地给出了具有任意接合角的异材界面端附近的奇异应力场和位移场；所得到的关于应力奇异性次数的特征方程，与Ｂｏｇｙ利用Ｍｅｌｌｉｎ变换求得的结果完全一致。本文的结果还表明：材料常数对接合材料力学性能的影响可只用两个组合参数来描述。