非平衡磁控溅射系统的离子束流控制

在非平衡磁控溅射沉积非磁性金属薄膜过程中，离子，原子到达比、沉积速率等参数是影响薄膜结构和性能的重要因素。根据非平衡磁控溅射沉积过程中离子的分布特点，分别考虑离子和中性粒子的传输，导出了对圆形平面靶非平衡磁控溅射沉积薄膜的放电功率、气压和离子束流密度等参数之间的关系，阐明了放电参数对于沉积过程离子束流密度等参数的影响。在Ar放电条件下，测量了系统的伏安特性；采用偏压平面离子收集电极测量了溅射系统轴向离子束流密度随不同的气压、溅射电流和空间位置的变化规律。结果表明模型分析的结论和实验数据的变化趋势相符合。     

非平衡磁控溅射沉积系统伏安特性模型研究

非平衡磁控溅射沉积系统的伏安特性对阴极溅射和薄膜沉积过程具有重要的影响.通过分析在常规磁控溅射沉积系统中非平衡磁场对于放电过程的影响，根据蔡尔得定律研究了非平衡磁场对磁控溅射沉积系统伏安特性影响的基本规律；根据模型和实验数据的对比证明模型正确表达了非平衡磁控溅射沉积系统中非平衡磁场对伏安特性影响的规律. 关键词： 等离子体 金属薄膜/非磁性 磁控溅射     

同轴磁场对非平衡磁控溅射系统放电特性的影响

采用激励电流可以调整的电磁线圈来激发非平衡磁场，调整约束磁场和放电空间等离子体状态。实验结果表明调整非平衡磁场显著影响系统的放电特性，使放电特性偏离常规的磁控溅射系统放电特性，增强了等离子体的引出效果。在Ar放电的条件下，详细研究了溅射系统的工作伏安特性随不同的工作气体、气压和溅射功率的变化规律。根据蔡尔得公式，讨论了非平衡磁场对于磁控溅射系统中放电特性的影响规律。     

面向复杂求解域的高效粒子网格/蒙特卡罗模型与阳极层离子源仿真

等离子体仿真是研究等离子体放电特性的重要手段,特别是阳极层离子源,其放电结构的几何特性对等离子体特性的作用很难通过实验手段进行系统研究.然而,传统仿真模型一般是针对离子源进行整体建模,离子源的阴阳极几何轮廓形成的复杂求解域,导致模型的计算效率和收敛性较差.鉴于此,将离子源结构仿真与等离子体仿真分离,首先利用磁镜原理将离子源内外阴极大小、形状和相对位置等一系列阴极几何参数简化为磁镜比R_m和磁镜中心磁感应强度B₀两个磁镜参数,并在此基础上,建立了高效粒子网格/蒙特卡罗模型,将收敛时间由1.00μs缩短到0.45μs,大幅提升了计算效率和稳定性.进一步利用该模型系统研究了阳极层离子源放电结构的几何特性对等离子体特性的影响规律,发现R_m=2.50, B₀=36 mT时磁镜对等离子体约束效果最佳,当放电中心的位置与内外阴极间磁镜中心重合时,不仅能够输出高密度离子束流,同时可大幅减少阴极刻蚀,并保证内外阴极的刻蚀平衡.     

离子辅助沉积中离子束流密度的作用

测量了End-Hall离子源在不同条件下的离子束流密度，在不同离子束流密度下进行了Ar离子辅助沉积ZrO2薄膜的实验，研究了离子束流密度对薄膜折射率、晶相的影响.根据动量传递模型分析了离子束流密度对薄膜折射率的作用;根据热尖峰理论证明了一定条件下离子束流密度不会影响薄膜晶体结构.     

静电堵漏串级镜MM－4U的约束位形的理论研究

本文分析了双会切静电堵漏串级磁镜ＭＭ－４Ｕ中粒子损失的可能机制，考虑了等离子体粒子能量的切断，从平衡的Ｖｌａｓｏｖ方程的解出发，数值求解了一组静态的达朗倍尔方程，即Ｐｏｉｓｓｏｎ方程和Ｍａｘｗｅｌｌ方程，得到了等离子体电位、密度及非中性度（净余电子数密度）分布。结果表明，堵漏电压及堵漏电极极板的几何位形、磁场位形及磁场大小、电子温度及电子－离子温度比在串级磁镜的约束位形的形成中起着重要的作用。     

离子束流后处理对类金刚石薄膜激光损伤特性的影响

类金刚石薄膜激光损伤阈值低,已经严重制约其在红外激光系统中的应用。基于非平衡磁控溅射技术,在硅基底上沉积类金刚石薄膜;采用离子束流后处理技术,用正交实验法确定影响处理效果的主要因素,对已沉积完成的DLC薄膜进行离子束轰击;在不同处理工艺下,观测薄膜样品的光学常数及拉曼光谱,最后进行了激光损伤测试。从测试结果可知,离子束流后处理参数:离子能量1000eV、放电电流30~40mA、轰击时间8min时,透射率由原来的60.65%提高到了65.98%;消光系数在900nm后明显降低,DLC薄膜的激光损伤阈值从0.69J/cm2提高到1.01J/cm2。     

圆形复合式磁控溅射阴极设计及其放电特性模拟研究

基于二维有限元算法使用COMSOL软件对圆形复合式磁控溅射阴极的磁场进行了计算,结合Matlab优化工具箱分别采用遗传算法和模拟退火算法对圆形复合式磁控溅射阴极的结构进行优化,得到靶材利用率达到最大的最优结构.对得到的最优化磁控阴极,基于自洽粒子模拟方法,使用VSim软件对不同工况下的放电特性进行了模拟.研究发现随着磁场非平衡度的增加,阴极表面电势降落最大的位置和等离子体聚集的位置,沿着阴极表面外沿不断向阴极中心移动,阴极表面磁场的强度不断减小.随着磁场非平衡度的增加,等离子体密度先增加后减小,鞘层厚度先减小后增加,等离子体的密度和鞘层厚度不仅与磁场非平衡度有关,而且与磁场强度有关.最后根据粒子模拟的结果,对复合式磁控阴极的靶材刻蚀深度进行了研究.研究发现,在优化前后靶材的刻蚀范围从60 mm扩展至整个靶面,极大地提高了靶材利用率.     

静电堵漏串级镜MM—4U贩约束位形的理论研究

本文分析了双会切静电堵漏串级磁镜ＭＭ－４Ｕ中粒子损失的可能机制，考虑了 等离子体粒子能量的切断，从平衡的Ｖｌａｓｏｖ方程的解出发，数值求解了一组静态的达朗倍尔方程，即Ｐｏｉｓｓｏｎ方程和Ｍａｘｗｅｌｌ方程，得到了等离子体电位，密度及非中性度（净余电子数密度）分布。结果表明，堵漏电压及堵漏电极板的几何位形，磁场位形及磁场大小，电子温度电子－离子温度比在串级磁镜的束位形的形成中起着重要的作用。     

外扩型电磁场控制筒形阴极内等离子体放电输运特性的仿真研究

筒形阴极由于具有向内放电的特性,可改善高功率脉冲磁控溅射技术放电不稳定、溅射材料离化率差异大等缺陷.然而其产生的等离子体仅能依靠浓度差扩散的方式向基体运动,沉积速率并没有明显改善,尤其是在远离阴极区域.使用外扩型磁场对离子运动进行引导,可实现等离子体的聚焦和远距离输运,从而减少离子损失,提高沉积效率.本文从模拟和实验的角度对磁场的布局与设置进行研究,并获得不同磁场条件下的等离子体空间和时间输运特性及其对薄膜沉积的影响.结果表明电磁场的引入不仅可以大幅提高筒形阴极内等离子体的引出效率,实现不同程度的引出或聚焦,而且对等离子体放电也产生明显的增强或减弱,可根据不同的需求或材料进行精确调控.通过控制磁场,可获得较强的Hi PIMS放电和较高的沉积速率,实验结果与仿真预测相符合.该工作完善了Hi PIMS沉积技术在沉积效率上的不足,拓宽了筒形阴极的溅射工艺窗口和适用范围,有助于Hi PIMS更进一步的推广与应用.     

Influence of the Basic Process Parameters on the Ion/Atom Arrival Rate Ratio during Magnetron Sputter Deposition of Thin Carbon Films

The behaviour of the ratio of the argon ion flux and the sputtered atom flux to the substrate with the variation of the basic process parameters was studied in a planar magnetron sputtering system. Finding ways to control this ratio is important with respect to carrying out ion-assisted thin film growth by magnetron sputtering under well-defined conditions. Combined deposition rate measurements and plasma probe measurements were carried out in order to determine the ion/atom arrival rate ratio. In addition calculations of the neutral atom flux were performed on the basis of a simple model and the results compared with the measured values. A considerable change in the values of the ion/atom arrival rate ratio with the variation of the argon pressure and the discharge power was found under operating conditions, at which the back diffusion of the sputtered material is pronounced. The distribution of the ion flux over the substrate surface was found to become more homogeneous with the increase of the working pressure or the target-to-substrate distance.     

Gallium-doped zinc oxide films deposited using an unbalanced magnetron sputtering system

Gallium-doped zinc oxide films are deposited using an unbalanced magnetron sputtering system. The films are deposited by dc sputtering of a conducting ceramic target in an argon atmosphere. The substrate temperature is 150°C. The film surface morphology is studied by scanning electron microscopy and atomic force microscopy. As the degree of magnetron unbalance increases, the electrophysical properties of the films deposited along the system axis are shown to improve, and the distribution of the film electrical resistivity over the substrate surface becomes more uniform.     

Effect of balanced and unbalanced magnetron sputtering processes on the properties of SnO2 thin films

A comparative study has been carried on the role of balanced magnetron (BM) and unbalanced magnetron (UBM) sputtering processes on the properties of SnO₂ thin films. The oxygen partial pressure, substrate temperature and deposition pressure were kept 20%, 700 °C and 30 mTorr, respectively and the applied RF power varied in the range of 150–250 W. It is observed that the UBM deposition causes significant effect on the structural, electrical and optical properties of SnO₂ thin films than BM as evidenced by X-ray diffraction, C-V, Spectroscopic Ellipsometer and Photoluminescence measurements. The value of band gap (E_g) of the films deposited at 150 W in UBM is found as E_g = 3.83 eV which is much higher than the value of E_g = 3.69 eV as observed in BM sputtering indicating that UBM sputtering results in good crystalline quality. Further, the C-V measurements of SnO₂ thin films deposited using UBM at high power 250 W show hysteresis with large flat band shift indicating that these thin films can be used for the fabrication of memory device. The observed results have been attributed to different mechanisms which exist simultaneously under unbalanced magnetron sputtering due to ion bombardment of growing SnO₂ thin film by energetic Ar+ ions.     

Preparation and structural properties of thin carbon films by very-high-frequency magnetron sputtering

Growth and structural properties of thin a-C films prepared by the 60 MHz very-high-frequency(VHF) magnetron sputtering were investigated. The energy and flux of ions impinging the substrate were also analyzed. It is found that the thin a-C films prepared by the 60 MHz sputtering have a lower growth rate, a smooth surface, and more sp~3 contents.These features are related to the higher ion energy and the lower ions flux onto the substrate. Therefore, the 60 MHz VHF sputtering is more suitable for the preparation of thin a-C film with more sp~3 contents.     

非平衡磁控溅射等离子体频谱特征

利用朗缪尔探针和快速傅里叶变换研究了非平衡磁控溅射等离子体静电波动的驻波共振频谱特征。频带宽度为0~300kHz,典型放电条件下磁控靶前2cm和10cm两个位置的共振本征频率变化范围分别为10~50kHz和1~10kHz,研究了线圈电流、气压和放电功率等参数对共振本征频率的影响;指出了非平衡磁控溅射中能够导致等离子体静电驻波共振的两种势阱结构,提出驻波共振机制解释特征频率出现的原因,根据声驻波共振机制计算的电子温度数值符合实验的结果。     

Effect of driving frequency on the structure of silicon grown on Ag(111) films by very-high-frequency magnetron sputtering

The effect of driving frequency on the structure of silicon grown on Ag(111) film is investigated, which was prepared by using the very-high-frequency(VHF)(40.68 MHz and 60 MHz) magnetron sputtering. The energy and flux density of the ions impinging on the substrate are also analyzed. It is found that for the 60-MHz VHF magnetron sputtering, the surface of silicon on Ag(111) film exhibits a small cone structure, similar to that of Ag(111) film substrate, indicating a better microstructure continuity. However, for the 40.68-MHz VHF magnetron sputtering, the surface of silicon on Ag(111) film shows a hybrid structure of hollowed-cones and hollowed-particles, which is completely different from that of Ag(111)film. The change of silicon structure is closely related to the differences in the ion energy and flux density controlled by the driving frequency of sputtering.     

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利用朗缪尔探针和快速傅里叶变换研究了非平衡磁控溅射等离子体静电波动的驻波共振频谱特征。频带宽度为0~300kHz,典型放电条件下磁控靶前2cm和10cm两个位置的共振本征频率变化范围分别为10~50kHz和1~10kHz,研究了线圈电流、气压和放电功率等参数对共振本征频率的影响;指出了非平衡磁控溅射中能够导致等离子体静电驻波共振的两种势阱结构,提出驻波共振机制解释特征频率出现的原因,根据声驻波共振机制计算的电子温度数值符合实验的结果。     

Ion energies at the cathode of the DC planar magnetron sputtering discharge

The energy distribution of the ions striking the cathode of the dc planar magnetron system was measured over a range of the typical sputtering conditions (magnetic field of 0.07–0.13 T, argon pressure of 0.01–10 Pa, discharge voltage of 250–600 V). The results obtained allow us to conclude that the major part of the incident ion flux originates in the cathode fall region. The theoretical model developed in terms of mobility theory makes it possible to evaluate the cathode fall voltage and its dependence on the sputtering conditions. It was found that the normalized integral form of the incident ions, energy spectrum is practically independent of the sputtering discharge parameters.