高电荷态离子207Pbq+(24≤q≤36)与Si(110)固体表面作用的电子发射研究

报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子²⁰⁷Pb^q+(24≤q≤36)入射到Si(110)表面产生的电子发射的实验测量结果.结果表明,高电荷态离子与固体表面相互作用产生的电子发射产额Y与入射离子的电荷态q、入射角度ψ和入射能量E都有很强的关联.首次发现,电子发射产额Y与入射角度ψ间有接近1/tanψ的关系.理论分析认为,这些过程与基于经典过垒模型的势能电子发射过程密切相关. 关键词： 高电荷态离子 经典过垒模型 电子发射产额     

高电荷态Krq+与Al表面碰撞发射可见光的研究

利用低速(V≈0.01 V_Bohr)高电荷态Kr^q+ (q=8, 10, 13, 15, 17)离子轰击金属Al表面, 获得了碰撞过程产生的300–600 nm的光谱. 实验结果表明: 低能大流强(μA/cm²量级)离子束入射金属表面, 可产生溅射原子、离子和入射离子中性化后发射的可见光. 随着入射离子势能(电荷态)增加, 碰撞过程中发射谱线的强度增强. 与激发态3d能级相比, 较高的势能可以有效地激发Al原子的电子到较高4s能级. 关键词： 高电荷态离子 可见光发射 离子与表面作用     

高电荷态离子与SiO2表面相互作用的研究

高电荷态离子(Pbq ,Arq )由兰州近代物理研究所的ECR实验平台所产生,轰击非晶态SiO2表面.用微通道板测量溅射粒子产额的角分布.用公式拟合实验溅射角分布得到了较好的结果,并给出了初步的理论解释.由此得出了高电荷态离子与SiO2表面作用的微分溅射截面.实验结果表明高电荷态离子能够增加动能溅射;同时高电荷态离子入射能够引起势能溅射.在大角度入射时,溅射产额主要是由碰撞引起的;在小角入射时势能溅射所占比重会增大.     

Ar的类氦和类锂离子与Mo表面相互作用过程中的x射线发射

在兰州重离子加速器国家实验室电子回旋共振离子源上用Si(Li)探测器观测到了不同动能的Ar¹⁵⁺和Ar¹⁶⁺离子与Mo表面相互作用过程产生的x射线.在不同动能 的Ar¹⁶⁺与Mo表面作用过程中不仅能观测到Ar的K层x射线而且能观测到Mo的L层x 射线.在不同动能的Ar¹⁵⁺入射下只能观测到Mo的L层x射线.实验结果表明，Ar的 K层x 射线的产额与入射离子的动能、作用过程中形成的空心原子携带的势能以及入射离子和靶原 子x射线的竞争等有关，Mo的L层x射线随入射离子动能的增加而增加. 关键词： x射线发射 高电荷态离子 Mo表面     

高电荷态离子Arq+与不同金属靶作用产生的X射线

研究了高电荷态离子Ar^q+(q=16，17，18)入射金属Be，Al，Ni，Mo，Au靶表面产生的X射线谱.实验结果表明，Ar的Kα-X射线是离子在与固体表面相互作用过程中固体表面之下形成空心原子发射的.电子组态1s²的高电荷态Ar¹⁶⁺离子在金属表面中性化过程中，存在的多电子激发过程使Ar¹⁶⁺的K壳层电子激发产生空穴，级联退激发射Ar的Kα 特征X射线.Ar¹⁷⁺离子在金属表面作用过程中产生的X射线谱形与靶材料没有明显的关联,入射离子的Kα-X射线产额与其最初的电子组态有关，靶原子的X射线产额与入射离子的动能有关. 关键词： 高电荷态离子 空心原子 多电子激发 X射线     

高电荷态离子入射Al表面库仑势对靶原子特征谱线强度的影响

用同一动能(150keV)而不同电荷态的⁴⁰Ar^q+(8≤q≤16)离子入射金属Al表面,靶原子受激辐射产生特征光谱线. 实验结果表明：高电荷态离子与金属表面相互作用过程中,经过与靶原子碰撞(Penning碰撞)交换动能和共振电子俘获(resonant capture)释放库仑势能,将携带的能量沉积于靶表面,使靶原子激发. 这种激发不同于光激发,它不仅激发了原子复杂电子组态之间的跃迁,而且跃迁辐射的特征谱线强度增强的趋势与入射粒子的库 关键词： 高电荷态离子 库仑势 特征光谱 光谱强度     

260～520 keV Krq+ (8≤q≤17)离子轰击Al靶产生的可见光辐射

低速高电荷态离子与金属表面相互作用,原子从靶材表面溅射,其中一部分处于激发态的溅射原子通过辐射退激产生可见光。在这一相互作用过程中,低速高电荷态离子从靶材表面捕获一个或多个电子进入其激发态,这些处于激发态的入射离子也会通过辐射退激产生可见光。研究表明,离子在靶材中的核阻止本领与溅射原子产额密切相关。为了更好地理解溅射原子的激发过程,认识低速高电荷态离子与金属相互作用过程中,溅射原子的激发概率与入射离子动能和势能之间的关联,研究了260～520 keV Krq+ (8≤q≤17)离子与Al靶相互作用过程中的可见光发射。给出了520 keV Kr13+ 与Al表面相互作用过程中,发射300～550 nm波长范围的发射光谱。实验结果包括溅射的Al原子在309.0和395.9 nm处的共振跃迁,Al+和Al2+分别在358.3和451.6 nm处的共振跃迁,以及Kr+在430.0,434.1,465.8和486.0 nm处的共振跃迁。还给出了谱线强度比值Y(309.0)/Y(395.9),Y(358.5)/Y(395.9),Y(452.8)/Y(395.9)随入射离子动能和势能的变化。结果表明：谱线强度比值均随入射离子动能的增加而增大,而比值Y(309.0)/Y(395.9)随势能的增加而减小。分析表明,在低速高电荷态离子与Al靶相互作用过程中,动能（电子阻止本领）和势能共同作用导致Al原子的激发,与激发态Al(4s)相比,电子布居较高激发态Al(3d)的概率随着离子电子阻止本领的增加而增大,而随着离子势能增加而减小。在低速高电荷态离子与金属表面相互作用过程中,入射离子在靶材中的核阻止本领影响溅射原子产额,而电子阻止本领与激发概率相关。在这一作用过程中,动能和势能共同决定溅射原子的激发概率,当动能和势能在同一数量级时,动能作用比势能作用小两个量级。     

高电荷态离子207Pbq+(24≤q≤36)与Si(110)固体表面作用的电子发射研究

报道了利用兰州重离子加速器国家实验室ECR源引出的高电荷态离子207Pbq+(24≤q≤36)入射到Si(110)表面产生的电子发射的实验测量结果.结果表明,高电荷态离子与固体表面相互作用产生的电子发射产额Y与入射离子的电荷态q、入射角度ψ和入射能量E都有很强的关联.首次发现,电子发射产额Y与入射角度ψ间有接近1/tanψ的关系.理论分析认为,这些过程与基于经典过垒模型的势能电子发射过程密切相关.     

高电荷态离子$lt;sup$gt;126$lt;/sup$gt;Xe$lt;sup$gt;$lt;i$gt;q$lt;/i$gt;+$lt;/sup$gt;引起GaN表面形貌变化研究

用不同电荷态的¹²⁶Xe^q+离子（9≤q≤30）在室温下轰击GaN晶体表面,经原子力显微镜分析表明,当q>18,辐照区域由隆起转为显著的刻蚀.被轰击后的GaN晶体表面形貌主要取决于入射离子的电荷态.同时,样品表面形貌还与入射离子的剂量和入射角有关;在实验参数范围,与入射离子的初动能没有明显关系（180 keV≤E_k≤600 keV）.当入射离子的电荷态q=18,与样品表面法线成60°角倾斜入射和垂直表面入射时,样品的表面几乎没有变化,只是倾斜入射后有很微小的隆起;当q＜18时,样品表面膨胀隆起,粗糙度增强,倾斜入射时表面隆起比垂直入射时更明显,而且都有清晰的峰状分界区;当q＞18时,样品表面被蚀刻呈凹陷状,有明显的齿状刻痕,且侵蚀深度与离子剂量近似呈线性关系,倾斜入射时的刻蚀深度大于垂直入射时的刻蚀深度. 关键词： 高电荷态离子 GaN晶体 原子力显微镜 表面形貌     

近Bohr速度129Xeq+离子入射Ta靶发射近红外光谱线

用动能一定的高电荷态¹²⁹Xe^q+(17≤q≤27)离子，分别入射洁净的Ta靶表面，测量中性化的激发态Xe原子从组态5p⁵(²P°_3/2) nl退激到组态5p⁵(²P°_3/2) ml’过程中辐射的近红外光谱线.实验结果表明:多激发态的空心原子退激发射其特征光谱线，部分典型的跃迁按照阶梯方式退激.Xe原子发射的谱线的单粒子荧光产额和激发的Ta原子发射谱线的单粒子荧光产额随入射离子电荷态的增加而增加，其增加的趋势与入射离子携带的势能随电荷态增加的趋势一致.证明在近Bohr速度的能区，经典过垒模型是成立的.     

Study on the orientation of silver films by ion-beam assisted deposition

Low energy ion beam assisted deposition (IBAD) was employed to prepare Ag films on Mo/Si (100) substrate. It was found that Ag films deposited by sputtering method without ion beam bombardment were preferred (111) orientation. When the depositing film was simultaneously bombardment by Ar⁺ beam perpendicular to the film surface at ion/atom arrival ratio of 0.18, the prepared films exhibited weak (111) and (200) mixed orientations. When the direction of Ar⁺ beam was off-normal direction of the film surface, Ag films showed highly preferred (111) orientation. Monte Carlo method was used to calculate the sputtering yields of Ar⁺ ions at various incident and azimuth angles. The effects of channeling and surface free energy on the crystallographic orientation of Ag films were discussed.     

Angular distribution and differential sputtering yields for low-energy light-ion irradiation of polycrystalline nickel and tungsten

Angular differential and total sputtering yields of polycrystalline nickel and tungsten have been measured for 1 and 4 keV H⁺ and 4 keV He⁺ ion bombardment at incidence angles between 0° and 80°. The differential sputtering yields (dY/dΩ) were determined with the aid of the collector technique, whereas the total yieldY was determined from the weight loss of the target during irradiation. Asymmetric angular distributions are observed at oblique angles of incidence, the emission maximum being shifted in forward direction (with respect to the incident ions). Even more pronounced than the change in shape of the emission distribution is an increase in the differential yield:dY/dΩ rises with increasing incidence angle over the whole range of ejection angles, the increase being most prominent in the direction of primary recoil emission. This effect is therefore ascribed to emission of surface atoms in direct projectile-surface atom collisions. On short term leave from Institut für Plasmaphysik der Kernforschungsanlage Jülich GmbH, D-5170, Jülich, Fed. Rep. Germany.     

Sputtering yields for light ions as a function of angle of incidence

The sputtering yield of Ni, Mo, and Au have been measured at oblique angles of incidence for H⁺-, D⁺-, and⁴He⁺-ion irradiation in the energy region from 1 to 8 keV. The yields were determined from the weight loss of the targets. For Ni and Mo the dependence of the sputtering yield on the angle of incidence was found to be much stronger for H⁺- and D⁺-ion than for⁴He⁺-ion irradiation. In all cases the maximum in the yield was found at angles of incidence ϑ≧80°, where ϑ is the angle measured from the surface normal. Furthermore the ratio of the maximum yield to the yeild at normal incidence increases with increasing surface binding energy of the target material as well as with increasing ion energy in the energy region inveestigated. The results are discussed qualitatively in view of a model for the sputtering mechanism for light ions.     

Secondary ion emission under the bombardment of Si by multiply charged Si q+ ions

The spectra of secondary ion emission under the bombardment of a B-doped Si target by multiply charged Si ^q+ ions (q = 1?C5) have been studied in the energy range of 1 to 10 keV per unit of charge. A multifold increase in the yield of secondary cluster Sk _n ⁺ ions, multiply charged Si ^q/+ ion (q = 1?C3), and H⁺, C⁺, B⁺, Si₂N⁺, Si₂O⁺ is observed as the charge of the multiply charged ions increases. The increase in the yield of secondary ions with increasing charge of the multiply charged-ion charge is most significant for ions with relatively high ionization potentials.     

~(129)Xe~(q+)激发Mo表面产生的X射线谱

研究了高电荷态离子129Xeq+(q=25,26,27)入射金属Mo表面产生的特征X射线谱.实验结果表明,在束流强度小于120nA条件下,高电荷态离子129Xeq+可以激发Mo的L壳层特征X射线谱.单离子X射线相对产额可达10-8量级,特征X射线的相对产额随入射离子的动能和电荷态(势能)的增加而增加.通过Mo原子的Lα1特征X射线谱,利用Heisenberg不确定关系对Mo原子的第M能级寿命进行了估算.     

The effect of incident angle on the C60 bombardment of molecular solids

The effect of incident angle on the quality of SIMS molecular depth profiling using C₆₀⁺ was investigated. Cholesterol films of ∼300 nm thickness on Si were employed as a model and were eroded using 40 keV C₆₀⁺ at an incident angle of 40° and 73° with respect to the surface normal. The erosion process was characterized by determining at each angle the relative amount of chemical damage, the total sputtering yield of cholesterol molecules, and the interface width between the film and the Si substrate. The results show that there is less molecule damage at an angle of incidence of 73° and that the total sputtering yield is largest at an angle of incidence of 40°. The measurements suggest reduced damage is not necessarily dependent upon enhanced yields and that depositing the incident energy nearer the surface by using glancing angles is most important. The interface width parameter supports this idea by indicating that at the 73° incident angle, C₆₀⁺ produces a smaller altered layer depth. Overall, the results show that 73° incidence is the better angle for molecular depth profiling using 40 keV C₆₀⁺.     

Carrier removal by implanted IONS in GaAs

Abstract

A model for calculation of the range distribution of energetic ions with taking into account the channeling effect is proposed. The measurement of the depth distributions of boron ions in silicon crystals implanted at 13.6 and 91 MeV revealed significant difference between the measured and the calculated range profiles when the channeling effects have not been included in the calculation. In spite of deminishing the critical angles of channeling with growing ion energy the probability of the capture of ions into the channeling regime is significant in case of high energy implantation even when the incident angles are 7–10° off the main crystallographic directions.     

Effect of the target density on the cross section of charge exchange between fast ions and atoms

When fast X^q+ X^{q^ + } ions collide with atomic or molecular targets, the total charge exchange cross section decreases with increasing target density. This is because the excitation levels of resulting X^{(q - 1)+} X^{(q - 1)^ + } ions are suppressed because of ionization by target atoms. The effect of target density on the total charge exchange cross section may amount to one order of magnitude or more depending on the charge and energy of an incident ion, as well as on the density and inner shell configuration of target atoms. Numerical calculations are performed for partial (in the principal quantum number n) cross sections σ(n) and total cross sections σ_tot=Σ_nσ(n) of charge exchange in the case of collisions of fast multiply charged ions having an energy E in the range 100 keV/u-10 MeV/u with gas or solid targets.     

Nano-crater formation on a Si(1 1 1)-(7 × 7) surface by slow highly charged ion-impact

Using scanning tunneling microscopy (STM) and time of flight secondary ion mass spectrometry (TOF/SIMS), we observed radiation effects on a Si(1 1 1)-(7 × 7) surface in the collision of a single highly charged ion (HCI) with a charge state q up to q = 50. The STM observation with atomic resolution revealed that a nanometer sized crater-like structure was created by a single HCI impact, where the size increased rapidly with q. The secondary ion yields also increased with q in which multiply charged Si ions (Siⁿ⁺) were clearly observed in higher q HCI-collisions. The sputtering mechanism is briefly discussed, based on the so-called Coulomb explosion model.