GaAs衬底上生长的GaInP2外延单昌薄膜的杂质污染研究

各种外延技术已被用来在ＧａＡｓ衬底上生长ＧａｘＩｎ１－ｘＰ外延单晶薄膜。很多文献认为,在ＧａＩｎＰ２／ＧａＡｓ生长过程中会被Ｃ杂质污染。     

在Si衬底上异质外延GaAs薄膜变激发强度的近红外光致发光

通过对用ＭＯＣＶＤ（金属有机物化学气相沉积）方法在Ｓｉ衬底上生长的ＧａＡｓ外延薄膜，用不同激发强度下的近红外光致发光研究了液氮温度下峰值能量为１．１３ｅＶ和１．０４ｅＶ两个带谱的发光特性，表明这两个带均属于施主－受主对复合发光。由于发光带中存在着电子－声子耦合，所以应在施主－受主对复合发光能量表示式中计及Ｆｒａｎｋ－Ｃｏｎｄｏｎ位移，从而对复合发光能量表示式进行修正。通过对复合发光带能量随激发强度变化的实验曲线和理论表达式的拟合，确定了峰值为１．１３ｅＶ与１．０４ｅＶ这两个发光带深施主－受主对的束缚能之和分别为０．３００ｅＶ和０．４０１ｅＶ。     

低压－金属有机物汽相外延生长的Ga＿（1－x）In＿xAs／InP激光器中深能级的研究

应用深能级瞬态谱（ＤＬＴｓ）技术详细研究低压－金属有机物汽相外延（ＬＰ－ＭＯＶＰＥ）生长的Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ／Ｉｎｐ量子阱、宽接触和质子轰击条形异质结激光器中的深能级。样品的ＤＬＴＳ表明，在宽接触激光器的ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层里观察到Ｈ１（Ｅ＿ｖ＋０．０９ｅＶ）和Ｅ１（Ｅ＿ｃ－０．３５ｅＶ）陷阱，它们可能分别与样品生长过程中扩散到ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层的Ｚｎ和材料本身的原生缺陷有关。而条形激光器的ｉ－Ｇａ＿（０．４７）Ｉｎ＿（０．５３）Ａｓ有源层的Ｈ２（Ｅ＿ｖ＋０．１１ｅＶ）和Ｅ２（Ｅ＿ｖ－０．４２ｅＶ）陷阱则可能是Ｈ１和Ｅ１与质子轰击引起的损伤相互作用的产物。     

MBE和MOCVD生长的AlGaAs／GaAsGRIN—SCH SQW激光器深中心的比较

应用深能级瞬态谱（ＤＬＴＳ）技术详细研究分子束外延（ＭＢＥ）和金属有机物化学汽相淀积（ＭＯＣＶＤ）生长的ＡｌＧａＡｓ／ＧａＡｓ ｇｒａｄｅｄ ｉｎｄｅｘ ｓｅｐａｒａｔｅ ｃｏｎｆｉｎｅｍｅｎｔ ｈｅｔｅｒｏｓｔｒｕｃｔｕｒｅ ｓｉｎｇｌｅ ｑｕａｎｔｕｍ ｗｅｌｌ（ＧＲＩＮ－ＳＣＨ ＳＱＷ）激光器的深中心。结果表明，在激光器的ｎ－ＡｌＧａＡｓ层里除众所周知的ＤＸ中心外，还存在着较大浓度和俘获截面     

低压-金属有机物汽相外延生长的Ga1-xInxAs/InP激光器中深能级的研究

应用深能级瞬态谱（ＤＬＴｓ）技术详细研究低压－金属有机物汽相外延（ＬＰ－ＭＯＶＰＥ）生长的Ｇａ_０．４７Ｉｎ_０．５３Ａｓ／Ｉｎｐ量子阱、宽接触和质子轰击条形异质结激光器中的深能级。样品的ＤＬＴＳ表明，在宽接触激光器的ｉ－Ｇａ_０．４７Ｉｎ_０．５３Ａｓ有源层里观察到Ｈ１（Ｅ_ｖ＋０．０９ｅＶ）和Ｅ１（Ｅ_ｃ－０．３５ｅＶ)陷阱，它们可能分别与样品生长过程中扩散到ｉ－Ｇａ_{０．４ 关键词：}     

1．55μm InGaAsP／InP应变量子阱激光器的LP－MOCVD生长

本文首次报导了生长温度为５５０℃，以三甲基镓（ＴＭＧａ）和三甲基铟（ＴＭＩｎ）为Ⅲ族源，用低压金属有机物气相沉积（ＬＦＭＯＣＶＤ〕技术，高质量１．６２ｕｍ和１．３ｕｍＩｎＧａＡｓＰ及Ｉｎ０．５７Ｇａ０．４３Ａｓ０．９８Ｐ０．０４／Ｉｎ０．７３Ｇａ０．２７Ａｓ０．６Ｐ０．４量子阶结构的生长，并给出了１．５５ｕｍＧａＡｓＰ／ＩｎＰ分别限制应变量子阱结构激光器的生长条件，激光器于室温下脉冲激射，其阈值电流密度为２．４ｋＡ／ｃｍ２。     

1．55μmInGaAsP及其相应量子阱结构的LP－MOCVD生长

本文研究了用低压金属有机化合物汽相外延（ＬＰ－ＭＯＣＶＤ）技术在（１００）ＩｎＰ衬底上生长ＩｎＧａＡｓｐ体材料及ＩｎＧａＡＰ／ＩｎＰ量子阱结构材料的生长条件。三甲基镓（ＴＭ６３）、三甲基铟（ＴＭｈ）和纯的砷烷（Ａ８Ｈ３）、磷烷（ＰＨ３）分别用作Ⅲ族和Ⅴ族源，在非故意掺杂情况下，ＩｎＧａＡｓＰ材料的载流子浓度为３．６×１０１５ｃｍ－３；在液氦温度和室温下，与ＩｎＰ晶格匹配的ＩｎＧａＡｓＰ光致发光半峰宽分别为１９．２ｍｅＶ和６３ｍｅＶ；对外延层的组分及厚度均匀性分别进行了转靶Ｘ光衍射仪，低温光致发光和扫描电子显微镜分析，对不同阱宽的量子阱结构材料测出了由于量子尺寸效应导致光致发光波长随阱宽增加而红移现象。     

晶片融合产生长波低阈值垂直腔激光器

日本ＮＴＴ光电实验室的研究人员演示了一种以双ＩｎＧａＡｓ／ＩｎＰ－ＧａＡｓ／ＡｌＡｓ分布布喇格反射器为基础的１．５５μｍ输出垂直腔表面发射激光器（ＶＣＳＥＬ）。靠晶片融合进行的设计，其不匹配位错密度低于ＩｎＰ／ＧａＡｓ界面上的异质外延生长。这种直径为２５μｍ的器件在２３℃时的阈值电流为８．８ｍＡ，阈值电压为２．１Ｖ。在１０ｍＡ时实验了１．５５μｍ发射，最大输出功率为７μｗ。研究人员希望通过优化底部反射率提高最大输出功率。他们指出，长波ＶＣＳＥ有许多优点，包括在晶片融合前便于作谐振腔波长试验，以及…     

荧光XAFS研究Si可稀浓度杂质的区域结构

荧光ＸＡＦＳ研究Ｓｉ晶体中等电子，缺电子和富电子杂质原子的区域环境结构。结果表明杂质原子的电子构型决定了杂质原子对Ｓｉ区域晶格形变的影响。相对于共价键长ＲＳｉ－Ｓｉ（０．２４０ｎｍ）来说，富电子杂质Ａｓ导致Ｓｉ晶格在Ｓｉ（１１１）方向的ＲＡｓ－Ｓｉ键长产生０．００４ｎｍ的反应增长，等电子杂质Ｇｅ的Ｒ－Ｇｒｅ－Ｓｉ和缺电子杂质Ｇａ和ＲＧａ－Ｓｉ键长收缩０．００２ｎｍ。     

1MeVSi~＋衬底加温注入Al＿（0．3）Ga＿（0．7）As／GaAs超晶格和GaAs的晶格损伤研究

用卢瑟福背散射／沟道技术研究了１ＭｅＶＳｉ￣＋在衬底加温和室温下以不同剂量注入Ａｌ＿（０．３）Ｇ＿（０．７）Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ后的晶格损伤。在衬底加温下，观察到Ａｌ＿（０．３）Ｇａ＿（０．７）Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ都存在一个动态退火速率与缺陷产生速率相平衡的剂量范围，以及两种速率失去平衡的临界剂量。超晶格比ＧａＡｓ更难以损伤，并且它的两种速率失去平衡的临界剂量也大于ＧａＡｓ中的相应临界剂量，用热尖峰与碰撞模型解释了晶格损伤积累与注入剂量和衬底温度的关系。用ＣＮＤＯ／２量子化学方法计算了ＧａＡｓ和Ａｌ＿ｘＧａ＿（１－ｘ）Ａｓ中化学键的相对强度，并根据计算结果解释了注入过程中Ａｌ＿（０．３）Ｇａ＿（０．７）Ａｓ／ＧａＡｓ超晶格和ＧａＡｓ中晶格损伤程度的差别。     

Photoluminescence study of Si doped and undoped Chalcopyrite CuGaSe2 thin films

Photoluminescence (PL) characteristics have been studied on undoped and Si-doped CuGaSe₂ single crystal thin films grown on GaAs (001) substrate by migration-enhanced epitaxy. Room temperature PL spectrum of an undoped layer clearly shows free excitonic emission bands related to the minimum band-edge and to the split-off valence band, but no discernible emission has been observed in the low energy area. At 4.2 K, the excitonic emission due to the split-off valence band disappears. Instead, two additional emissions appear at 1.68 and 1.715 eV which are attributed to the bound exciton and band-to-acceptor transition. The Si doping to CuGaSe₂ produces two additional PL bands around 1.61 and 1.64 eV. These PL bands are attributed to the donor acceptor pair emissions due to the doped Si impurity which probably occupies Cu or Ga sites and intrinsic Cu vacancy.     

Study of n type porous GaAs by photoluminescence spectroscopy: Effect of the etching time on the deep levels

Photoluminescence (PL) analysis is used to study porous layers elaborated by electrochemical etching of n⁺ Si-doped GaAs substrate with different etching times. Temperature and power dependence photoluminescence (PL) studies were achieved to characterize the effect of the etching time on the deep levels of the n⁺ Si-doped GaAs. The energy emission at about 1.46 eV is attributed to the band-to-band (B-B) (e-h) recombination of a hole gas with electrons in the conduction band. The emission band is composed of four deep levels due to the complex of (V_AsSi_GaV_Ga), a complex of a (Ga vacancy - donor - As vacancy), a (Si_Ga-V_Ga³⁻) defect or Si clustering, and a (gallium antisite double acceptor-effective mass donor pair complex) and which peaked, respectively, at about (0.94, 1, 1.14, and 1.32 eV). The PL intensity behavior as function of the temperature is investigated, and the experimental results are fitted with a rate equation model with double thermal activation energies.     

Shallow acceptor luminescence in GaAs grown by liquid phase epitaxy

Two pairs of photoluminescence (PL) emission bands between 1.494 and 1.480 eV have been observed at 4.2°K from high purity, undoped GaAs layers grown by liquid phase epitaxy. The PL emission from doped layers grown after incremental Si additions to a single parent melt suggests that Si acceptors are responsible for the lower energy pair of bands near 1.484 eV. The identity of the acceptor species responsible for the higher energy pair near 1.493 eV is presently unknown.     

Temperature-dependent photoluminescence of GaN grown on β-Si3N4/Si (1 1 1) by plasma-assisted MBE

Photoluminescence (PL) of high quality GaN epitaxial layer grown on β-Si₃N₄/Si (1 1 1) substrate using nitridation-annealing-nitridation method by plasma-assisted molecular beam epitaxy (PA-MBE) was investigated in the range of 5-300 K. Crystallinity of GaN epilayers was evaluated by high resolution X-ray diffraction (HRXRD) and surface morphology by Atomic Force Microscopy (AFM) and high resolution scanning electron microscopy (HRSEM). The temperature-dependent photoluminescence spectra showed an anomalous behaviour with an ‘S-like’ shape of free exciton (FX) emission peaks. Distant shallow donor-acceptor pair (DAP) line peak at approximately 3.285 eV was also observed at 5 K, followed by LO replica sidebands separated by 91 meV. The activation energy of the free exciton for GaN epilayers was also evaluated to be ∼27.8±0.7 meV from the temperature-dependent PL studies. Low carrier concentrations were observed ∼4.5±2×10¹⁷ cm⁻³ by measurements and it indicates the silicon nitride layer, which not only acts as a growth buffer layer, but also effectively prevents Si diffusion from the substrate to GaN epilayers. The absence of yellow band emission at around 2.2 eV signifies the high quality of film. The tensile stress in GaN film calculated by the thermal stress model agrees very well with that derived from Raman spectroscopy.     

Competition in the carrier capture between InGaAs/AlGaAs quantum dots and deep point defects

The presence of an extrinsic photoluminescence (PL) band peaked at 1.356 eV at low temperature is observed, on a large number of self-assembled InAs and In_0.5Ga_0.5As quantum dot (QD) structures, when exciting just below the GaAs absorption edge. A detailed optical characterization allows us to attribute the 1.356 eV PL band to the radiative transition between the conduction band and the doubly ionized Cu _Ga acceptor in GaAs. A striking common feature is observed in all investigated samples, namely a resonant quenching of the QD-PL when exciting on the excited level of this deep defect. Moreover, the photoluminescence excitation (PLE) spectrum of the 1.356 eV emission turns out to be almost specular to the QD PLE. This correlation between the PL efficiency of the QDs and the Cu centers evidences a competition in the carrier capture arising from a resonant coupling between the excited level of the defect and the electronic states of the wetting layer on which the QDs nucleate. The estimated Cu concentration is compatible with a contamination during the epitaxial growth. Received 13 November 2001 / Received in final form 28 May 2002 Published online 19 July 2002     

硅基硒纳米颗粒的发光特性研究

由于尺寸缩小引起的量子效应, 硒(Se) 材料的低维纳米结构具有更高的光响应和低的阈值激射等特性, 因此成为纳米电子与纳米光电子器件领域一个重要的研究方向. 本文通过对非晶硒薄膜的快速热退火来制备硒纳米颗粒, 退火温度在100–180℃之间时, 结晶后的硒纳米颗粒均为三角晶体结构, 其颗粒尺寸随退火温度的增加而线性增大. 光致发光谱测试发现三个发光峰, 分别位于1.4eV, 1.7eV和1.83eV. 研究发现位于1.4eV处的发光峰来源于非晶硒缺陷发光, 位于1.83eV处的发光峰来源于晶体硒的带带跃迁发光; 而位于1.7eV处的发光峰强度随激发功率增强而指数增大, 且向短波长移动, 该发光峰应该来源于非晶硒与硒纳米颗粒界面处的施主-受主对复合发光. 关键词： 硅基 硒纳米颗粒 光致发光 施主-受主对     

掺锰磷化铟中1.18eV辐射的施主受主对辐射性质的研究

通过对掺锰磷化铟的1.18eV辐射的频率响应谱(FRS)及辐射峰随激发强度的位移的研究得到了明确的证据,确认这个光致发光辐射的施主受主对(DAP)复合的性质。一个和Mn2+相关的复合跃迁过程被提出用以解释有关的实验结果。     

优质GaAs/Si和AlGaAs/Si材料的MOCVD生长研究

用自制常压MOCVD装置,在Si衬底上生长GaAs和AlGaAs外延层,在高温去除Si衬底表面氧化膜之后,采用两步法,即低温生长过渡层,再提高温度生长外延层。得到了表面镜面光亮的优质GaAs和AlGaAs外延层。X射线双晶衍射仪测试GaAs外延层,其回摆曲线半峰宽是200孤秒,GaAs和AlGaAs外延层在77K温度下,PL谱半峰宽分别是17meV和24meV。     

Photoluminescence of epitaxial GaAs grown by close space vapor transport method

We report here the first observation of photoluminescence spectra of GaAs epitaxial layers prepared by close space vapor transport method. At 77 K two PL signals were found, the near-band gap transition at 1,51 eV and the other at 1,4 eV. The nature of PL emission lines is discussed in relation with the features of growth method. No simple relation between the growth conditions and concentration of radiative centers was found.     

A study of GaInP/GaAs interfaces: metallurgical coupling of successive quantum wells

We present a study of GaInP/GaAs interfaces by means of photoluminescence (PL) of multi quantum wells (MQW), embedded in GaInP, or asymmetric structures having an AlGaAs barrier GaInP/GaAs/AlGaAs. The PL energies of quantum wells were compared with calculations based on the transfer matrix envelope function approximation, well suited for asymmetric structures. GaInP/GaAs/AlGaAs MQW structures (GaInP grown first) are in reasonably good agreement with calculations. Reverse ones, AlGaAs/GaAs/GaInP, present a lower PL energy than calculated. But the agreement with theory is recovered on single quantum well samples, or in MQW when the GaInP thickness is increased up to 100 nm. We interpret this phenomenon as a diffusion of arsenic atoms from the next GaAs well through the GaInP barrier. Arsenic atoms exchange with phosphorus atoms at the GaInP-on-GaAs interface of the former well, leading to a small gap strained InGaAs region responsible for the lowering of PL energies.