三维双材料结构的应力奇异性分析

应用有限单元法子模型技术，对具有不同界面角的三维双材料结构的应力奇异性进行了分析。结果表明，应用子模型技术估算三维双材料结构的应力奇异性指数是有效的。然后分析了界面端线和界面端点处附近奇异性指数，得到了一些重要而有趣的结果。最后对消除三维双材料结构应力奇异性的几何条件进行了讨论。     

影响双材料界面端三维应力奇异性的几何因素研究

应用常规有限单元分析技术,对几种典型接头形式的三维双材料结构界面端点附近应力奇异性进行了研究,重点分析了棱角(两自由平面的夹角)大小对界面端点附近应力奇异性指数的影响。数值分析结果表明:棱角大小对界面端应力奇异性指数有明显影响,棱角越大,奇异性指数越小;当棱角趋于180°时,端点附近的应力奇异性指数收敛于界面端线上的值(等于平面应变条件下的理论值)。研究发现,如果采用圆弧对三维双材料结构的棱边进行倒角,使相应的界面端线变成光滑连续曲线,则原界面端点附近的应力奇异性会完全退化为界面端线附近的应力奇异性,即界面端点独特的应力奇异性现象消失。     

双材料板条的界面应力问题─温度沿板厚呈线性分布的情况

本文给出双材料板条结构的Ｓｕｈｉｒ界面应力微分方程一般解，进而求解了温度沿板厚呈线性分布时因异材失配引起的界面剪应力和剥离应力，此解包含了均匀升温情况下的Ｓｕｈｉｒ解。     

各向同性材料接头和界面相交裂纹应力奇异性特征分析

提出了用插值矩阵法分析各向同性材料接头以及与界面相交的平面裂纹应力奇异性。基于接头和裂纹端部附近区域位移场渐近展开,将位移场的渐近展开式的典型项代入线弹性力学基本方程,得到关于平面内各向同性材料接头以及与两相材料界面相交裂纹应力奇异性指数的一组非线性常微分方程的特征值问题,运用插值矩阵法求解,获得了两相材料平面接头端部应力奇异性指数以及与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律,数值计算结果与已有结果比较表明,本文方法具有很高的精度和效率。     

双材料板条的界面应力问题——温度沿板厚呈线性分布的情况

本文给出双材料板条结构的Ｓｕｈｉｒ界面应力微分方程一般解，进而求解了温度沿板呈线性分时因异材料失配引起的界面剪应力和剥离应力。此解包含了均匀升温情况下的Ｓｕｈｉｒ解。     

插值矩阵法分析与复合材料界面相交的平面裂纹奇异应力场

提出了用插值矩阵法分析与各向异性材料界面相交的平面裂纹应力奇异性。基于V形切口尖端附近区域位移场渐近展开,将位移场的渐近展开式的典型项代入线弹性力学基本方程,得到关于平面内与复合材料界面相交的裂纹应力奇异性指数的一组非线性常微分方程的特征值问题,运用插值矩阵法求解,获得了平面内各向异性结合材料中与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律,数值计算结果与已有结果比较表明,本文方法具有很高的精度和效率。     

轴对称界面端的扭转问题

基于弹性力学轴对称扭转问题的通解,研究了具有任意几何形状的双材料轴对称界面端,给出了界面端的应力奇异性及其附近的位移场和奇应力场,定义了扭转问题的Ｄｕｎｄｕｒｓ双材料参数。研究结果表明,应力奇异性只与界面端的结合角和扭转问题的Ｄｕｎｄｕｒｓ双材料参数有关,而与界面的角度以及界面端与对称轴之间的距离无关,在任何情况下,特征值均为实数,不会产生振荡应力奇异性。     

梯度材料二维轴对称问题的弹性解析解

为了研究梯度材料在静荷载下的响应,首先推导出极坐标下轴对称问题的相容方程;再通过选取特殊的应力函数和弹性模量简化该方程,得到了弹性模量呈幂函数形式分布的梯度圆环内、外受均布压力问题的弹性解;在此基础上,引入接触条件,推得均布荷载下双层梯度圆筒和具有梯度界面层的双材料圆筒的弹性解;最后对各解析解进行了算例分析。分析结果表明:对于双层梯度圆筒,材料的梯度分布不改变其应力正负,并能使筒内应力分布更均匀,缓解应力集中;但对于具有梯度界面层的双材料圆筒,并非梯度层厚度越大应力状态越理想,也存在周向正应力虽然更加平均,最大应力值却有所提升的情况。     

考虑尺寸效应的双材料轴对称界面端应力奇异性

提出了一种分析双材料轴对称界面端的应力奇异行为的特征值法.基于弹性力学空间轴对称问题的基本方程和一阶近似假设,利用分离变量形式的位移函数和无网格算法,导出了关于应力奇异性指数的离散形式的奇异性特征方程.由奇异性特征方程的特征值和特征向量,即可确定应力奇异性指数、位移角函数和应力角函数.数值求解了纤维/基体轴对称界面端模型的奇异性特征方程, 结果表明:尺寸效应参数δ(奇异点与轴对称轴的距离和应力奇异性支配区域大小的比值)影响着应力奇异性的强弱与阶次, 准一阶近似解析解只是δ>>1时的一个特例.      

弹塑性双材料界面裂纹的渐近分析

本文通过精确的数学分析,对于遵循塑性形变理论的幂硬化材料界面裂纹,求得了裂纹面面力自由和裂纹面无摩擦接触两种情况下的分离变量形式的全连续HRR 型奇性渐近解,这种全连续的奇性渐近解只对特殊的混合参数M'才存在.对任意指定的混合参数M',我们进一步求得了含弱间断的分离变量形式的HRR 型奇性渐近解(?)我们得到的所有解均保证了界面处的面力连续条件和位移连续条件,且不出现弹性双材料界面裂纹问题中所常见的应力振荡奇性和裂纹面相互嵌入的不合理现象.     

异弹模界面裂缝的动态实验研究

本文利用电测法测量异弹模界面裂缝缝端的应力,进而推算出动态应力强度因子,并与特解边界元的计算结果作了比较,结果表明,两者的一致性较好.     

异质双材料粘接梁的界面端部应力及端部龟裂破坏的实验应力分析

本文采用了高灵敏度的云纹干涉法对异质双材料粘接梁在弯曲载荷作用下的位移进行了测量，用局部杂交法对界面端部区域的应变和应力进行了计算。通过对该区域内的实验应力分析发现：拉应力σｘ是影响结构强度的关键因素。本文还对在基体材料表面近角点区域可能出现的龟裂破坏的原因进行了分析。     

Fracture-mechanical assessment of electrically permeable interface cracks in piezoelectric bimaterials by consideration of various contact zone models

Summary An interface crack with an artificial contact zone at the right-hand side crack tip between two piezoelectric semi-infinite half-planes is considered under remote mixed-mode loading. Assuming the stresses, strains and displacements are independent of the coordinate x ₂, the expression for the displacement jumps and stresses along the interface are found via a sectionally holomorphic vector function. For piezoceramics of the symmetry class 6 mm and for electrically permeable crack faces, the problem is reduced to a combined Dirichlet-Riemann boundary value problem which can be solved analytically. Further, analytical expressions for the stresses, electrical displacements, derivatives of elastic displacement jumps, stress and electrical intensity factors are found at the interface. Real contact zone lengths and the well-known oscillating solution are derived from the obtained solution as well. Analytical relationships between the fracture-mechanical parameters of various models are found, and recommendations are suggested concerning the application of numerical methods to the problem of an interface crack in the discontinuity area of a piezoelectric bimaterial. Received 16 March 1999; accepted for publication 31 May 1999     

Dynamic crack kinking from a PMMA/Homalite interface

The behavior of a pre-existing, dynamically loaded, interfacial crack kinking away from the interface separating two materials was experimentally investigated under dynamic loading conditions. Dynamic fracture experiments were performed on pre-cracked bimaterial panels of PMMA bonded with Homalite-100 impact loaded using a high-speed gas gun. By varying the location of impact, a large range of mixed mode loading at the crack tip was produced. Information about the stress state surrounding the crack tip was obtained through use of the lateral shearing interferometer of coherent gradient sensing in conjunction with high-speed photography. The high-speed interferogram corresponding, to the time of crack initiation was analyzed in each case to find the preinitiation mode mixity at the crack tip. Measurement of both the local initiation mode mixity and the crack kink angle allows for possible extension of existing quasi-static interface crack kinking criteria, such as maximum opening stress or maximum energy release rate, to the case of dynamic loading. It was found that for bimaterial systems with small material property mismatch, such as the PMMA/Homalite system, the maximum opening stress criterion accurately predicts the relation between crack tip mode mixity and resulting kink angle for small initial crack kinking speeds.     

ASYMPTOTIC ANALYSIS OF MODE Ⅱ STATIONARY GROWTH CRACK ON ELASTIC-ELASTIC POWER LAW CREEPING BIMATERIAL INTERFACE

A mechanical model was established for mode Ⅱ interfacial crack static growing along an elastic-elastic power law creeping bimaterial interface. For two kinds of boundary conditions on crack faces, traction free and frictional contact, asymptotic solutions of the stress and strain near tip-crack were given. Results derived indicate that the stress and strain have the same singularity, there is not the oscillatory singularity in the field; the creep power-hardening index n and the ratio of Young' s module notably influence the cracktip field in region of elastic power law creeping material and n only influences distribution of stresses and strains in region of elastic material. When n is bigger, the creeping deformation is dominant and stress fields become steady, which does not change with n.Poisson ' s ratio does not affect the distributing of the crack- tip field.     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

THE ANALYSIS OF INTERLAMINAR STRESSES FOR COMPOSITE LAMINATED SHALLOW SHELLS WITH INTERFACIAL DAMAGE

Based on the general six-degrees-of-freedom plate theory towards the accurate stress analysis and nonlinear theory of shallow shells, considering the damage effect of the interlaminar interface and using the variation principle, the three-dimensional non-linear equilibrium differential equations of the laminated shallow shells with interfacial damage are derived. Then, considering a simply supported laminated shallow shell with damage and under normal load, an analytical solution is presented by using finite difference method to obtain the interlaminar stresses. Numerical results show, the stiffness of the shell is weakened, greater absolute values of displacements as well as smaller interlaminar stresses are obtained by interfacial damage. When the interfacial damage is further increased, delamination occurs obviously under normal pulling load and pure shear slip occurs under normal pressure load. The portion of the load undertaken by the two sides of the interface is more different. Different mechanical behaviors are shown in both sides of the interface, and the discontinuation of stresses and displacements takes place in the interface.     

A crack perpendicular to and terminating at a bimaterial interface

Using dislocation simulation approach, the basic equation for a finite crack perpendicular to and terminating at a bimaterial interface is formulated. A novel expansion method is proposed for solving the problem. The complete solution to the problem, including the explicit formulae for theT stresses ahead of the crack tip and the stress intensity factors are presented. The stress field characteristics are analysed in detail. It is found that normal stresses {ie27-1} and {ie27-2} ahead of the crack tip, are characterised byQ fields if the crack is within a stiff material and the parameters |p _T | and |q _T | are very small, whereQ is a generalised stress intensity factor for a crack normal to and terminating at the interface. If the crack is within a weak material, the normal stresses {ie27-3} and {ie27-4} are dominated by theQ field plusT stress. This work was supported by the Swedish Research Council for Engineering Sciences.     

Asymptotic fields in the finite element analysis of electrically permeable interface cracks in piezoelectric bimaterials

Summary The interface crack problem for a piezoelectric bimaterial based on permeable conditions is studied numerically. To find the singular electromechanical field at the crack tip, an asymptotic solution is derived in connection with the conventional finite element method. For mechanical and electrical loads, the complex stress intensity factor for an interface crack is obtained. The influence of the applied loads on the electromechanical fields near the crack tip is also studied. For a particular case of a short crack with respect to the bimaterial size, the numerical results are compared with the exact analytical solutions, obtained for a piezoelectric bimaterial plane with an interface crack.One author (V.G.) gratefully acknowledges the support provided by the Alexander von Humboldt Foundation of Germany.accepted for publication 7 June 2004