Novel method for the preparation of poly(urethane–imide)s and their properties

A polymer blend consisting of polyimide (PI) and polyurethane (PU) was prepared by means of a novel approach. PU prepolymer was prepared by the reaction of polyester polyol and 2,4-tolylenediisocyanate (2,4-TDI) and then end-capped with phenol. Poly(amide acid) was prepared from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). A series of oligo(amide acid)s were also prepared by controlling the molar ratio of PMDA and ODA. The PU prepolymer and poly(amide acid) or oligo(amide acid) solution were blended at room temperature in various weight ratios. The cast films were obtained from the blend solution and treated at various temperatures. With the increase of polyurethane component, the films changed from plastic to brittle and then to elastic. The poly(urethane–imide) elastomers showed excellent mechanical properties and moderate thermal stability. The elongation of films with elasticity was more than 300%. The elongation set after the breaking of films was small. From the dynamic mechanical analysis, all the samples showed a glass transition temperature (T_g) at ca. −15°C, corresponding to T_g of the urethane component, suggesting that phase separation occurred between the two polymer components, irrespective of polyimide content. TGA and DSC studies indicated that the thermal degradation of poly(urethane–imide) was in the temperature range 250–270°C. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35: 3745–3753, 1997     

Synthesis of poly(urethane‐imide) using aromatic secondary amine‐blocked polyurethane prepolymer

A set of poly(urethane‐imide)s were prepared using blocked Polyurethane (PU) prepolymer and pyromellitic dianhydride (PMDA). The PU prepolymer was prepared by the reaction of polyether glycol and 2,4‐tolylene diisocyanate, and end capped with N‐methyl aniline. The PU prepolymer was reacted with PMDA until the evolution of carbon dioxide ceased. The effect of tertiary amine catalysts, organo tin catalysts, solvents, and reaction temperature were studied and compared with the poly(urethane‐imide) prepared using phenol‐blocked PU prepolymer. N‐methyl aniline blocked PU prepolymer gave a higher molecular weight poly(urethane‐imide) at a lower reaction temperature in a shorter time. Amine catalysts were found to be more efficient than organo tin catalysts. The reaction was favorable in particular with N‐ethylmorpholine and diazabicyclo(2.2.2)octane (DABCO) as catalysts, and dimethylpropylene urea as a reaction medium. The poly(urethane‐imide)s were characterized by FTIR, GPC, TGA, and DSC analyses. The molecular weight decreased with an increase in reaction temperature. The thermal stability of the PU was found to increase by the introduction of imide component. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 4032–4037, 2000     

Pretilt angle for BTDA,PMDA and CPDA series polyimides with various side chain lengths

Polyamic acid precursors were prepared by mixing dianhydride of 3,3',4,4'-benzophenone-tetracarboxylic dianhydride (BTDA), 1,2,3,4-benzene-tetracarboxylic dianhydride (pyrromellitic dianhydride PMDA), cis-1,2,3,4-cyclopentane-tetracarboxylic dianhydride (CPDA), the diamine (alkyl 3,5-diaminobenzoate) with side chain, and 4,4'-oxydianiline (ODA) without side chain. Copolyimide films with various side chain lengths were prepared by thermal imidization of polyamic acid precursors. The roughness of rubbed polyimide surface increased with increase in the side chain length. The pretilt angle for the BTDA and PMDA series polyimide (PI) increased exponentially with increase in side chain length. Various pretilt angles were obtained on the synthesized polyimides. In the case of CPDA series PI, the pretilt angle was nearly constant at 0 until the alkyl side chain length reached 12 (C12) and then increased markedly at C18. Models of pretilt angle generation were tested.     

High performance polymer films 4. Mechanical behavior

Tensile properties of the polyimide and copolyimide films based on two dianhydrides, pyromellitic dianhydride (PMDA) and 3,3^′,4,4^′-benzophenonetetracarboxylic dianhydride (BTDA) and two diamines, 4,4^′-oxydianiline (ODA), and a proprietary aromatic diamine (PD) have been described. The tensile strength of the films containing higher proportions of BTDA or PMDA and PD is much higher (except the fully rigid film based on PMDA-PD which is brittle in nature) than the films containing higher proportion of ODA moiety. The films containing PD as the diamine moiety exhibit high initial moduli than the films containing exclusively or mainly ODA as the diamine moiety. The films having higher concentration of the -O- linkage originated from diamine ODA are found to exhibit higher elongation values. There is found to be no direct correlation between η_inh of the precursor casting solutions and mechanical properties of structurally different polyimide/copolyimide films. For a particular polyimide or copolyimide film, the tensile strength value is found to be less sensitive than the elongation to the variation of η_inh value of the precursor poly(amic acid) or copoly(amic acid). Tensile strength and elongation of the film, basically rigid in nature, may be improved by post-curing at 360°C/370°C. While Kapton H film retains 78% and 63.5% of its tensile strength and % elongation at break (% E_b) respectively after hot-wet mechanical test, the film based on BTDA 80, PMDA 20 and PD shows an increase of about 27% and 22% in its tensile strength and % E_b respectively.     

Thermal and dynamic mechanical properties of epoxy resin/poly(urethane‐imide)/polyhedral oligomeric silsesquioxane nanocomposites

Linear isocyanate‐terminated poly(urethane‐imide) (PUI) with combination of the advantages of polyurethane and polyimide was directly synthesized by the reaction between polyurethane prepolymer and pyromellitic dianhydride (PMDA). Then octaaminophenyl polyhedral oligomeric silsesquioxane (OapPOSS) and PUI were incorporated into the epoxy resin (EP) to prepare a series of EP/PUI/POSS organic–inorganic nanocomposites for the purpose of simultaneously improving the heat resistance and toughness of the epoxy resin. Their thermal degradation behavior, dynamic mechanical properties, and morphology were studied with thermal gravimetric analysis (TGA), dynamic mechanical analysis (DMA), and transmission electron microscope (TEM). The results showed that the thermal stability and mechanical modulus was greatly improved with the addition of PUI and POSS. Moreover, the EP/PUI/POSS nanocomposites had lower glass transition temperatures. The TEM results revealed that POSS molecules could self assemble into strip domain which could switch to uniform dispersion with increasing the content of POSS. All the results could be ascribed to synergistic effect of PUI and POSS on the epoxy resin matrix. Copyright © 2010 John Wiley & Sons, Ltd.     

Polyimide containing internal acetylene units linked para to the aromatic ring

4,4′-Diaminodiphenylacetylene (p-intA) was reacted with 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) in N-methyl-2-pyrrolidone (NMP) to give poly(amic acid) solution of moderate to high viscosity. Thermal imidization gave polyimide having acetylene units that are linked para to the aromatic connecting unit. Polyimide having acetylene units that are linked meta to the aromatic connecting unit also was prepared utilizing 3,3′-diaminodiphenylacetylene (m-intA) for comparison. The crosslinking behavior of the acetylene units was observed with DSC. Exotherm due to the crosslinking of the para-linked acetylene units appeared at ca. 340 to 380°C depending on the structure of polyimide, whereas meta-linked acetylene units appeared at lower temperature as 340–350°C. After thermal treatment at high temperature such as 350 or 400°C, the amount of the exotherm became smaller and finally disappeared on DSC, confirming the progress of crosslinking. Dynamic mechanical properties of the polyimide films show that glass transition temperature increased with higher heat treatment, also confirming the progress of crosslinking. Tensile properties of the polyimide films showed that rigid polyimide films consisting of p-intA with BPDA or PMDA have considerably higher modulus than those consisting of m-intA. Cold-drawing of the poly(amic acid) followed by imidization gave much higher modulus in the case of rigid polyimide. © 1997 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 35 : 2395–2402, 1997     

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002     

Preparation and characterization of a polyimide membrane

Two different polyimide semipermeable membranes have been prepared from two base polyimides of PMDA/ODA and BTDA/ODA by incorporation of lithium chloride with the respective poly(amic acids) and subsequently leaching out the maximum possible lithium chloride by water at slightly elevated temperature. The water and various organic vapor permeability of the lithium chloride modified films has been found to be better compared to the respective control films. BTDA/ODA based polyimide films show overall lower permeability.     

Synthesis and characterization of soluble polyimides derived from a novel unsymmetrical diamine monomer: 1,4-(2′,4″-diaminodiphenoxy)benzene

A new aromatic unsymmetrical diamine monomer, 1,4-(2′,4″-diaminodiphenoxy)benzene (OAPB), was successfully synthesized in three steps using hydroquinone as starting material and polymerized with various aromatic tetracarboxylic acid dianhydrides, including 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA), 2,2′-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride (6FDA) and pyromellitic dianhydride (PMDA) via the conventional two-step thermal or chemical imidization method to produce a series of the unsymmetrical aromatic polyimides. The polyimides were characterized by solubility tests, viscosity measurements, IR, ¹H NMR, and ¹³C NMR spectroscopy, X-ray diffraction studies, and thermogravimetric analysis. The polyimides obtained had inherent viscosities ranged of 0.38-0.58 dL/g, and were easily dissolved in common organic solvents. The resulting strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 505 °C and the glass transition temperature in the range of 230-299 °C. Moreover, the polymer films showed outstanding mechanical properties with the tensile strengths of 41.4-108.5 MPa, elongation at breaks of 5-9% and initial moduli of 1.15-1.68 GPa.     

The effect of orientation on thermal expansion behavior in polyimide films

The anisotropy of the thermal expansion of polyimide films was investigated . Out-of-plane or thickness direction coefficients of linear thermal expansion (CTE) were calculated from the difference between the coefficient of volumetric expansion (CVE) and the sum of the in-plane or film direction coefficients of linear thermal expansion for commercial and spin-coated PMDA//ODA and BPDA//PPD films and spin coated BTDA//ODA/MPD films. The CVEs were obtained from a pressure-volume-temperature (PVT) technique based on Bridgeman bellows. The CVE was shown to be essentially constant, independent of molecular orientation and thickness. A decrease in the in-plane CTEs therefore occurs at the expense of an increase in the out-of-plane CTE. In all cases the calculated out-of-plane CTE was higher than the measured in-plane CTE. The ratio of the out-of-plane CTE to the in-plane CTE was 1.2, 3.8, and 49.3 for the spin-coated BTDA//ODA/MPD, PMDA//ODA, and BPDA//PPD films, respectively. © 1994 John Wiley & Sons, Inc.     

Dielectric properties of oxydianiline‐based polyimide thin films according to the water uptake

For polyimide thin films, the dielectric properties were investigated with the capacitance and optical methods. The dielectric constants of the 4,4′‐oxydianiline (ODA)‐based polyimide thin films varied from 2.49 to 3.10 and were in the following decreasing order: 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA)–ODA > 1,2,4,5‐benzenetetracarboxylic dianhydride (PMDA)–ODA > 4,4′‐hexafluoroisopropylidene diphthalic dianhydride (6FDA)–ODA. According to the absorption of water, the diffusion coefficients in the films varied from 4.8 × 10^?10 to 7.2 × 10^?10 cm²/s and were in the following increasing order: BPDA–ODA < PMDA–ODA < 6FDA–ODA. The dielectric constants and diffusion coefficients of the polyimides were affected by the morphological structures, including the molecular packing order. However, because of the water uptake, the changes in the dielectric constants in the polyimide thin films varied from 0.49 to 1.01 and were in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. Surprisingly, 6FDA–ODA with bulky hexafluoroisopropylidene groups showed less of a change in its dielectric constant than PMDA–ODA. The total water uptake for the polyimide thin films varied from 1.43 to 3.19 wt % and was in the following increasing order: BPDA–ODA < 6FDA–ODA < PMDA–ODA. This means that the changes in the dielectric constants in the polyimide thin films were significantly related to the morphological structure and hydrophobicity of hexafluoroisopropylidene groups. Therefore, the morphological structure and chemical affinity in the polyimide thin films were important factors in controlling the dielectric properties. © 2002 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 40: 2190–2198, 2002     

Spontaneous molecular orientation of polyimides induced by thermal imidization (5). Effect of ordered structure formation in polyimide precursors on CTE

Six poly(amic acid) (PAA) systems based on pyromellitic dianhydride (PMDA) formed some ordered structures with optical anisotropies clearly detectable on an optical polarizing microscope (POM) in N-methyl-2-pyrrolidone (NMP) at room temperature at high solute concentrations (15-25 wt.%) with complete sol-gel transition reversibility, whereas PAA systems based on 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with a variety of diamine components showed no optical anisotropy in solution. However, a fluorescence probe technique combined with solution viscosity measurements suggested that a PAA derived s-BPDA with 1,4-phenylenediamine (PDA), i.e., PAA(s-BPDA/PDA) forms some ordered structure with a POM-undetectable very local scale during prolonged storage in NMP at room temperature. The introduction of the biphenyldiimide (BPDI) units at 33% into the PAA(s-BPDA/PDA) main chains by copolymerization allowed the formation of optically anisotropic gels with a smectic liquid crystal-like ordered structure by cooling the NMP solution at −20 °C. PI films derived from s-BPDA with PDA, i.e., PI(s-BPDA/PDA) were prepared upon thermal imidization of the BPDI-containing PAA films dried at 40 °C for 2.5 h. An increase in the BPDI content caused a gradual decrease in the linear coefficient of thermal expansion (CTE) of the PI films. This can be interpreted as a result of an intensified pre-orientation at the stage of the PAA cast films by incorporation of the BPDI units. When the BPDI-containing PAA solutions were heated at 70 °C for 4 min prior to the drying process at 40 °C, the ordered structures can be cancelled without imidization, and the CTE values of the resulting PI films appreciably increased compared to the case without heating at 70 °C. A similar effect was observed even in the BPDI-free original s-BPDA/PDA system. The results suggest the presence of a POM-undetectable very locally ordered structure in the PAA cast films, which promotes the pre-orientation of the PAA chains in the cast films and consequently can contribute to a further decrease in the CTE of the PI(s-BPDA/PDA) films.     

Synthesis and characterization of poly(amideimide)s containing pendent flexible alkoxy chains

A series of aromatic diacylhydrazides containing pendent flexible alkoxy chains, viz., 5-butyloxyisophthalicacid dihydrazide, 5-octyloxyisophthalicacid dihydrazide, 5-dodecyloxyisophthalicacid dihydrazide and 5-hexadecyloxyisophthalicacid dihydrazide were synthesized by the hydrazinolysis reaction of the corresponding aromatic esters with hydrazine hydrate. Diacylhydrazides were each polycondensed with aromatic dianhydrides, viz., 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA) to obtain new poly(amideimide)s. Poly(amideimide)s had inherent viscosity in the range 0.55-0.88 dL/g in N,N-dimethylacetamide (DMAc) at 30 ± 0.1 °C. Poly(amideimide)s were found to be soluble in DMAc, N,N-dimethylformamide (DMF), 1-methyl-2-pyrrolidinone (NMP) and pyridine and could be cast into tough, flexible and transparent films from a solution in DMAc. X-ray diffractograms revealed that poly(amideimide)s with longer alkoxy chains had layered structures. Glass transition temperature of poly(amideimide)s containing pendent flexible alkoxy chains were in the range 215-245 °C. Temperature at 10% weight loss was in the range 380-410 °C in nitrogen atmosphere indicating good thermal stability of poly(amideimide)s.     

Synthesis of soluble and thermally stable polyimides from unsymmetrical diamine containing 2,4,5-triaryl imidazole pendent group

A novel unsymmetrical diamine monomer containing triaryl imidazole pendant group, 4-[4-(4,5-diphenyl-1H-imidazol-2-yl)phenoxy] benzene-1,3-diamine (DAI), was successfully synthesized via aromatic substitution reaction of 1-chloro-2,4-dinitrobenzene with 4-(4,5-diphenyl-1H-imidazol-2-yl)phenol, followed by palladium-catalyzed hydrazine reduction. The diamine monomer DAI polymerized with commercial available dianhydrides such as benzophenone tetracarboxylic dianhydride (BTDA), pyromellitic dianhydride (PMDA) and bicyclo[2.2.2]-oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BCDA) by using two step synthetic methods to obtain corresponding polyimides (PIs). PIs had inherent viscosity of 0.42-0.51 dL/g and exhibited excellent solubility in aprotic polar solvents such as N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidone (NMP), N,N-dimethylformamide (DMF), pyridine and methyl sulfoxide (DMSO). PIs showed high glass transition temperatures between 230 and 320 °C, and they were fairly stable up to a temperature above 300 and 450 °C depending on the dianhydride monomer used for the PIs preparation.     

Preparation of reflective and electrically conductive surface-silvered polyimide films from silver(I) complex and PMDA/ODA via an in situ single-stage technique

Optically reflective and/or electrically conductive surface-silvered polyimide films have been prepared by thermal curing of the (1,1,1-trifluoro-2,4-pentadionato) silver(I) (AgTFA)-containing poly(amic acid) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide. Films with specular reflectivity of 20-40% and surface electrical resistivity less than 7 Ω/sq were obtained. Two different thermal curing cycles were applied for the imidization and silver reduction process, and film conductivity were only obtained under rapid thermal treatment. The metallized films exhibit mechanical properties close to that of the parent polyimide films. Films were characterized by dynamic mechanical thermal analysis, X-ray diffraction, transmission electron microscopy, atomic force microscopy and mechanical measurements.     

Preparation and absorption spectrum studies of aromatic and alicyclic poly(amide acid) ammonium salts in water and DMF and in films

A series of ammonium salts of poly(amide acid)s (PAS) were prepared from various poly(amide acid)s (PAA) with tertiary amines. The solubility of poly(amide acid) ammonium salts prepared from PAA(PMDA/ODA) in water is related to the ion concentration of tertiary amines. In order to elucidate the influence of the chemical structures of poly(amide acid)s and poly(amide acid) ammonium salts on their absorption spectra, pyromellitic dianhydride (PMDA), 3,3′,4,4 ′-biphenyltetracarboxylic dianhydride (BPDA), and 3,3′,4,4 ′-benzophenonetetracarboxylic dianhydride (BTDA) were chosen to react with p-phenylenediamine (PDA) and (4,4′-diaminodicyclohexyl)methane (DCHM) to give three kinds of aromatic PAAs and three kinds of alicyclic PAAs. The corresponding PASs were prepared by the reaction of PAAs with triethanolamine (TEA). Their ultraviolet–visible (UV–vis) absorption spectra were investigated compared to those of model compounds. A transparent film without absorption above 320 nm was obtained for PAS(PMDA/DCHM). The difference in absorption spectra of PAS(PMDA/PDA) from that of PAS(PMDA/DCHM) can be related to the existence of intra- and intermolecular charge transfer (CT) for PAS(PMDA/PDA). The absorption spectra of PASs with PDA in films are red shifted compared to those of corresponding PAAs in films, while the absorption spectra of PASs in water are blue shifted compared to those of corresponding PAAs in DMF. No differences in the absorption spectra of PAAs and PASs were found in DMF/H₂O (9/1) mixed solvent. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 1329–1340, 1998     

Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

The mechanism of negative coefficient of thermal expansion (CTE) generation for non-stretched polyimide (PI) films is proposed in this work. Negative CTE behavior was observed in some miscible binary blend films composed of a major fraction of a rod-like semi-crystalline PI derived from pyromellitic dianhydride (PMDA) with p-phenylenediamine (PDA) and flexible PIs based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) whereas homo PMDA/PDA PI film shows a considerably low but a positive CTE value. The results suggest that the negative CTE generation is related to not only a considerably high extent of in-plane orientation of the PMDA/PDA chains but also to the crystallinity of the blends. The present work revealed that some other PIs, a poly(ester imide), and a polybenzoxazole system also display negative CTE and these systems also possess extremely high extents of in-plane chain orientation without exception. In addition to CTE, the morphologies were monitored as a function of imidization temperature for two PI systems, PMDA/2,2′-bis(trifluoromethyl)benzidine and PMDA/m-tolidine by wide-angle X-ray diffraction, FT-IR spectroscopy, birefringence, and film density measurements. The results suggested that the negative CTE phenomenon occurs when PI films possess very high extents of in-plane orientation and a less crystalline morphology simultaneously, thereby significant thermal expansion can be allowed to the thickness direction.     

Synthesis and characterization of novel fluorinated polyimides derived from 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane and aromatic dianhydrides

A novel fluorinated aromatic diamine 1,1′-bis(4-aminophenyl)-1-(3-trifluoromethylphenyl)-2,2,2-trifluoroethane (6FDAM) was synthesized in a simple procedure, which was then employed to prepare a series of fluorinated polyimides with commercial aromatic dianhydrides, such as pyromellitic dianhydride (PMDA), 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane (6FDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-oxydiphthalic anhydride (ODPA). The polyimides exhibited good solubility in strong dipolar solvents such as NMP, DMAc, DMF and m-cresol as well as some of low boiling point organic solvents of THF and CHCl₃, etc. Experimental results indicated the polyimides possessed low moisture adsorptions of 0.42-0.95%, low dielectric constant of 2.71-2.95 at 1 MHz, high dielectric strength of 92.0-122.6 kV/mm and good optical transparency with cutoff wavelengths of UV-vis at 330-375 nm. The polyimides also exhibited good mechanical properties as well as excellent thermal and thermo-oxidative stability. The fluorinated polyimides possessed better solubility, lower dielectric constant and water adsorption as well as higher optical transparency than the representative non-fluorinated polyimide derived from PMDA and 4,4′-oxydianiline (ODA).     

Synthesis of benzophenone tetracarboxylic dianhydride and pyromellitic dianhydride incorporated biscitraconimides and their thermal polymerization

Biscitraconimides incorporated with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) were synthesised. Their curing behavior as well as thermal stabilities were investigated. The intermediate amic acids were prepared by the reaction of 4-amino 4′-citraconamic acid diphenyl sulphone, 4-amino 4′-citraconamic acid diphenyl ether, and 12-amino 1-citraconamic acid dodecane with BTDA and PMDA, respectively. Six amic acids formed were then imidized by cyclocondensation with acetic anhydride. The imide monomers were obtained and these were cured at 225–240°C. The thermal stabilities of the polymers so formed were investigated and compared. © 1996 John Wiley & Sons, Inc.     

Influence of Steric Hindrance Between Hydrogen Atoms of Linkage Groups and Adjacent Phenyls on Properties of Polyimide

A diamine monomer 4,4′-methylenedianiline(MDA) was introduced to modify the polyimide of pyromellitic dianhydride(PMDA) and 4,4′-oxydianiline(ODA) by polycondensation. A series of polyamic acids was synthesized from MDA and ODA of different molar ratios with PMDA of sum mole of moles of MDA and ODA, and polyimide films were obtained by thermal imidization. Polyimide(PI) films were characterized by tensile testing, dynamic mechanical analysis(DMA), thermal gravimetry analysis(TGA), Fourier transform infrared spectroscopy (FTIR), wide X-ray diffraction(WAXD) and molecular simulation. With the increase of MDA content, the tensile strength and thermal decomposition temperature remained generally stable compared with those of PMDA/ODA polyimide. Unexpectedly, the glass transition temperature(T_g) and Young’s modulus increased from 388.7 ℃ and 2.37 GPa to 408.3 ℃ and 5.74 GPa, respectively. The results of WAXD and molecular simulation indicate the steric hindrance among hydrogen atoms of the linkage groups and adjacent phenyls enhanced the properties of the polyimide modified with MDA.