Improvement of total-dose irradiation hardness of silicon-on-insulator materials by modifying the buried oxide layer with ion implantation

The hardening of the buried oxide (BOX) layer of separation by implanted oxygen (SIMOX) silicon-on-insulator (SOI) wafers against total-dose irradiation was investigated by implanting ions into the BOX layers. The tolerance to total-dose irradiation of the BOX layers was characterized by the comparison of the transfer characteristics of SOI NMOS transistors before and after irradiation to a total dose of 2.7 Mrad(SiO₂. The experimental results show that the implantation of silicon ions into the BOX layer can improve the tolerance of the BOX layers to total-dose irradiation. The investigation of the mechanism of the improvement suggests that the deep electron traps introduced by silicon implantation play an important role in the remarkable improvement in radiation hardness of SIMOX SOI wafers.     

Defects formation in the dual B+ and N+ ions implanted silicon

Silicon wafers were implanted with 40 keV B⁺ ions (to doses of 1.2×10¹⁴ or 1.2×10¹⁵ cm^–2) and 50 or 100 keV N⁺ ions (to doses from 1.2×10¹⁴ to 1.2×10¹⁵ cm^–2). After implantations, the samples were furnace annealed at temperatures from 100 to 450 °C. The depth profiles of the radiation damages before and after annealing were obtained from random and channeled RBS spectra using standard procedures. Two damaged regions with different annealing behaviour were found for the silicon implanted with boron ions. Present investigations show that surface disordered layer conserves at the annealing temperatures up to 450 °C. The influence of preliminary boron implantation on the concentration of radiation defects created in subsequent nitrogen implantation was studied. It was shown that the annealing behaviour of the dual implanted silicon layers depends on the nitrogen implantation dose.The authors would like to thank the members of the INP accelerator staff for the help during the experiments. The work of two authors (V.H. and J.K.) was partially supported by the Internal Grant Agency of Academy of Science of Czech Republic under grant No. 14805.     

Oxygen and hydrogen accumulation at buried implantation-damage layers in hydrogen- and helium-implanted Czochralski silicon

Oxygen and hydrogen accumulations at buried implantation-damage layers were studied after post-implant-ation annealing of hydrogen- and helium-implanted Czochralski (Cz) silicon. Hydrogen implantation was carried out at energies E=180 keV and doses D=2.7×10¹⁶ cm^-2, and helium implantation at E=300 keV and D=10¹⁶ cm^-2. For comparison hydrogen implantation was also done into float-zone (Fz) silicon wafers. Post-implantation annealing at 1000 °C was done either in H₂ or N₂ atmosphere. Hydrogen and oxygen concentration profiles were measured by secondary ion mass spectroscopy (SIMS). It is shown that the ambient during annealing plays a significant role for the gettering of oxygen at buried implantation-damage layers in Cz Si. For both hydrogen and helium implantations, the buried defect layers act as rather effective getter centers for oxygen and hydrogen at appropriate conditions. The more efficient gettering of oxygen during post-implantation annealing in a hydrogen ambient can be attributed to a hydrogen-enhanced diffusion of oxygen towards the buried implantation-damage layers, where a fast oxygen accumulation occurs. Oxygen concentrations well above 10¹⁹ cm^-3 can be obtained. From the comparison of measurements on hydrogen-implanted Cz Si and Fz Si one can conclude that at the buried defect layers hydrogen is most probably trapped by voids and/or may be stable as immobile molecular hydrogen species. Therefore hydrogen accumulated at the defect layers, and is preserved even after high-temperature annealing at 1000 °C. Received: 3 July 2000 / Accepted: 11 July 2000 / Published online: 22 November 2000     

Crystalline quality of 3C-SiC formed by high-fluence C-implanted Si

Carbon ions at 40 keV were implanted into (1 0 0) high-purity p-type silicon wafers at 400 °C to a fluence of 6.5 × 10¹⁷ ions/cm². Subsequent thermal annealing of the implanted samples was performed in a diffusion furnace at atmospheric pressure with inert nitrogen ambient at 1100 °C. Time-of-flight energy elastic recoil detection analysis (ToF-E ERDA) was used to investigate depth distributions of the implanted ions. Infrared transmittance (IR) and Raman scattering measurements were used to characterize the formation of SiC in the implanted Si substrate. X-ray diffraction analysis (XRD) was used to characterize the crystalline quality in the surface layer of the sample. The formation of 3C-SiC and its crystalline structure obtained from the above mentioned techniques was finally confirmed by transmission electron microscopy (TEM). The results show that 3C-SiC is directly formed during implantation, and that the subsequent high-temperature annealing enhances the quality of the poly-crystalline SiC.     

CEMS study of silicon implanted iron

Thin layers of iron-rich Fe-Si alloys were formed by silicon implantation into iron at room temperature with different energies (100, 200, and 300 keV) and ion doses (2 × 10¹⁷ to 1×10¹⁸ cm^–2). The produced layers were investigated by⁵⁷Fe conversion electron Mössbauer spectroscopy (CEMS) to identify the phases formed by the ion implantation. Auger electron spectroscopy (AES) was used to measure the concentration depth profiles of the implanted silicon. Depending on the implantation parameters different disordered Fe-Si structures were detected. At low doses only magnetic phases were formed while at high doses a non-magnetic phase with a hitherto unknown structure appeared. Annealing of the samples resulted first in the formation of a D0₃-like short-range order and a slow decrease of the non-magnetic phase, and subsequently in the migration of Si out of the investigated depth range.     

Novel approaches for low cost fabrication of SOI

Two trials for low cost manufacture of silicon-on-insulator (SOI) wafers were implemented. Low dose separation by implantation of oxygen (SIMOX) procedure has been conducted on a beam-line ion implanter with mass analyzer. The energy dependence of the formed SOI structure was studied at varied implant dosages. The integrity of the buried oxide (BOX) layer was examined by transmission electron microscopy (TEM) and the threading dislocation in the top silicon layer was evaluated by Secco technique. The results indicated that not only the implanted oxygen dose but also the oxygen ion energy plays an important role in the formation of SOI structure with good crystallinity of top silicon, sharp Si/SiO₂ interfaces and highly integrated BOX layer free of silicon inclusion. For separation by plasma implantation of oxygen (SPIMOX) approach, water plasma, rather than oxygen plasma, was employed to avoid oxygen spread in the implant depth profile. The SPIMOX process using water plasma was carried out on a beam-line ion implanter without mass selector to simulate the plasma implantation procedure. Cross-sectional TEM study revealed that uniform BOX layer was formed under single crystal silicon superficial layer with the present approach. The interfaces between silicon superficial layer, BOX layer and bulk silicon were smooth and sharp. An implant dose window has been identified for fabricating the desirable SOI structure.     

Characterization of nano-depth junctions in silicon by using Photo-Carrier Radiometry (PCR)

Non-contact, non-intrusive Photo-Carrier Radiometry (PCR) was used for monitoring nano-depth junctions in industrial-grade silicon wafers. The silicon wafers were implanted with arsenic to the dose of 5E10¹⁴ cm^-2. The junction depth was in the 30 nm to 100 nm range. Quantitative results for PCR sensitivity to the junction depth and implantation energies are presented. This laser-based carrier-wave technique monitors harmonically photo-excited and recombining carriers and shows great potential advantages for the characterization of multiple semiconductor processes such as ion implantation, ultra shallow junction (USJ) depth determination and other Si wafer process steps.     

Effect of hydrogen defects on nanocrystallite layers of Si solar cells by hydrogen implantation

The Si solar cells were irradiated with high energy hydrogen ions of 10, 30, 60 and 120?keV at the dose rate of 10¹⁷ H⁺ ions (proton)/cm². The structural, optical and electrical properties of the implanted samples and fabricated cells were studied. The implantation induced defects bringing structural changes before and after annealing was evidenced by the transmission electron microscopy. The Raman spectrum showed a change of crystalline to amorphous state at 480?cm^?1 when the sample was implanted by hydrogen ion of 30?keV energy. Formation of nanocrystallite layers were observed after annealing. The electroluminescence images showed that hydrogen-related defect centers were involved in the emission mechanism. The photoluminescence emission from the implanted cells was attributed to nanocrystallite layers. From current–voltage measurements, the conversion efficiencies of implanted Si solar cells were found lower than the un-implanted reference cell. The ion implantation did not passivate the defects rather acted as recombination centers.     

Total dose radiation response of modified commercial silicon-on-insulator materials with nitrogen implanted buried oxide

Nitrogen ions of various doses are implanted into the buried oxide(BOX) of commercial silicon-on-insulator(SOI) materials,and subsequent annealings are carried out at various temperatures.The total dose radiation responses of the nitrogen-implanted SOI wafers are characterized by the high frequency capacitance-voltage(C-V) technique after irradiation using a Co-60 source.It is found that there exist relatively complex relationships between the radiation hardness of the nitrogen implanted BOX and the nitrogen implantation dose at different irradiation doses.The experimental results also suggest that a lower dose nitrogen implantation and a higher post-implantation annealing temperature are suitable for improving the radiation hardness of SOI wafer.Based on the measured C-V data,secondary ion mass spectrometry(SIMS),and Fourier transform infrared(FTIR) spectroscopy,the total dose responses of the nitrogen-implanted SOI wafers are discussed.     

SIMOX SOI埋氧注氮工艺对埋氧中固定正电荷密度的影响

在SIMOX SOI材料的埋氧中注氮是为了增强该类材料的抗辐射能力.通过C-V研究表明，对于埋氧层为150 nm的SIMOX SOI材料来说，当在其埋氧中注入4×10¹⁵cm^-2剂量的氮后，与未注氮埋氧相比，注氮埋氧中的固定正电荷密度显著增加了；而对于埋氧层为375nm的SIMOX SOI材料来说，当注氮剂量分别为2×10¹⁵cm^-2和3×10¹⁵cm^{-2关键词： SIMOX 埋氧 注氮 固定正电荷密度}     

Investigation of helium implantation induced blistering in InP

 Four-inch InP wafers were implanted with 100 keV helium ions with a dose of 5×10¹⁶ cm⁻² and subsequently annealed in air in the temperature range of 225-400°C in order to determine the blistering kinetics of these wafers. An Arrhenius plot of the blistering time as a function of reciprocal temperature revealed two different activation energies for the formation of surface blisters in InP. The activation energy was found to be 0.30 eV in the higher temperature regime of 300-400 °C and 0.74 eV in the lower temperature regime of 225-300 °C. The implantation induced damage was analyzed by cross-sectional transmission electron microscopy, which revealed a band of defects extending from 400-700 nm from the surface of InP. The damage band was found to be decorated with a large number of nanovoids having diameters between 2 and 5 nm. These nanovoids served as precursors for the formation of microcracks inside InP upon annealing, which led to the formation of surface blisters.     

Enhancement of saturation magnetization in Cr-ion implanted silicon by high temperature annealing

Magnetic properties and microstructure of Cr-implanted Si have been investigated by alternating gradient magnetometer (AGM), superconducting quantum interference device (SQUID) magnetometer, and transmission electron microscopy (TEM). p-Type (1 0 0) Si wafers were implanted at 200 keV at room temperature with a dosage of 1 × 10¹⁶ cm⁻² Cr ions and then annealed at 600-900 °C for 5 min. The effect of annealing on the structure and magnetic properties of Cr-implanted Si is studied. The as-implanted sample shows a square M-H loop at low temperature. Magnetic signal becomes weaker after short time annealing of the as-implanted sample at 600 °C, 700 °C, and 800 °C. However, the 900 °C annealed sample exhibits large saturation magnetization at room temperature. TEM images reveal that the implanting process caused amorphization of Si, while annealing at 900 °C led to partial recovery of the crystal. The enhancement of saturation magnetization can be explained by the redistribution and accumulation of Cr atoms in the vacancy-rich region of Si during annealing.     

Ion beam modification of silicide-silicon interfaces

We have modified the contact interface between Pd₂Si and n-Si by ion implantation and investigated the effect of the implantation on Schottky barrier height and rate of silicide formation by electrical current-voltage measurements and Rutherford backscattering spectroscopy. Various ions, As. P, B. O and Si at 50 keV and up to a dose of 5 × 10¹⁴ ions/cm² were implanted into Si wafers before the Pd-deposition to form Pd₂Si. In the case of As and P, the implantation showed a large erect on the subsequent Pd₂Si formation; the formation is enhanced in the as-implanted samples, but it is retarded if an annealing at 600°C precedes the Pd-deposition. Silicide formation was found generally to help reduce the implantation damage (with or without the 600°C annealing) and showed improvements on the electrical characteristics of the contact interface. Consumption of the entire implanted region by silicide formation is found necessary for obtaining a good diode performance. In the case of As implantation, a lowering of the Schottky barrier height of Pd₂Si has been observed.     

Synthesis of molybdenum silicide by both ion implantation and ion beam assisted deposition

Two groups of Mo/Si films were deposited on surface of Si(1 0 0) crystal. The first group of the samples was prepared by both ion beam assisted deposition (IBAD) and metal vapor vacuum arc (MEVVA) ion implantation technologies under temperatures from 200 to 400 °C. The deposited species of IBAD were Mo and Si, and different sputtering Ar ion densities were selected. The mixed Mo/Si films were implanted by Mo ion with energy of 94 keV, and fluence of Mo ion was 5 × 10¹⁶ ions/cm². The second group of the samples was prepared only by IBAD under the same test temperature range. The Mo/Si samples were analyzed by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), sheet resistance, nanohardness, and modulus of the Mo/Si films were also measured. For the Mo/Si films implanted with Mo ion, XRD results indicate that phase of the Mo/Si films prepared at 400 and 300 °C was pure MoSi₂. Sheet resistance of the Mo/Si films implanted with Mo ion was less than that of the Mo/Si films prepared without ion implantation. Nanohardness and modulus of the Mo/Si films were obviously affected by test parameters.     

Optimising dislocation-engineered silicon light-emitting diodes

This article presents a study of the possibilities of optimising the electroluminescence (EL) efficiency of dislocation-engineered silicon light-emitting diodes (DELEDs). The diodes were produced by implantation of boron in n-type (100)Si wafers, at a constant ion energy and fluence, of 30 keV and 1×10¹⁵ ions/cm², respectively. The density and the areal coverage by dislocation loops were varied by applying different annealing times in a rapid thermal processing, from 30 s to 60 min. It is shown that the EL efficiency is directly correlated to the number and areal coverage by the loops. The highest population of loops, ∼5×10⁹ /cm², and an areal coverage of around 50% were achieved for 1–5 min annealing. This loop distribution results in optimal DELEDs, having the highest EL response and the largest increase of EL intensity with operating temperature (80–300 K). The results of this work confirm a previously introduced model of charge-carrier spatial confinement by a local stress induced by the edge of the dislocation loops, preventing carrier diffusion to non-radiative recombination centres and enhancing radiative transitions at the silicon band edge. PACS 85.60.Jb; 78.60.Fi; 61.72.Tt     

离子注入形成SOI结构的界面及埋层的俄歇能谱研究

本文中研究了O⁺(200keV,1.8×10¹⁸/cm²)和N⁺(190keV,1.8×10¹⁸/cm²)注入Si形成SOI(Silicon on Insulator)结构的界面及埋层的化学组成。俄歇能谱的测量和研究结果表明:注O⁺的SOI结构在经1300℃,5h退火后,其表层Si和氧化硅埋层的界面存在一个不饱和氧化硅状态,氧化硅埋层是由SiO₂相和这不饱和氧化硅态组成,而且氧化硅埋层和体硅界面不同于表层Si和氧化硅埋层界面;注N⁺的SOI结构在经1200℃,2h退火后,其氮化硅埋层中存在一个富N的疏松夹层,表层Si和氮化硅埋层界面与氮化硅埋层和体硅界面性质亦不同。这些结果与红外吸收和透射电子显微镜及离子背散射谱的分析结果相一致。还对两种SOI结构界面与埋层的不同特征的原因进行了分析讨论。 关键词：     

Boron electrical activation in dual B+ + N+ + and B+ + Ar+ ion-implanted silicon

Silicon wafers were implanted with 40 keV B⁺ ions and then with 50 keV N⁺ or 100 keV Ar+ ions to doses from 1.2 x 1014 to 1.2 x 1015 cm^–2. The implanted samples were studied using the Hall effect and standard van der Pauw methods. The dependences of the sheet resistivity and the sheet concentration of charge carriers on the annealing temperature in the range from 700 to 1300 K were obtained. Models describing the influence of additional implantation of nitrogen and argon ions on the process of boron electrical activation during annealing are proposed.     

Chemical bonding and interface analysis of ultrathin silicon-nitride layers produced by ion implantation and Electron Beam Rapid Thermal Annealing (EB-RTA)

¹⁵N ₂ ⁺ ions were implanted into c-Si with an energy of 5 keV/atom and fluences ranging from 5×10¹⁶ to 2×10¹⁷ atoms/cm² at RT to form ultrathin silicon-nitride layers (SiN _x ) with different N/Si ratios depending on the fluences (up to an overstoichiometric N/Si ratio of 1.65). The ¹⁵N depth distributions were analysed by the resonant nuclear reaction ¹⁵N(p, )¹²C(E _res=429 keV). The implanted samples were processed by Electron Beam Rapid Thermal Annealing (EB-RTA) at 1150° C for 15 s (ramping up and down 5° C/s). The chemical structure of the ¹⁵N implantation into Si was investigated by EXAFS and NEXAFS. Channeling-RBS (⁴He⁺, E ₀=1.5 MeV) measurements were performed to observe the transition region (disordered-Si layer, d-Si) being underneath of the SiN _x layer (typical values of layer thicknesses:SiN _x 24 nm, d-Si 6 nm).     

Formation of high-conductivity NiSi2 layers on Si at zero-mismatch temperature by high-current Ni-ion implantation

2 and Si lattices at 380 °C, which was defined as zero-mismatch temperature. The implantation was conducted with a metal vapor vacuum arc (MEVVA) ion implanter at an extraction voltage of 45 kV. Based on a thermal conduction estimation, a temperature rise of 380 °C required the Ni-ion current density to be 35 μA/cm². For the Si(111) wafers, the high conducting NiSi₂ layers were indeed directly formed after Ni-ion implantation with this specific current density to a normal dose of 2×10¹⁷ ions/cm² and the resistivity was as low as 9 μΩ cm. For the Si(111) wafers pre-covered with a 10-nm Ni overlayer, the resistivity of the NiSi₂ layers obtained under the same conditions decreased down to about 6 μΩ cm. The superior electrical property of the NiSi₂ was thought to be related to its formation temperature, i.e. at a zero-mismatch temperature of 380 °C, which resulted in minimizing the stress and stress-induced defects involved in its formation as well as cooling process. Received: 27 April 1998 / Accepted: 26 October 1998