I型锗基笼合物Ba8Ga16-xSbxGe30的合成及热电性能

用高温熔融结合放电等离子烧结（SPS）方法合成了Sb掺杂的单相n型Ba8Ga16-xSbxGe30化合物，探索了Sb对Ga的取代对其热电性能的影响规律．研究结果表明：随着Sb取代分数x的增加，Seebeck系数逐渐降低，Seebeck系数峰值对应的温度向低温方向偏移．电导率随着x的增加先增大后减小，当x=2时达到最大值．Sb取代Ga后对化合物的热性能有较大影响，其热导率和晶格热导率都有不同程度的降低．在所有n型Ba8Ga16-xSbxGe30化合物中，Ba8Ga14Sb2Ge30化合物的ZT值最大，在950K左右其最大ZY值达1．1．     

Zn掺杂n型笼合物Ba8Ga16-2xZnxGe30+x的热电传输特性

用高温熔融结合放电等离子烧结法制备了Zn掺杂单相n型Ba8Ga16-2xZnxGe30 x笼合物,探索了Zn对Ga的取代对其热电传输特性的影响规律.研究结果表明,n型Ba8Ga16-2xZnxGe30 x化合物的电导率随着x的增加逐渐增大,Seebeck系数随着x的增加而逐渐减小.当Zn完全取代Ga时,Ba8Zn8Ge38化合物的电导率反而急剧下降,Seebeck系数显著增大.Ba8Ga16-2xZnxGe30 x化合物的载流子迁移率随着温度的升高而降低,当Zn掺杂后,化合物的载流子迁移率有一定的增加,随着x的增加而逐渐增大.Ba8Ga16-2xZnxGe30 x化合物的热导率和晶格热导率变化规律类似,随着x的增加先减小后增大.在所有n型Ba8Ga16-2xZnxGe30 x笼合物中,Ba8Ga8Zn4Ge34化合物的ZT值最大,在1000 K时其最大ZT值达0.85.     

Zn掺杂P型Ba8Ga16ZnxGe30-x笼合物的合成及热电性能

用熔融法结合放电等离子烧结方法合成了Zn掺杂单相p型Ge基Ⅰ型笼合物Ba8Ga16ZnxGe30-x(x=3,4,5,6),探索Zn取代Ge对其热电性能的影响规律,结果表明:所制备的Ba8Ga16ZnxGe30-x化合物为p型传导,随Zn取代量x的增加,化合物室温载流子浓度Np逐渐增加,室温载流子迁移率μH和电导率逐渐降低.在所有试样中,Ba8Ga16Zn3Ge27化合物的Seebeck系数α在300—870K内始终最大,温度为300K时Seebeck系数为234μV/K,在700K附近达295μV/K.化合物的热导率随Zn取代量x的增加而降低.Ba8Ga16Zn3Ge27化合物在806K最大ZT值达0.38.     

Cd掺杂p型Ge基Ba8Ga16CdxGe30-x Ⅰ型笼合物的结构及热电特性

以Cd作为掺杂元素,用熔融法结合放电等离子体烧结(SPS)技术制备了具有不同Cd含量的Ba8Ga16CdxGe30-x(x=0.95,1.00,1.05,1.10) Ⅰ型笼合物,研究了Cd掺杂对其结构及热电性能的影响.Rietveld结构解析表明所制备的Ba8Ga16CdxGe30-x化合物为空间群pm3n的Ⅰ型笼合物,Cd原子主要占据在框架6c和16i位置上且具有较大的原子位移参数(ADP).所有样品均表现为p型传导,样品的载流子散射机制由低温的杂质电离散射为主逐渐过渡到高温的声学波散射为主.随Cd掺杂量的增加,对应化合物电导率逐渐增加,Seebeck系数逐渐降低.由于Cd原子较大的ADP,从而导致较低的晶格热导率,在室温附近,Ba8Ga16Cd1.10Ge28.90化合物的晶格热导率与Ba8Ga16Ge30化合物相比约降低38%.Ba8Ga16Cd1.00Ge29.00化合物的最大ZT值在600 K时为0.173.     

n型BayNixCo4-xSb12化合物的热电性能

系统地研究了Ba填充分数及Ni含量对n型BayNixCo4-xSb12(x=0—0.1,y=0—0.4)化合物热性能及电性能的影响规律.n型BayNixCo4-xSb12的热导率随Ba填充分数的增加而显著下降,当Ba填充分数为0.3时,热导率随Ni含量的增加而降低,在x=0.05时,热导率达到最小值,晶格热导率随Ni含量的增加单调降低.电子浓度和电导率随Ba填充分数及Ni含量的增加而增加,塞贝克系数则随Ba填充分数及Ni含量的增加而减小.对于Ba0.3Ni0.05Co3.95Sb12试样,得到了1.2最大 关键词： n型方钴矿 填充 置换 热电性能     

Ge掺杂n型Sn基VIII型单晶笼合物的制备及热电传输特性

采用Sn自熔剂法制备了具有n型传导的VIII型Ba8Ga16 xGexSn30(0 x 1.0)单晶笼合物,并对其结构和热电特性进行研究.研究结果表明:Ge在单晶中的实际含量较少,随着掺杂量的增加样品的晶格常数略有减小,Ge掺杂后样品的载流子浓度较掺杂前低,迁移率增加;所有样品的Seebeck系数均为负值,且绝对值较未掺杂样品低,但Ge掺杂后样品的电导率提高了62%;x=0.5的样品在500 K附近取得最大ZT值1.25.     

Yb/Sr双原子复合填充的Ⅰ-型Yb_x Sr_(8-x)Ga_(16)Ge_(30)笼合物的合成及热电性能

用熔融法结合放电等离子烧结(SPS)合成了Yb/Sr双原子复合填充的n型Yb_x Sr_(8-x)Ga_(16)Ge_(30)(x=0,0.5,1.0,1.5)笼合物,研究了双原子复合填充及Yb填充量x对Yb_x Sr_(8-x)Ga_(16)Ge_(30)笼合物热电传输特性的影响规律.结果表明,Yb在Yb_x Sr_(8-x)Ga_(16)Ge_(30)化合物中的固溶极限介于1.0-1.5之间.随着Yb填充量x的增加,化合物的室温载流子浓度增加而迁移率降低.在300-800 K温度范围内,随着x的增加,双原子填充试样的电导率逐渐增大,Seebeck系数逐渐减小,其中x=0.5的试样与单原子填充的Sr_8Ga_(16)Ge_(30)试样相比,电导率变化不大,Seebeck系数显著增加.Yb/Sr双原子复合填充比Sr单原子填充更有利于晶格热导率的降低,且晶格热导率随着Yb填充量x的增加逐渐降低.在所有n型Yb_x Sr_(8-x)Ga_(16)Ge_(30)化合物中Yb_(1.0) Sr_(7.0)Ga_(16)Ge_(30)化合物的ZT值最大,在800 K时其最大ZT值达0.81,与单原子填充的Sr_8Ga_(16)Ge_(30)化合物相比ZT值提高了35%.

Abstract：

n-type Yb/Sr double-atom-filled Yb_xSr_(8-x)Ga_(16)Ge_(30) (x = 0, 0.5, 1.0, 1.5) elathrates have been synthesized by combining melting reaction with the spark plasma sintering (SPS) method. The effects of double-atom fining on thermoelectric properties have been investigated. The results show that the solubility limit of Yb in the Sr-Ga-Ge system is between 1.0 and 1.5 when it is expressed by the formula of Yb_xSr_(8-x)Ga_(16)Ge_(30). With increasing Yb content x, the room-temperature carrier concentration of the Yb_xSr_(8-x)Ga_(16)Ge_(30) samples increases, while the room-temperature carrier mobility decreases. For the double-atom-filled samples, the electrical conductivity raises with increasing x, while the Seebeck coefficient reduces, and in which the x = 0.5 sample has a comparable electrical conductivity and a remarkably higher $eebeck coefficient compared with the single-atom-filled Sr_8Ga_(16)Ge_(30) sample in the temperature range of 300-800 K. The double-atom filling of Yb/Sr has significant influence on the lattice thermal conductivity of the Yb_xSr_(8-x)Ga_(16)Ge_(30) samples and the lattice thermal conductivity decreases gradually with increasing x. Of all the Yb_xSr_(8-x)Ga_(16)Ge_(30) samples, the maximum dimensionless figure of merit ZT of 0.81 is obtained at 800 K for the Yb_(1.0)Sr_(7.0)Ga_(16)Ge_(30) sample. Compared with that of single-atom-filled Sr_(8-x)Ga_(16)Ge_(30) sample, it is 35% higher at the same temperature.     

熔体旋甩法合成n型(Bi_(0.85)Sb_(0.15))_2(Te_(1-x)Se_x)_3化合物的微结构及热电性能

采用熔体旋甩结合放电等离子烧结(MS-SPS)技术制备了单相n型四元(Bi0.85Sb0.15)2(Te1-xSex)3(x=0.15,0.17,0.19,0.21)化合物,并对所得样品的微结构和热电传输性能进行了系统研究.样品自由断裂面的场发射扫描电子显微镜及抛光面的背散射电子成分分析表明:块体材料晶粒细小,晶粒排列紧密,成分分布均匀且相结构单一,样品中存在大量10—100nm的层状结构.随着Se含量x的增加,样品的电导率和热导率逐渐增加,而Seebeck系数逐渐降低.相比商业应用的区熔材料,MS-SPS方法合成的高Se组成的样品均在425K后表现出更高的ZT值,其中(Bi0.85Sb0.15)2(Te0.83Se0.17)3样品具有最高的ZT值,在360K可达到0.96,并在320—500K均保持较高的ZT值,500K时其ZT值相比区熔材料提高了48%.此外,通过调节Se的含量,可以有效地调控材料的ZT峰值出现的温度段,这对多级或梯度热电器件的制备具有重要意义.     

熔体旋甩工艺对Zn掺杂Ⅰ-型Ba8Ga12Zn2Ge32笼合物微结构及热电性能的影响

采用新颖的熔体旋甩(MS)结合放电等离子烧结(SPS)技术制备了单相Zn掺杂的I-型Ba8Ga12Zn2Ge32笼合物,研究了熔体旋甩工艺对其微结构以及热电性能的影响.结果表明,MS得到的薄带自由面主要由300 nm-1 μm的小立方体单晶组成,薄带经SPS烧结后得到了具有大量层状精细结构的致密块体.与熔融+SPS工艺制备的试样相比,熔融+MS+SPS制备的Ba8Ga12Zn2Ge3笼合物室温载流子浓度增加而迁移率降低,在测试温度范围内,试样的电导率略有下降,Seebeck系数增加,热导率和晶格热导率显著降低,900 K时其晶格热导率从1.06 W/mK降低至0.42W/mK.熔融+MS+SPS制备的Ba8Ca12Zn2Ge32笼合物试样在900 K时其最大ZT值达到0.90,与熔融+SPS试样相比提高了75%.     

多壁碳纳米管对p型Ba0.3FeCo3Sb12化合物热电性能的影响

用两步固相反应法合成了P型Ba填充方钴矿化合物Ba0.3FeCo3Sb12，并采用放电等离子烧结法(SPS)制备了Ba0.3FeCo3Sb12／多壁碳纳米管复合材料．研究了Ba0.3FeCo3Sb12／多壁碳纳米管复合材料的结构及多壁碳纳米管对其热电性能的影响规律：SEM分析表明多壁碳纳米管比较均匀地分布在Ba0.3FeCo3Sb12基体中；随着碳纳米管添加量的增加，Ba0.3FeCo3Sb12／多壁碳纳米管复合材料的电导率下降、塞贝克系数略微下降、晶格热导率大幅度降低，当碳纳米管含量为5％时其晶格热导率最小；当碳纳米管的含量为3％时，本研究得到的Ba0.3FeCo3Sb12／碳纳米管复合材料的最大ZT值达0．78．     

Zn掺杂n型笼合物Ba8Ga16-2xZnxGe30+x的热电传输特性

用高温熔融结合放电等离子烧结法制备了Zn掺杂单相n型Ba₈Ga_16-2xZn_xGe_30+x笼合物,探索了Zn对Ga的取代对其热电传输特性的影响规律.研究结果表明,n型Ba₈Ga_16-2xZn_xGe_30+x化合物的电导率随着x的增加逐渐增 关键词： 热电传输性能 n型笼合物 框架取代     

Convergence of conduction bands as a means of enhancing thermoelectric performance of n-type Mg2Si(1-x)Sn(x) solid solutions

Mg(2)Si and Mg(2)Sn are indirect band gap semiconductors with two low-lying conduction bands (the lower mass and higher mass bands) that have their respective band edges reversed in the two compounds. Consequently, for some composition x, Mg(2)Si(1-x)Sn(x) solid solutions must display a convergence in energy of the two conduction bands. Since Mg(2)Si(1-x)Sn(x) solid solutions are among the most prospective of the novel thermoelectric materials, we aim on exploring the influence of such a band convergence (valley degeneracy) on the Seebeck coefficient and thermoelectric properties in a series of Mg(2)Si(1-x)Sn(x) solid solutions uniformly doped with Sb. Transport measurements carried out from 4 to 800 K reveal a progressively increasing Seebeck coefficient that peaks at x=0.7. At this concentration the thermoelectric figure of merit ZT reaches exceptionally large values of 1.3 near 700 K. Our first principles calculations confirm that at the Sn content x≈0.7 the two conduction bands coincide in energy. We explain the high Seebeck coefficient and ZT values as originating from an enhanced density-of-states effective mass brought about by the increased valley degeneracy as the two conduction bands cross over. We corroborate the increase in the density-of-states effective mass by measurements of the low temperature specific heat. The research suggests that striving to achieve band degeneracy by means of compositional variations is an effective strategy for enhancing the thermoelectric properties of these materials.     

Electrical and thermal transport properties of CdO ceramics

High temperature electrical and thermal transport properties, that is, electrical conductivity, Seebeck coefficient and thermal conductivity, of CdO ceramics have been investigated. Because of the good electrical properties and low thermal conductivity, the dimensionless figure-of-merit ZT of the CdO ceramics reaches 0.34 at 1023 K. This value is comparable to the best reported ZT for the n-type oxide ceramic thermoelectric materials and remains as potential to be further improved by porosity controlling or nanostructuring.     

Off-center rattling and anisotropic expansion of type-I clathrates studied by Raman scattering

Dynamical motions of the guest ions in type-I clathrates Sr8Ga16Si(30-x)Gex and Ba8Ga16Si(30-x)Gex have been studied by Raman scattering spectroscopy, to clarify the role of guest vibration modes in these systems with unusual thermal transport behaviors. An anomalous decrease of the guest energies with decreasing temperature is observed for both systems. The Ge-doping expands the cage surrounding the 6d site anisotropically for Sr8Ga16Si(30-x)Gex, but isotropically for Ba8Ga16Si(30-x)Gex. Especially for Sr8Ga16Si(30-x)Gex, off-center rattling arises simultaneously with the anisotropic expansion, and it is confirmed that these anomalies play a crucial role to suppress lattice thermal conductivity in these systems.     

Sm和Ce复合掺杂Skutterudite化合物的制备及热电性能

用熔融法结合放电等离子快速烧结(SPS)制备出了单相的Sm和Ce复合掺杂的Skutterudite化合物Sm_mCe_nFe_1.5Co_2.5Sb₁₂，研究了Sm和Ce复合掺杂总量对其热电性能的影响规律.结果表明：随着Sm和Ce复合掺杂总量的增加，p型Sm_mCe_nFe_1.5Co_2.5Sb₁₂化合物的Seebeck系数增加、电导率和热导率降低.当掺杂总量相近时，和Sm、Ce单原子掺杂相比，Sm和Ce复合掺杂使Skutterudite化合物的热导率低10%—40%.Sm_0.22Ce_0.20Fe_1.54Co_2.46Sb_11.89化合物的最大热电性能指数ZT_max值在775K时为0.84. 关键词： 复合掺杂 方钴矿 热电性能     

聚对苯撑/LiNi0.5Fe2O4纳米复合热电材料的制备及其性能研究

本文以流变相反应法原位合成了聚对苯撑/LiNi_0.5Fe₂O₄纳米复合热电材料,并对其热电性能进行表征,研究了放电等离子烧结时保温时间对其热电性能的影响.结果发现,复合材料铁氧体颗粒粒径为100---300nm,其外部被一层聚对苯撑膜包覆.电子在Fe²⁺和Fe³⁺之间的跳跃机理在铁氧体电导中占主导作用,因此聚对苯撑/LiNi_0.5Fe₂O₄复合材料具有n型导电特性.随着保温时间增加,复合材料电导率基本不变,但热导率逐渐增大且Seebeck系数逐渐减小,导致热电优值系数降低.由于结合了有机物高电导率和低热导率以及无机材料高赛贝克系数的优点,所制备的复合材料热电性能较单一材料有较大提高.     

Effect of pressure on electronic and thermoelectric properties of magnesium silicide: A density functional theory study

We study the effect of pressure on electronic and thermoelectric properties of Mg_2Si using the density functional theory and Boltzmann transport equations. The variation of lattice constant, band gap, bulk modulus with pressure is also analyzed. Further, the thermoelectric properties(Seebeck coefficient, electrical conductivity, electronic thermal conductivity) have been studied as a function of temperature and pressure up to 1200 K. The results show that Mg_2Si is an n-type semiconductor with a band gap of 0.21 eV. The negative value of the Seebeck coefficient at all pressures indicates that the conduction is due to electrons. With the increase in pressure, the Seebeck coefficient decreases and electrical conductivity increases. It is also seen that, there is practically no effect of pressure on the electronic contribution of thermal conductivity.The paper describes the calculation of the lattice thermal conductivity and figure of merit of Mg_2Si at zero pressure. The maximum value of figure of merit is attained 1.83 × 10~(-3) at 1000 K. The obtained results are in good agreement with the available experimental and theoretical results.