基于DIC方法的残余应力快速测量系统

结合数字图像相关(Digital Image Correlation,DIC)方法与钻孔法,开发了残余应力快速测量系统。该系统可分为两部分:适用于现场测量的便携式机械系统与针对残余应力测量而改进的基于DIC算法的程序。在四点弯曲加载平台上对工件进行载荷释放前后的残余应力测量试验,通过与应变片测量结果进行对比,该残余应力测量系统的精度达到了应变片测量的同等精度。同时,该测量系统解决了传统应变片测量系统对心误差大、操作繁琐、效率低和测量结果稳定性差等问题,具有较高的工程应用价值。     

Validation of Mechanical Strain Relaxation Methods for Stress Measurement

Most validation studies of mechanical strain relaxation (MSR) methods for residual stress measurement rely on using the saw-tooth residual stress distribution resulting from four point bending and elastic–plastic deformation. Validation studies using simple applied stress profiles in rectangular steel beams are used in this work, together with beams subjected to elastic–plastic bending. Two MSR methods are explored, deep-hole drilling (DHD) and incremental centre hole drilling (ICHD). As well as a series of experiments, finite element analyses are conducted to determine the accuracy in the inversion of measured deformation to reconstruct stress. The validation tests demonstrated that apart from the applied stresses, the initial residual stresses also contribute even when samples are expected to be stress free. The uncertainty in measurement for the two MSR methods is determined, with the uncertainty in near surface measurement found to be significantly larger than uncertainty for interior measurement. In simple loading cases (and simple stress profiles) the uncertainty in measurement and hence the degree of validation is shown to be within about ±50 MPa for steel for “known” stress up to about 140 MPa. However, if the residual stress distribution is more complex there arises increased uncertainty in the predicted residual stress and lack of confidence between measurements methods.     

正交异性动态光弹性方法的几个基本问题的研究

文章对适用于动态研究的正交异性光弹性复合材料进行了分析，详细说明了光弹性复合材料中残余双折射的确定方法；基于静态下Ｈｙｅｒ和Ｌｉｕ应力－光性定律，提出了正交异性动态应力－光性定律，并对正交异性材料的动态力学参数及动态光弹性常数给出了实用的标定方法；最后，利用三个单轴压缩试件（０°，９０°及４５°），采用动态应变测量方法，证实了单轴应力状态下正交异性动态应力－光性定律的正确性。     

A fully automatic stress-analysis system by using electro-optic modulation

This paper presents a new system for stress analysis, electro-optic modulation. The optical retardation resulting from stress is compensated for by induced birefringence in an electro-optic crystal under an applied voltage. When the compensation is complete the modulation signal changes, which signals that the measurement is complete. The sensitivity of measurement is higher than for other methods, easily less than /10000.In order to accomplish an automatic process, the author also presents a set of magneto-optic equipment which is designed to rotate the direction of principal stress around the optical axis of the system. This process is automatic and does not require a large complex mechanical drive.     

利用分形相关法测量股骨头剖开面的面内位移

由于股骨头内松质骨结构的复杂性,对股骨头内骨小梁的应力和变形的分析与测试十分困难。在已经开展的这一方面的研究工作中主要是进行松质骨试样的宏观力学性能测试。随着计算机和图像技术的发展,图像及图像相关方法开始被用来进行松质骨的生物力学研究,这是非接触的测量方法,可以用来测量松质骨的表面位移场。本文利用图像相关方法在宏观尺度下测量了股骨头受外力作用时冠状面的面内的位移分布,作为进一步探索的开端。尽管松质骨表面的凹凸不平性对测量精度有影响,但是,还是可以分析出面内位移的分布特点。     

Dynamic fracture behavior of a cracked piezoelectric half space under anti-plane mechanical and in-plane electric impact

Summary  The dynamic response of a cracked piezoelectric half-space under anti-plane mechanical and in-plane electric impacting loads is investigated in the present paper. In the study, the crack is assumed parallel to the free surface of the half-space. Laplace and Fourier transforms are used to reduce the mixed boundary value problems to Cauchy-type singular integral equations in the Laplace transform domain, which are solved numerically. Then, a numerical Laplace inversion is performed and the dynamic stress and electric displacement factors are obtained as functions of time and geometry parameters. The dynamic energy release rate is derived for piezoelectric materials in terms of the electroelastic intensities and is displayed graphically. Received 5 January 2000; accepted for publication 28 June 2000     

Transient response of an insulating crack between dissimilar piezoelectric layers under mechanical and electrical impacts

Summary  The dynamic response of an interface crack between two dissimilar piezoelectric layers subjected to mechanical and electrical impacts is investigated under the boundary condition of electrical insulation on the crack surface by using the integral transform and the Cauchy singular integral equation methods. The dynamic stress intensity factors, the dynamic electrical displacement intensity factor, and the dynamic energy release rate (DERR) are determined. The numerical calculation of the mode-I plane problem indicates that the DERR is more liable to be the token of the crack growth when an electrical load is applied. The dynamic response shows a significant dependence on the loading mode, the material combination parameters as well as the crack configuration. Under a given loading mode and a specified crack configuration, the DERR of an interface crack between piezoelectric media may be decreased or increased by adjusting the material combination parameters. It is also found that the intrinsic mechanical-electrical coupling plays a more significant role in the dynamic fracture response of in-plane problems than that in anti-plane problems. Received 4 September 2001; accepted for publication 23 July 2002 The work was supported by the National Natural Science Foundation under Grant Number 19891180, the Fundamental Research Foundation of Tsinghua University, and the Education Ministry of China.     

Multiple parallel cracks interaction problem inpiezoelectric ceramics

This paper has two goals. First, we propose the pseudo-traction–electric displacementmethod for solving the interaction problem of multiple parallel cracks in transversely isotropicpiezoelectric ceramics. Second, we present a fundamental understanding for the role that theelectric displacement loading plays in the interaction problem. Detailed comparisons between theresults under the compound mechanical–electric loading conditions and those derived underpurely mechanical loading conditions are performed. It is shown that the mechanical fractureparameters such as the stress intensity factors are no longer independent of the electric loading asthey would be in single crack problems. Quite contrary, the electric displacement loading has asignificant influence on the stress intensity factors, the total potential energy release rate and themechanical strain energy release rate. This important conclusion is mainly due to the interactioneffect, i.e., one of the multiple cracks releases the stresses and disturbs the electric fields near theother crack. It is also found that there are some special relative locations for the multiple parallelcracks at which the electric displacement loading has no effect on the Mode I stress intensityfactor. However, the mechanical strain energy release rate has no such a property.     

Stress Monitoring of Post-processed MEMS Silicon Microbridge Structures Using Raman Spectroscopy

Inherent residual stresses during material deposition can have profound effects on the functionality and reliability of fabricated Micro-Electro-Mechanical Systems (MEMS) devices. Residual stress often causes device failure due to curling, buckling, or fracture. Typically, the material properties of thin films used in surface micromachining are not well controlled during deposition. The residual stress; for example, tends to vary significantly for different deposition methods. Currently, few nondestructive techniques are available to measure residual stress in MEMS devices prior to the final release etch. In this research, micro-Raman spectroscopy is used to measure the residual stresses in polysilicon MEMS microbridge devices. This measurement technique was selected since it is nondestructive, fast, and provides the potential for in-situ stress monitoring. Raman spectroscopy residual stress profiles on unreleased and released MEMS microbridge beams are compared to analytical and FEM models to assess the viability of micro-Raman spectroscopy as an in-situ stress measurement technique. Raman spectroscopy was used during post-processing phosphorus ion implants on unreleased MEMS devices to investigate and monitor residual stress levels at key points during the post-processing sequences. As observed through Raman stress profiles and verified using on-chip test structures, the post-processing implants and accompanying anneals resulted in residual stress relaxation of over 90%.     

On the driving force for crack growth during thermal actuation of shape memory alloys

The effect of thermomechanically induced phase transformation on the driving force for crack growth in polycrystalline shape memory alloys is analyzed in an infinite center-cracked plate subjected to a thermal actuation cycle under mechanical load in plain strain. Finite element calculations are carried out to determine the mechanical fields near the static crack and the crack-tip energy release rate using the virtual crack closure technique. A substantial increase of the energy release rate – an order of magnitude for some material systems – is observed during the thermal cycle due to the stress redistribution induced by large scale phase transformation. Thus, phase transformation occurring due to thermal variations under mechanical load may result in crack growth if the crack-tip energy release rate reaches a material specific critical value.     

Curved thermal crack growth in nonhomogeneous materials with different shaped external boundaries II. Experimental results

Curved thermal cracks are considered running along special principal stress trajectories in self-stressed two-phase solids with different cross sections. The resulting mixed boundary-value problems of the stationary plane thermoelasticity are solved by applying the finite element method. Moreover, using appropriate directional criteria established for crack path prediction, the further extension of thermal cracks starting at the external surfaces of different shaped two-phase solids has been determined. Furthermore, the corresponding fracture mechanical data like crack edge displacements, strain energy release rates and stress intensity factors, respectively, have been calculated. Finally, the theoretical investigations given in part I of the paper are compared with experiments using differing optical methods of the experimental stress analysis. The experimental results reported in part II of the paper and the theoretical calculations show a reasonable agreement.     

A review on stress determination and control in metal-based additive manufacturing

Metal additive manufacturing (MAM) is an emerging and disruptive technology that builds three-dimensional (3D) components by adding layer-upon-layer of metallic materials. The complex cyclic thermal history and highly localized energy can produce large temperature gradients, which will, in turn, lead to compressive and tensile stress during the MAM process and eventually result in residual stress. Being an issue of great concern, residual stress, which can cause distortion, delamination, cracking, etc., is considered a key mechanical quantity that affects the manufacturing quality and service performance of MAM parts. In this review paper, the ongoing work in the field of residual stress determination and control for MAM is described with a particular emphasis on the experimental measurement/control methods and numerical models. We also provide insight on what still requires to be achieved and the research opportunities and challenges.     

Residual stress measurement for injection molded components

Residual stress induced during manufacturing of injection molded components such as polymethyl methacrylate(PMMA) affects the mechanical and optical properties of these components. These residual stresses can be visualized and quantified by measuring their birefringence. In this paper, a low birefringence polariscope(LBP) is used to measure the whole-field residual stress distribution of these injection molded specimens. Detailed analytical and experimental study is conducted to quantify the residual stress measurement in these materials. A commercial birefringence measurement system was used to validate the results obtained to our measurement system. This study can help in material diagnosis for quality and manufacturing purpose and be useful for understanding of residual stress in imaging or other applications.     

基于FIB的微观变形载体制作技术研究及应用

变形载体包括光栅、散斑和标记点等,是光学变形测量时的重要载体,关系到测试的成败.基于聚焦离子束(FIB)微加工平台和技术,介绍了微观变形载体的设计、制作方法、程序等要点,并且利用FIB刻蚀微型孔、槽等实现材料表面微观残余应力的测量.分析和讨论了FIB制作变形载体对原有结构的影响和由此引起的残余应力测试误差.结果表明,FIB刻蚀作为一种新型的直写微纳米加工技术,结合高倍显微镜对视场的切换,可以在关键微区准确定位,并制作变形载体和实现变形测量,尤其对残余应力的测量特别有效.     

The use of a virtual configuration in formulating constitutive equations for residually stressed elastic materials

Residual stress is the stress present in the unloaded equilibrium configuration of a body. Because residual stresses can significantly affect the mechanical behavior of a component, the measurement of these stresses and the prediction of their effect on mechanical behavior are important objectives in many engineering problems. Common methods for the measurement of residual stresses include various destructive experiments in which the body is cut to relieve the residual stress. The resulting strain is measured and used to approximate the original residual stress in the intact body. In order to predict the mechanical behavior of a residually stressed body, a constitutive model is required that includes the influence of the residual stress.In this paper we present a method by which the data obtained from standard destructive experiments can be used to derive constitutive equations that describe the mechanical behavior of elastic residually stressed bodies. The derivation is based on the idea that for each infinitesimal neighborhood in a residually stressed body, there exists a corresponding stress free configuration. We refer to this stress free configuration as the virtual configuration of the infinitesimal neighborhood. The derivation requires that the constitutive equation for the stress free material be known and invertible; it is used to relate the residual stress to the deformation of the virtual configuration into the residually stressed configuration. Although the concept of the virtual configuration is central to the derivation, the geometry of this configuration need not be determined explicitly, and it need not be achievable experimentally, in order to construct the constitutive equation for the residually stressed body.The general mathematical forms of constitutive equations valid for residually stressed elastic materials have been derived previously for a number of cases. These general forms contain numerous unknown material-response functions or material constants that must be determined experimentally. In contrast, the method presented here results in a constitutive equation that is an explicit function of residual stress and includes only the material parameters required to describe the stress free material.After presenting the method for the derivation of constitutive equations, we explore the relationship between destructive experiments and the theory used in the derivation. Specifically, we discuss the use of the theory to improve the design of destructive experiments, and the use of destructive experiments to obtain the data required to construct the constitutive equation for a particular material.     

On mechano-chemical Calcium waves

The influence of mechano-chemical coupling on calcium concentration waves is considered. The propagation of calcium waves is described by a reaction–diffusion equation with the reaction term dependent on the mechanical stress responsible for the release of calcium. Similarly the balance of mechanical forces is influenced by the calcium concentration through the so-called traction force.     

Mechanical properties of ultrananocrystalline diamond thin films relevant to MEMS/NEMS devices

The mechanical properties of ultrananocrystalline diamond (UNCD) thin films were measured using microcantilever deflection and membrane deflection techniques. Bending tests on several free-standing UNCD cantilevers, 0.5 μm thick, 20 μm wide and 80 μm long, yielded elastic modulus values of 916–959 GPa. The tests showed good reproducibility by repeated testing on the same cantilever and by testing several cantilevers of different lengths. The largest source of error in the method was accurate measurement of film thickness. Elastic modulus measurements performed with the novel membrane deflection experiment (MDE), developed by Espinosa and co-workers, gave results similar to those from the microcantilever-based tests. Tests were performed on UNCD specimens grown by both micro and nano wafer-seeding techniques. The elastic modulus was measured to be between 930–970 GPa for the microseeding and between 945–963 GPa for the nanoseeding technique. The MDE test also provided the fracture strength, which for UNCD was found to vary from 0.89 to 2.42 GPa for the microseeded samples and from 3.95 to 5.03 for the nanoseeded samples. The narrowing of the elastic modulus variation and major increase in fracture strength is believed to result from a reduction in surface roughness, less stress concentration, when employing the nanoseeding technique. Although both methods yielded reliable values of elastic modulus, the MDE was found to be more versatile since it yielded additional information about the structure and material properties, such as strength and initial stress state.     

A magnetic method for the determination of residual stress

A magnetic method for the measurement of residual longitudinal stress in the outer portions of cylindrical bars is developed and applied to nickel and steel. It involves measurement of the reversible effective permeability over a range of frequency of the applied alternating field. Special composites specimens, in which any desired level of residual stress can be produced, serve as idealized test specimens. Magnetic stress measurements made on cold-drawn, machined and quenched rods are compared with measurements by X-ray diffraction and mechanical relaxation (slitting). A combination of magnetic and X-ray measurements yields qualitative information about the stress gradient in the outer portion of a bar. A rapid magnetic-test method, suitable for practical application, is described.     

喷丸镍基合金材料微区残余应力的切槽法测量研究

本文结合聚焦离子束-电子束(Focused ion beam-electron beam,简称FIB-EB)双束系统和真空镀膜工艺,进行微区散斑的制备工艺研究,并将所发展的微散斑制备工艺应用于喷丸镍基合金材料表面制斑,进而结合切槽法进行残余应力高温释放规律的测量研究。在FIB-EB双束系统下记录切槽前后制斑微区的图像,利用数字图像相关法计算切槽后的位移,结合InglisMuskhelishvili理论公式可计算得到残余应力。文中研究了不同温度及保温时间对残余应力释放的影响规律。结果表明,残余应力随保温时间的增长释放速度逐渐减小,最后残余应力趋于稳定值。同时,温度越高,残余应力释放越彻底,800℃下近乎完全释放。该工艺具有适用性好,效率高等优点,可望在材料微区变形测量中得到进一步应用。     

Moving eccentric crack in a piezoelectric strip bonded to elastic materials

Summary  The steady-state of a propagation eccentric crack in a piezoelectric ceramic strip bonded between two elastic materials under combined anti-plane mechanical shear and in-plane electrical loadings is considered in this paper. The analysis based on the integral transform approach is conducted on the permeable crack condition. Field intensity factors and energy release rate are obtained in terms of a Fredholm integral equation of the second kind. It is shown for this geometry that the crack propagation speed has influence on the dynamic energy release rate. The initial crack branching angle for a PZT-5H piezoceramic structure is predicted by the maximum energy release rate criterion. Received 23 January 2001; accepted for publication 18 October 2001