Spontaneous molecular orientation of polyimides induced by thermal imidization (4): Casting- and melt-induced in-plane orientation

Driving forces of in-plane chain orientation of polyimides (PIs) and their precursors were discussed and the mechanisms were proposed. A polyimide precursor, poly(amic acid) (PAA) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) with p-phenylenediamine (PDA) showed a certain degree of in-plane orientation in its solution-casting process and clear molecular weight dependence. The results allowed us to propose the casting-induced in-plane orientation mechanism of the rigid PAA chains. The imidization-induced in-plane orientation mechanism was also discussed by investigating how residual solvent content influences the degree of in-plane orientation of resultant PI films. The results suggested that the magnitudes of the PI chain in-plane orientation are dominated by a combined effect of the initial PAA orientation, apparent stretching based on a great thickness decrease, and the molecular mobility during thermal imidization. In a system derived from s-BPDA with 2,2′-bis(trifluoromethyl)benzidine (TFMB), the effect of molecular mobility during thermal imidization was predominant when cured under usual thermal conditions owing to the presence of the trifluoromethyl groups contributing to weakened intermolecular interaction. In s-BPDA/TFMB and s-BPDA/m-TOL systems (m-TOL = m-tolidine), a melt-induced in-plane orientation phenomenon was observed at temperatures corresponding to their T_g’s when the extents of in-plane chain orientation (f values) were monitored as a function of temperature in the stepwise heating process. This behavior is very curious because there are no appreciable dimensional, morphological, and structural changes as some driving forces just above the T_g of s-BPDA/TFMB.     

Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

The mechanism of negative coefficient of thermal expansion (CTE) generation for non-stretched polyimide (PI) films is proposed in this work. Negative CTE behavior was observed in some miscible binary blend films composed of a major fraction of a rod-like semi-crystalline PI derived from pyromellitic dianhydride (PMDA) with p-phenylenediamine (PDA) and flexible PIs based on 2,3,3′,4′-biphenyltetracarboxylic dianhydride (a-BPDA) whereas homo PMDA/PDA PI film shows a considerably low but a positive CTE value. The results suggest that the negative CTE generation is related to not only a considerably high extent of in-plane orientation of the PMDA/PDA chains but also to the crystallinity of the blends. The present work revealed that some other PIs, a poly(ester imide), and a polybenzoxazole system also display negative CTE and these systems also possess extremely high extents of in-plane chain orientation without exception. In addition to CTE, the morphologies were monitored as a function of imidization temperature for two PI systems, PMDA/2,2′-bis(trifluoromethyl)benzidine and PMDA/m-tolidine by wide-angle X-ray diffraction, FT-IR spectroscopy, birefringence, and film density measurements. The results suggested that the negative CTE phenomenon occurs when PI films possess very high extents of in-plane orientation and a less crystalline morphology simultaneously, thereby significant thermal expansion can be allowed to the thickness direction.     

Thermal imidization of poly(pyromellitic dianhydride-4,4′-oxydianiline) precursors on fluoropolymers modified by surface graft-copolymerization with glycidyl methacrylate

Composite films of polyimide (PI) and poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) or of PI and poly(tetrafluoroethylene) (PTFE) were prepared by thermal imidization of the poly(amic acid) (PAA) precursors of poly(pyromellitic dianhydride-4,4′-oxydianiline) (PMPA-ODA) on glycidyl methacrylate (GMA) graft-copolymerized FEP and PTFE films. The resulting PI/GMA-g-FEP and PI/GMA-g-PTFE composites exhibited T-peel adhesion strength of approximately 7.0 and 6.5 N/cm, respectively, compared to negligible adhesion strength for the laminates prepared from thermal imidization of the PAA on the pristine and the Ar plasma-treated FEP and PTFE films. X-ray photoelectron spectroscopy (XPS) results revealed that both the PI/GMA-g-FEP and PI/FEP-g-PTFE composite films delaminated by cohesive failure inside the FEP and PTFE films, respectively. The so-delaminated PI films with a covalently tethered FEP or PTFE surface layer were highly hydrophobic, having static water contact angles above 140°. The highly hydrophobic property depends on both the composition and roughness of the delaminated surface.     

Synthesis and characterization of soluble polyimides derived from a novel unsymmetrical diamine monomer: 1,4-(2′,4″-diaminodiphenoxy)benzene

A new aromatic unsymmetrical diamine monomer, 1,4-(2′,4″-diaminodiphenoxy)benzene (OAPB), was successfully synthesized in three steps using hydroquinone as starting material and polymerized with various aromatic tetracarboxylic acid dianhydrides, including 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-benzophenone tetracarboxylic dianhydride (BTDA), 2,2′-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride (6FDA) and pyromellitic dianhydride (PMDA) via the conventional two-step thermal or chemical imidization method to produce a series of the unsymmetrical aromatic polyimides. The polyimides were characterized by solubility tests, viscosity measurements, IR, ¹H NMR, and ¹³C NMR spectroscopy, X-ray diffraction studies, and thermogravimetric analysis. The polyimides obtained had inherent viscosities ranged of 0.38-0.58 dL/g, and were easily dissolved in common organic solvents. The resulting strong and flexible PI films exhibited excellent thermal stability with the decomposition temperature (at 5% weight loss) of above 505 °C and the glass transition temperature in the range of 230-299 °C. Moreover, the polymer films showed outstanding mechanical properties with the tensile strengths of 41.4-108.5 MPa, elongation at breaks of 5-9% and initial moduli of 1.15-1.68 GPa.     

Organo-soluble and transparent polyimides containing phenylphosphine oxide and trifluoromethyl moiety: Synthesis and characterization

A series of aromatic polyimides (PI-II_a-d) containing lateral phenylphosphine oxide (PPO) and trifluoromethyl (-CF₃) moiety were prepared from an aromatic diamine, 2,5-bis[(4-amino-2-trifluoromethylphenoxy)phenyl]diphenyl-phosphine oxide (BATFDPO) and various aromatic dianhydrides via a two-step chemical imidization procedure. In parallel, for comparison, another series of polyimides (PI-I_a-d) without trifluoromethyl were synthesized from a diamine, 2,5-bis[(4-aminophenoxy)-phenyl]diphenylphosphine oxide (BADPO) and the same dianhydrides. It was found that both of the two series of polyimides (PIs) were soluble in polar aprotic solvents, such as N-methyl-2-pyrrolidinone (NMP) and the solubility of PI-II_a-d was highly enhanced by the introduction of the bulky -CF₃ group. Flexible and tough PI films with tensile strengths higher than 70 MPa were cast from the PI solution. The introduction of -CF₃ moiety slightly sacrificed the thermal stability and mechanical properties of the PI films. For example, PI-II_a-d showed 5% weight loss at 472-476 ^°C, which was about 50 ^°C lower than those of their PI-I_a-d analogues. However, -CF₃ group apparently improved the optical transparency and decreased the refractive indices of the PI films. PI-II_d derived from BATFDPO and 4,4’-hexafluoroisopropylidenediphthalic anhydride (6FDA) exhibited the highest optical transparency with the transmittance of 90% at 400 nm and the refractive index as low as 1.5511 at 1310 nm.     

Synthesis and characterization of poly(amideimide)s containing pendent flexible alkoxy chains

A series of aromatic diacylhydrazides containing pendent flexible alkoxy chains, viz., 5-butyloxyisophthalicacid dihydrazide, 5-octyloxyisophthalicacid dihydrazide, 5-dodecyloxyisophthalicacid dihydrazide and 5-hexadecyloxyisophthalicacid dihydrazide were synthesized by the hydrazinolysis reaction of the corresponding aromatic esters with hydrazine hydrate. Diacylhydrazides were each polycondensed with aromatic dianhydrides, viz., 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA) and pyromellitic dianhydride (PMDA) to obtain new poly(amideimide)s. Poly(amideimide)s had inherent viscosity in the range 0.55-0.88 dL/g in N,N-dimethylacetamide (DMAc) at 30 ± 0.1 °C. Poly(amideimide)s were found to be soluble in DMAc, N,N-dimethylformamide (DMF), 1-methyl-2-pyrrolidinone (NMP) and pyridine and could be cast into tough, flexible and transparent films from a solution in DMAc. X-ray diffractograms revealed that poly(amideimide)s with longer alkoxy chains had layered structures. Glass transition temperature of poly(amideimide)s containing pendent flexible alkoxy chains were in the range 215-245 °C. Temperature at 10% weight loss was in the range 380-410 °C in nitrogen atmosphere indicating good thermal stability of poly(amideimide)s.     

Preparation, structure and properties of porous polyimide films via PAA/PU alloy

A new route to porous polyimide (PI) films with pore sizes in the nanometer regime was developed. A polyamic acid (PAA)/polyurethane (PU) blend with PU as the disperse phase was first prepared via in situ polymerization of pyromellitic dianhydride and 4,4-oxydianiline in PU solutions. Porous PI films were obtained from PAA/PU films by thermolysis of PU at 360°C and imidization of PAA at 300°C, respectively. Fourier transform infrared spectroscopy and thermal gravimetric analysis were used to detect the imidization and thermolysis processes of PAA/PU blends under thermal treatment. The microporous structure of the PI films was observed by transmission electron microscopy. It was found that the size and content of pores increased with an increase in the PU mass fraction in the PAA/PU blend up to 20%. Because of the existence of nanopores, the dielectric constant of PI films decreased by a wide margin and was less than 2.0 at a PU mass fraction of 20%. It implies that this is an effective means to reduce the dielectric constant of PI, but it also causes the decrease of tensile strength and the rise of water absorption. Translated from Chemistry Journal of Chinese Universities 2006, 27(1): (in Chinese)     

Synthesis and characterization of fluorinated polyimides for pervaporation of n-heptane/thiophene mixtures

Soluble fluoro-polyimides have been synthesized by reacting of a fluorine-containing aromatic dianhydride, 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride, with aromatic diamine to yield poly(amic acid)s which were then cyclized to yield polyimide by chemical imidization method. The polyimides have excellent solubility both in strong bipolar solvents, such as NMP and DMAc, and in common organic solvents, such as THF and dioxane, etc. The glass transition temperature of these polyimides were determined by DSC and ranged from 281 to 289 °C. Thermogravimetric analysis indicated that these polyimides have good thermal stability with initial thermal decomposition temperature of 520-526 °C. The polyimide asymmetric membranes were prepared by phase inversion method and the inner structure was observed by method of SEM. The pervaporation properties of the prepared polyimides asymmetric membranes for n-heptane/thiophene mixtures were investigated at 40-77 °C and the permeation flux and the sulfur enrichment factor of the polyimide membranes are in the range of 0.56-1.68 kg/m² h and 3.12-2.24, respectively. The result demonstrated that the pervaporation method could be very effective method for desulfurization by polyimides asymmetric membranes with ultrathin skin.     

Fabrication of highly refractive BaTiO3 nanocomposite films using heat resistant polymer as matrix

Highly refractive, heat-resistant BaTiO₃ nanocomposite films were fabricated via in situ polymerization to homogeneously disperse barium titanate (BT) nanoparticles into polyimide (PI) matrix. BT nanoparticles surface-modified with O-phosphorylethanol phthalimide (PPHI) were employed to the in situ polymerization in which condensation reactions of a diphthalic anhydride and a diamine were conducted to form the prepolymer of poly(amic acid) (PAA) that was thermally imidized in the following step. The nanoparticles surface-modified were added to PAA solution at different times in the polymerization to examine the effect of PAA molecular weight on the refractive index (RI) of the nanocomposite films, which indicated that relatively low molecular weights (<10,000) of PAA formed at the point of nanoparticle addition was appropriate for enhancement of nanocomposite RI. An additional treatment of chemical imidization using acetic acid anhydride and pyridine, which was followed by the thermal imidization, was performed to examine the effect of polyimide structure on RI of nanocomposite films. The RI of nanocomposite films with excellent thermal stability could be successfully enhanced to n = 1.88 by the chemical imidization.     

Synthesis and characterization of soluble polyimides based on a new fluorinated diamine: 4-Phenyl-2,6-bis[3-(4′-amino-2′-trifluoromethyl-phenoxy) phenyl] pyridine

A new kind of pyridine-containing aromatic diamine monomer, 4-phenyl-2,6-bis[3-(4′-amino-2′-trifluoromethyl-phenoxy) phenyl] pyridine (m-PAFP), was successfully synthesized by a modified Chichibabin reaction of 3-(4′-nitro-2′-trifluoro-methyl-phenoxy)-acetophenone with benzaldehyde, followed by a catalytic reduction. A series of fluorinated pyridine-bridged aromatic poly(ether-imide)s were prepared from the resulting diamine monomer with various aromatic dianhydrides via a conventional two-step thermal or chemical imidization method. The inherent viscosities values of these polyimides were in the range of 0.56-1.02 dL/g, and they could be cast and thermally converted into transparent, flexible, and tough polyimide films. The polyimides displayed higher solubility in polar solvents such as NMP, DMSO and m-cresol. The polyimides had good thermal stability, with the glass transition temperatures (T_g) of 187-211 °C, the temperatures at 5% weight loss of 511-532 °C, and the residue at 800 °C in air was higher than 50%. These films also had dielectric constants of 2.64-2.74 at 10 MHz and low water uptake 0.53-0.66%. Wide-angle X-ray diffraction measurements revealed that these polyimides were predominantly amorphous. Moreover, the polymer films of these novel polyimides showed outstanding mechanical properties with the tensile strengths of 90.1-96.6 MPa, elongations at breakage of 8.9-10.7% and tensile modulus of 1.65-1.98 GPa.     

High strength electrospun polymer nanofibers made from BPDA-PDA polyimide

A series of high molecular weight PI precursors, poly(p-phenylene biphenyltetracarboxamide acid), were synthesized from 3,4,3′,4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) by using intense mechanical stirring at −15 to 0 °C for 48-72 h. The as-synthesized PI precursor solution was used to make BPDA/PDA polyimide thin films and electrospun nanofibers. IR, Ostward Viscometer, CMT-8102 Electromechanical Universal Testing Machine and scanning electron microscope (SEM) were used for the characterizations of the as-synthesized PI precursor, PI films and nanofiber sheets. The high molecular weight BPDA/PDA PI thin films and electrospun nanofiber sheets possess excellent mechanical properties of up to 900 MPa tensile strength with up to 18.0 GPa E-modulus and up to 210 MPa tensile strength with up to 2.5 GPa E-modulus, respectively.     

Unique fluorescence behavior of perylenetetracarboxydiimides in polyimide systems

Perylenetetracarboxydiimide (PEDI) molecularly dispersed in polyamic acid (PAA) and polyimide (PI) films has unique fluorescence properties. An originally strong fluorescence of PEDI is efficiently quenched in the PAA films. The systematic variation of the chain structure of the PAA matrices revealed that the aromatic amide groups in the PAA chains function as a quencher. When a PAA derived from 3,4,3′4′-biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA), BPDA/PDA, was used as a matrix polymer, the fluorescence of the dye dispersed in the film increased abruptly as imidization of the matrix proceeds. But annealing at temperatures higher than 320°C in the step-heating process caused a gradual decrease in the fluorescence intensity. The decreased intensity results from the dye–PDA units interactions intensified by the denser molecular packing of the matrix polymer chains. PEDI shows significant dependence of the fluorescence intensity on the chain structure of the PI matrices. In the various PI films containing a fixed diamine component, the dye fluorescence intensity reduces linearly with an increase in the intramolecular charge transfer ability of the PI matrices. From the result, we propose a fluorescence quenching mechanism through multistep electron transfer processes. The BPDA/PDA polyimide matrix leads to a strong PEDI fluorescence whereas the pyromellitic dianhydride (PMDA)-based PI matrices do not. For the blends composed of these PIs, the fluorescence of PEDI bound into the main chains provides a valuable indicator of the miscibility on the molecular level. © 1998 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 36: 827–840, 1998     

Synthesis and characterization of new polyimides containing pendent pentadecyl chains

A new unsymmetrical aromatic diamine, viz., 4-pentadecylbenzene-1,3-diamine was synthesized through a series of reaction steps starting from 3-pentadecylphenol. 4-Pentadecylbenzene-1,3-diamine was employed to synthesize a series of new polyimides by one-step polycondensation in m-cresol with four commercially available aromatic dianhydrides, viz., 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 4,4′-oxydiphthalic anhydride (ODPA) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6-FDA). Inherent viscosities of resulting polyimides were in the range 0.33-0.67 dL/g and number average molecular weights were in the range 14,700-52,200 (GPC, polystyrene standard). Polyimides containing pendent pentadecyl chains were soluble in organic solvents such as chloroform, m-cresol, N,N-dimethylacetamide (DMAc), 1-methyl-2-pyrrolidinone (NMP), pyridine and nitrobenzene. Strong and flexible films of polyimides could be cast from their chloroform solutions. Polyimides exhibited glass transition temperature in the range 158-206 °C. The temperature at 10% wt. loss (T₁₀), determined by TGA in nitrogen atmosphere, of polyimides was in the range 470-480 °C indicating good thermal stability.     

Pattern formation of polyimide by using photosensitive polybenzoxazole as a top layer

A versatile method for positive-type patterning of polyimide (PI) based on a two-layer photosensitive poly(benzoxazole) (PSPBO) and poly(amic acid) (PAA) film has been developed to provide a promising material in the field of microelectronics. This patterning system consisted of a pristine PAA thick bottom-layer and a poly(o-hydroxy amide) (PHA) thin top layer with 9,9-bis[4-(tert-butoxycarbonyl-methyloxy)phenyl]fluorene (TBMPF) as a dissolution inhibitor, and (5-propylsulfonyloxyimino-5H-thiophene-2-ylidene)-(2-methylphenyl)-acetonitrile (PTMA) as a photoacid generator (PAG). The PHA and PAA were prepared from 4,4′-(hexafluoroisopropylidene)-bis(o-aminophenol) and 4,4′-oxybis(benzoic acid) derivatives, and 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 4,4′-oxydianiline, respectively, in N,N-dimethylacetamide. This two-layer system based on PHA (150-nm thickness) and PAA (1.5-μm thickness) showed high sensitivity of 35 mJ/cm² and high contrast of 10.3 when exposed to a 365 nm line (i-line), post-baked at 100 °C for 2 min, and developed in a 2.38 wt.% tetramethylammonium hydroxide aqueous solution/5 wt.% iso-propanol at 25 °C. A clear positive image of a 4-μm line-and-space pattern was printed on a film which was exposed to 100 mJ/cm² of i-line by a contact-printing mode and fully converted to the corresponding PBO/PI pattern upon heating at 350 °C, confirmed by FT-IR spectroscopy. This two-layer system could be applied to the patterning of various PAAs.     

A novel type of Si-containing poly(urethane-imide)s: synthesis, characterization and electrical properties

A novel type of a Si-containing poly(urethane-imide) (PUI) was prepared by two different methods. In the first method, Si-containing polyurethane (PU) prepolymer having isocyanate end groups was prepared by the reaction of diphenylsilanediol (DSiD) and toluene diisocyanate (TDI). Subsequently the PU prepolymer was reacted with pyromellitic dianhydride (PMDA) or benzophenonetetracarboxylic dianhydride (BTDA) in N-methyl pyrolidone (NMP) to form Si-containing modified polyimide directly. In the second method, PU prepolymer was reacted with diaminodiphenylether (DDE) or diaminodiphenylsulfone (DDS) in order to prepare an amine telechelic PU prepolymer. Finally, the PU prepolymer having diamine end groups was reacted with PMDA or BTDA to form a Si-containing modified polyimide. Cast films prepared by second method were thermally treated at 160 °C to give a series of clear, transparent PUI films. Thermogravimetric analysis indicated that the thermal degradation of PUI starts at 265 °C which is higher than degradation temperature of conventional PU, confirming that the introduction of imide groups improved the thermal stability of PU.To characterize the modified polyimides and their films, TGA, FTIR, SEM and inherent viscosity analyses were carried out. The dielectrical properties were investigated by the frequency-capacitance method. Dielectric constant, dielectric breakdown strength, moisture uptake and solubility properties of the films were also investigated.     

Preparation of nonwoven polyimide/silica hybrid nanofiberous fabrics by combining electrospinning and controlled in situ sol-gel techniques

A controlled in situ sol-gel synthesis combined with the electrospinning technique and postspun imidization was applied in the fabrication of polyimide/silica hybrid nonwoven nanofiberous fabrics with excellent thermal and mechanical performance. The nanofiberous fabrics were prepared by electrospinning of the solution of tetraethoxysilane (TEOS) and polyamic acid (PAA). The different silica contents in the fabrics were achieved by varying the amount of TEOS while fitting the solid content of PAA. The final polyimide/silica fabrics was obtained after imidization of PAA and gelation of silica phase simultaneously accomplished through a step-wise heating process. Some specific IR techniques and other characterizations indicated the successful incorporation of the silicon dioxide (SiO₂) into the PI matrix and the relatively even distribution of the SiO₂ in the fabrics. An increase of 133 °C in the decomposition temperature and 4-fold enhancement of the ultimate tensile strength were achieved for the hybrids with a 6.58 wt.% of SiO₂ content, compared to the pure PI fabric. The excellent performance could be attributed to the good compatibility between the polyimide and silica, and good adhesion among the fibers, which resulted from the controlled TEOS hydrolysis and the simultaneous imidization and gelation process.     

聚酰亚胺硅氧烷/聚酰亚胺两面异性复合膜的制备及性能研究

以氨丙基封端的聚二甲基硅氧烷(PDMS)、 4,4'-二氨基二苯醚(4,4'-ODA)和3,4,3',4'-联苯四酸二酐(s-BPDA)为原料, 合成了聚酰胺酸硅氧烷嵌段共聚物. 将此嵌段共聚物和聚酰胺酸(s-BPDA/4,4'-ODA)共混, 通过控制制膜条件, 利用各组分在不同溶剂中的溶解度的差别, 使聚酰亚胺硅氧烷富集在膜的上表面. 因为两相在结构和性质上的相似性, 当聚酰胺酸硅氧烷和聚酰胺酸混合时, 具有很好的相容性, 消除了两相间的界面, 从而制备了优异的聚酰亚胺硅氧烷/聚酰亚胺两面异性的复合膜材料. 利用X射线光电子能谱(XPS)和水滴接触角对此复合膜进行了表征, 证明了此复合膜的两面异性, 并对此复合膜进行了热性能和机械性能研究, 发现此薄膜保持了聚酰亚胺优异的性能.     

Preparation of Poly(amic acid) and Polyimide via Microwave-Assisted Polycondensation of Aromatic Dianhydrides and Diamines

Summary: A copolycondesation-type poly (amic acid) (PAA) was synthesized using pyromellitic dianhydride (PMDA) and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) as dianhydride monomers, and 4,4′-oxydianiline (ODA) as a diamine monomer under microwave irradiation in dimethylformamide (DMF). PAA was then converted into a polyimide (PI) by an imidization. The structure and performance of the polymer were characterized by Fourier-transform infrared (FT-IR) spectroscopy, Proton nuclear magnetic resonance (¹H NMR) spectrometry, viscosity, X-ray diffraction (XRD), and thermogravimetric (TG) analyses. The results showed that under microwave irradiation, the intrinsic viscosity and the yield of PAA were increases, and the reaction time was shortened. The FT-IR spectra of the polymer revealed characteristic peaks for PI around 1778^– and 1723 cm^–1. TG curves indicated that the obtained PI began to lose weight at 535 °C, and its 10% thermal decomposition temperature under N₂ was 587 °C.     

Preparation and characterization of sulfonated polyimide ionomers via post‐sulfonation method for fuel cell applications

This paper describes our work on the synthesis of a series of sulfonated homo‐/co‐polyimides (SPI) which were obtained by post‐sulfonation method over three steps. In the first step, 4,4′‐oxydianiline (ODA) and 4,4′‐diaminodiphenylsulfone (DDS) dissolved in N‐methyl pyrrolidone (NMP) were reacted with benzophenonetetracarboxylic dianhydride (BTDA) in order to yield poly(amic acid) (PAA). Secondly, precipitated PAA was sulfonated via concentrated sulfuric acid (95–98%) at room temperature to give post‐sulfonated PAA (PSPAA). Finally, PSPAA was converted into post‐sulfonated PI (PSPI) by the thermal imidization method. PSPIs with ion exchange capacity (IEC) ranging from 0.20 to 0.67 meq/g were prepared. The thermal properties of the PSPIs were evaluated and high desulfonation temperature was found in the range of 190–350°C, suggesting the high stability of sulfonic acid groups. In water, PSPI‐5 membrane displayed similar proton conductivity to Nafion®117, whereas this membrane showed poor conductivity in dry state. All PSPIs displayed good solubility in common polar aprotic solvents such as NMP and dimethylacetamide (DMAc). Furthermore, the effects of post‐sulfonation reaction on chemical structure, thermal oxidative behavior, and physical properties of the PSPI membranes such as membrane quality/stability and water uptake were discussed. Copyright © 2008 John Wiley & Sons, Ltd.     

Polyimide–silica hybrid coatings: morphological,mechanical, and thermal investigations

In this study, polyimide–silica (PI–silica) based hybrid coating compositions were prepared from tetraethoxysilane (TEOS), γ‐glycidyloxypropyl trimethoxy silane (GOTMS), and polyamic acid (PAA) via a combination of sol–gel and thermal imidization techniques. PAA was synthesized from 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride (BTDA) and 3,3'‐Diaminodiphenyl sulfone (DDS) in N‐Methyl‐2‐pyrrolidone (NMP). The silica content in the hybrid coatings was varied from 0 to 20 wt%. The structural characterization of the hybrid coatings was performed using FTIR and ²⁹Si‐NMR spectroscopies. Results from both pendulum hardness and micro indentation test show that the hardness of hybrid coatings improves with the increase in silica content. The tensile tests also demonstrated that the mechanical properties at low silica content are rather striking. Their surface morphologies were characterized by scanning electron microscopy (SEM). SEM studies revealed that inorganic particles were distributed homogenously through the PI matrix. It was also found that, incorporation of the silica domains increased the thermal stability of the hybrid coatings. Copyright © 2007 John Wiley & Sons, Ltd.