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金刚石是一种重要的宽禁带半导体材料,对金刚石内载流子输运过程的研究将有助于了解金刚石用作各种电子器件的潜能。利用Monte Carlo模拟方法,研究了在低场低能区金刚石内载流子的飞行时间。在模拟中考虑了抛物线型能带模型和声学声子散射机制,以及样品对光的吸收和载流子在Brillouin区边界的Bragg反射。通过模拟,得到了低场低能区金刚石材料内载流子的飞行时间分布,并与相关的实验结果进行了比较分析,验证了该模拟模型的正确性。研究结果表明,在低场低能区,金刚石材料内主要的散射机制是声学声子散射。在研究金刚石材料内载流子的迁移输运问题时,可以采用较为简单的抛物线型能带模型,但在研究薄样品中的载流子输运时应当考虑材料的光吸收对初始载流子分布的影响,而且在场强较高以及样品厚度较大时,应当考虑载流子在Brillouin区边界的Bragg反射。 相似文献
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针对硅基半导体电光热多场耦合特性及电调控问题,引入泊松方程和载流子连续性方程来计算载流子输运过程的浓度分布,利用德鲁德-洛伦兹公式和K-K关系式考虑载流子浓度变化对于光折射率和吸收系数的影响,并根据电磁耗散求解热沉积项。通过对半导体基本方程、电磁波动方程和能量方程的耦合方程组进行有限元求解,模拟并分析了电光热三者耦合作用下硅基半导体介电属性及光传输行为随外加电压、载流子初始浓度、换热系数等影响因素的变化规律。研究指出了半导体P区表面反射光电场模随外加电压的降低而升高,随换热系数的增大而降低的规律。利用该机制给出了对反射光强空间分布进行电热调控的方案。 相似文献
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复杂半导体材料结构中的载流子分布特性对器件性能有重要影响. 本文针对一种新型的波长上转换红外探测器, 研究了载流子阻挡结构对载流子分布和器件特性的影响. 论文通过自洽求解薛定谔方程、泊松方程、电流连续性方程和载流子速率方程分析了不同器件结构中的空穴分布. 同时, 生长了相应结构的外延材料, 并通过电致荧光谱分析了载流子阻挡结构对器件特性的影响. 结果表明, 2 nm厚的AlAs势垒层既能有效阻挡空穴又不影响电子输运, 有利于制作波长上转换红外探测器. 此外, 论文分析了阻挡势垒层的厚度和高度以及工作温度对载流子分布的影响. 本文研究结果亦可应用于其他载流子非均匀分布的半导体器件. 相似文献
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考虑到热电子崩力的影响,在基于玻耳兹曼理论弛豫时间近似的非线性自相关模型基础上,将晶格温度与应变速率相耦合,建立了超短脉冲激光作用下半导体材料的超快热弹性模型。在单轴应变条件下,利用有限差分法模拟了500 fs脉冲激光作用下2 μm厚硅膜内的载流子温度、晶格温度、载流子数密度、热应力和热电子崩力等的变化情况。结果表明:在低能量密度激光条件下,热弹性效应对半导体材料的影响很小;载流子温度达到峰值的时间比激光强度达到峰值的时间早,随后载流子数密度达到峰值,以及激光脉冲作用5 ps以后硅膜趋于总体热平衡;在脉冲辐照早期,非热平衡阶段形成的热电子崩力在超快损伤过程中起主要作用。 相似文献
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为了研究脉冲激光辐照GaAs材料的热效应,采用软件COMSOL Multiphysics构建了高斯脉冲激光辐照半导体材料的温升物理模型,分析了1 064nm纳秒级脉冲激光辐照半导体材料GaAs的热效应.通过求解热传导方程计算了不同功率密度激光辐照GaAs材料的径向与纵向温度场分布,讨论了单光子吸收、双光子吸收及自由载流子吸收对辐照材料的温升贡献.计算结果表明:当激光功率密度升至1010 W/cm2,自由载流子对材料的温升贡献已超过单光子吸收对材料温升的贡献而占主导位置;当激光功率密度降至108 W/cm2以下时,两种非线性吸收对材料温升的贡献可以忽略.该结果与相关实验基本相符,表明了构建的物理模型具有科学性. 相似文献
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稀磁半导体--自旋和电荷的桥梁 总被引:5,自引:0,他引:5
稀磁半导体可能同时利用载流子的自旋和电荷自由度构造将磁、电集于一体的半导体器件.尤其是铁磁半导体材料的出现带动了半导体自旋电子学的发展.室温铁磁半导体材料的制备,半导体材料中有效的自旋注入,以及自旋在半导体结构中输运和操作已成为目前半导体自旋电子学领域中的热门课题.稀磁半导体呈现出强烈的自旋相关的光学性质和输运性质,这些效应为人们制备半导体自旋电子学器件提供了物理基础. 相似文献
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光载流子辐射技术已广泛应用于半导体材料性能的表征,本文基于一种包含光子重吸收效应的光载流子辐射理论模型,对单晶硅中光子重吸收效应对光载流子辐射信号的影响进行了详细的理论分析.分析结果表明,光子重吸收效应对光载流子辐射信号的影响主要取决于样品掺杂浓度、过剩载流子浓度和过剩载流子的分布.由于过剩载流子浓度及其分布与材料电子输运特性密切相关,电子输运参数的变化将导致光子重吸收效应的影响随之变化.进一步分析了光子重吸收效应对具有不同电子输运特性的样品的电子输运参数的影响,并提出了减小光子重吸收效应影响的方法. 相似文献
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P. Baeri 《Journal of luminescence》1985,30(1-4):409-424
Heating and cooling rates as well as melting and solidification velocity of surface layers of irradiated samples by laser pulses are semi-quantitatively described in terms of heat flow concepts based on the assumption that laser light is directly converted in lattice heating. The range of validity of this approach compared with a more complete scheme taking into account the free carrier plasma evolution is sketched and the importance of Auger effect in the plasma-lattice coupling mechanism is detailed. The most important consequences of the quencing rates achievable by short laser pulse irradiation on the structure modification of semiconductor surface layers are reviewed with more details on the liquid to amorphous silicon transition. This is in fact the more new and less understood fast solidification process induced by pulsed laser irradiation. 相似文献
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In the present study, the hyperbolic heat conduction equation is derived from the Boltzmann transport equation and the analytical solution of the resulting equation appropriate to the laser short-pulse heating of a solid surface is presented. The time exponentially decaying pulse is incorporated as a volumetric heat source in the hyperbolic equation to account for the absorption of the incident laser energy. The Fourier transformation is used to simplify the hyperbolic equation and the analytical solution of the simplified equation is obtained using the Laplace transformation method. Temperature distribution in space and time are computed in steel for two laser pulse parameters. It is found that internal energy gain from the irradiated field, due to the presence of the volumetric heat source in the hyperbolic equation, results in rapid rise of temperature in the surface region during the early heating period. In addition, temperature decay is gradual in the surface region and as the depth below the surface increases beyond the absorption depth, temperature decay becomes sharp. 相似文献
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The transient response characteristics of HgCdTe photoconductive detector under the radiation of ultra-short laser pulse have been discussed in detail. Specifically, the transient effect of pulse width to the temperature of electronics and crystal lattice, and corresponding resistance changes of detector are mainly discussed. Based on traditional drift-diffusion model, considering that the temperature of electronics and crystal lattice are different under the ultra-short laser pulse, the double-temperature equation is joined to describe the semiconductor carriers’ dynamics features. Using the numerical method, the transient response characteristics of detector in the case of ultra-short pulse have been worked out. The calculation results show that: When the pulse width is greater than nanosecond pulse, the temperature of electronics will be equal to which of crystal lattice. If the pulse width is less than nanosecond pulse, the temperature of electronics is higher than which of the latter. After the end of a pulse, the rebound resistance of detector will be higher than the dark resistance because of the thermal effect. The heat effect is more obvious when a pulse with narrower width and higher energy density incident to the detector. 相似文献
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亚皮秒脉冲激光辐照硅薄膜热效应的模拟研究 总被引:1,自引:1,他引:0
基于Boltzmann方程,采用了Chen J K等人建立的自相关模型,考虑了Si薄膜的热容、热导率、弛豫时间等热力学参量随温度非线性变化的影响.采用有限差分法,数值求解了脉宽为500 fs的激光脉冲辐照2 μm厚硅膜的自相关模型.分析了膜表面载流子浓度、载流子温度、晶格温度等随入射激光功率和脉宽等的变化规律.结果表明:在脉冲辐照初期(t<0.68 ps),载流子和晶格之间存在着明显的非热平衡性,之后通过相互之间的弛豫碰撞,逐渐达到热平衡,载流子热容是引起载流子温度在早期迅速上升的原因;载流子温度速率方程中单光子吸收、载流子-晶格能量交换和载流子能流变化率对载流子温升影响较大,而多光子吸收、双极能流和带隙能量变化率对载流子温升的影响较小,可以忽略;较高脉冲激光能量(Ф>0.02 J·cm-2)辐照Si膜,会引起载流子密度方程中的俄歇复合项增大,从而使载流子密度下降率增大,导致载流子温度出现双峰. 相似文献
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采用双重分布函数的格子玻尔兹曼模型,对单脉冲激光金属打孔过程中的快速相变传热进行研究.模型考虑了金属材料熔化后熔体的流动换热,并采用浸没移动边界方案对过程中的固液界面进行追踪.采用纯导热模型和考虑对流的换热模型计算,将结果和试验进行对比,结果表明:在激光打孔过程中熔体的流动对相变传热产生较大影响,采用考虑流动换热模型的结果与实验更接近.进而对熔化速度、熔化深度以及温度场的变化进行分析,并探讨不同激光工艺参数对相变过程的影响.模拟发现一个脉冲结束后,激光的脉宽越大,孔深越小,孔径越大,且最高温度较短脉冲激光越低. 相似文献
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Y. Takubo M. Tsuchiya M. Shimazu 《Applied Physics A: Materials Science & Processing》1981,25(2):139-142
High power density electron beams offer new opportunities for studies of epitaxial growth of semiconductor materials. Assuming
that the mechanism of epitaxial growth can be understood as a surface melting followed by supercooling regrowth, the heat
flow equation has been applied to calculate the temperature reached after an electron beam pulse of power density between
0.5–2 J/cm2. Comparison with laser annealing is made. 相似文献