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为实现对激光雷达回波峰值的测量,介绍了一种应用于激光雷达接收机的回波峰值检测量化电路,采用对电压回波脉冲采样保持的方法配合低速模拟数字转换器(Analog to Digital Converter,ADC)来实现回波峰值的高精度量化。电路采用SMIC 0.18μm工艺设计,仿真结果显示,该电路采样电压动态范围为800 mV,采样3 ns脉宽的脉冲保持电压误差小于3.16%,实现10 bit的量化精度。整体电路采样周期由外部使能信号和复位信号控制,可满足不同场合下激光雷达接收机回波峰值采样的应用需求。 相似文献
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通过调节双稳系统参数实现大参数频率范围内周期信号的随机共振, 在工程上具有重要意义. 推导了双稳系统参数的归一化变换, 利用归一化变换原理对大参数周期信号的随机共振进行了数值仿真, 阐明该原理适用于任意频率周期信号. 对大参数随机共振用电路模拟进行了实验验证, 揭示了通过调节双稳系统参数可以实现大参数频率范围内的随机共振. 分析了二次采样实现大参数周期信号随机共振的机理, 通过数值仿真与参数归一化变换方法进行了比较. 仿真结果表明, 在输入信号幅度变化的情况下, 二次采样方法易出现发散现象, 而归一化变换具有更好的稳定性与适应性. 相似文献
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We proposed in this study a novel analog complementary metal oxide semiconductor (CMOS) circuit for generating a motion signal
when an object moves, which is a simple structure. The proposed unit circuit was constructed using a previously proposed edge
detection circuit and a novel proposed circuit for generating a motion signal which accepts an edge signal. The part for generating
the motion signal was constructed using six metal oxide semiconductor (MOS) transistors and one capacitor. Results obtained
by the simulation program with integrated circuit emphasis (SPICE) and the measured results of a test circuit constructed
with discrete MOS transistors and the test circuit fabricated with a 1.2 μm CMOS process showed that the proposed unit circuit
can output pulsed current (motion signal) when an object moves on the circuit. It was clarified from the SPICE results that
the two-dimensional network constructed with proposed unit circuits can output motion signals. The size of the novel unit
circuit is expected to be about 110 × 110μm2 obtained by the 1.2 μm CMOS process. It is possible to arrange 90 × 90 unit circuits on a chip which has an area of 1 × 1cm2. The aperture ratio is expected to be about 21%, which is twice as large as that of the previously proposed circuit. An integrated
circuit for image processing in real time can thus be realized by applying the two-dimensional network constructed with the
proposed circuits. 相似文献
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In this work,we demonstrate the technology of wafer-scale transistor-level heterogeneous integration of Ga As pseudomorphic high electron mobility transistors(p HEMTs) and Si complementary metal–oxide semiconductor(CMOS) on the same Silicon substrate.Ga As p HEMTs are vertical stacked at the top of the Si CMOS wafer using a wafer bonding technique,and the best alignment accuracy of 5 μm is obtained.As a circuit example,a wide band Ga As digital controlled switch is fabricated,which features the technologies of a digital control circuit in Si CMOS and a switch circuit in Ga As p HEMT,15% smaller than the area of normal Ga As and Si CMOS circuits. 相似文献
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Complementary metal-oxide-semiconductor (CMOS) vision chips for edge detection based on a resistive circuit have recently
been developed. These chips help in the creation of neuromorphic systems of a compact size, high speed of operation, and low
power dissipation. The output of the vision chip depends predominantly upon the electrical characteristics of the resistive
network which consists of a resistive circuit. In this paper, the body effect of the metal-oxide-semiconductor field-effect
transistor for current distribution in a resistive circuit is discussed with a simple model. In order to evaluate the model,
two 160 × 120 CMOS vision chips have been fabricated using a standard CMOS technology. The experimental results nicely match
our prediction. 相似文献
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Ryo Takahashi Tatsushi Nakahara Hirokazu Takenouchi Takako Yasui Hiroyuki Suzuki 《Optical Review》2004,11(2):98-105
A novel scheme for all-optical serial-to-parallel conversion (SPC) is proposed for label recognition of ultrafast asynchronous burst optical packets. Compact SP converter modules were developed using a fiber array or a surfaceemitting planar lightwave circuit, and 1-Tbit/s and 40-Gbit/s SPC for 16-bit optical packets is demonstrated using the modules. The key device in the converter is a spin-polarized surface-reflection all-optical switch (LOTOS) with an ultrafast switching time (250 fs) and an extremely high on/off ratio (>30 dB). Label recognition of 40-Gbit/s 16-bit burst-mode optical packets is experimentally confirmed using an optical clock-pulse generator and a complementary metal-oxide-semiconductor (CMOS) electronics circuit as well as the all-optical SP converter. 1 x 4 self-routing is also demonstrated using 2-channel control signals generated from the CMOS circuit according to a routing table. 相似文献
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In this paper, a typical correlated double sampling (CDS) complementary metal oxide semiconductor (CMOS) circuit for uncooled infrared focal plane array (IRFPA) is theoretically analyzed, the key factor of CDS CMOS integrated circuit is pointed out, and a new CDS integrated circuit which is high correlative for low-frequency noise is applied in an experimental readout chip for uncooled IRFPA. Theoretical analysis indicates that the sample transfer function of a noise source acted on by CDS processing is related to noise frequency and sampling time interval and the key factor of CDS circuit for reducing or eliminating noise in readout integrated circuit is the sampling time interval. The experimental readout chip with high noise-correlative CDS integrated circuit is fabricated to verify the theoretical analysis, which can be applied to uncooled IRFPAs. 相似文献
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Koji Yamamoto Yu Oya Keiichiro Kagawa Masahiro Nunoshita Jun Ohta Kunihiro Watanabe 《Optical Review》2006,13(2):64-68
A complementary metal oxide semiconductor (CMOS) image sensor for the detection of modulated light under background illumination
has been developed. When an object is illuminated by a modulated light source under background illumination the sensor enables
the object alone to be captured. This paper describes improvements in pixel architecture for reducing fixed pattern noise
(FPN) and improving the sensitivity of the image sensor. The improved 128 × 128 pixel CMOS image sensor with a column parallel
analog-to-digital converter (ADC) circuit was fabricated using 0.35-mm CMOS technology. The resulting captured images are
shown and the properties of improved pixel architecture are described. The image sensor has FPN of 1/28 that of the previous
image sensor and an improved pixel architecture comprising a common in-pixel amp and a correlated double sampling (CDS) circuit.
The use of a split photogate increases the sensitivity of the image sensor to 1.3 times that of the previous image sensor. 相似文献
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Sang Joon Hwang Ho Hyun Shin Man Young Sung 《International Journal of Infrared and Millimeter Waves》2008,29(10):953-965
An uncooled microbolometer image sensor, used in an IR image sensor, is made by a micro electro mechanical systems (MEMS)
process, so the value of the microbolometer resistor has a process variation. Also, the reference resistor, which is used
to connect to the microbolometer, is fabricated by a standard CMOS process, and the difference between the values of the microbolometer
resistor and the reference resistor generates an unwanted output signal for the same input from the sensor array. In order
to minimize this problem, a new CMOS read-out integrated circuit (ROIC) was designed. Instead of a single input mode, a differential
input mode scheme and a simple method to compensate the resistor value are proposed. Using results from a computer simulation,
it is observed that the output characteristic of the ROIC was improved and the effect of the process variation was decreased
without using complex compensation circuits. Based on the simulation results, a prototype device including an ROIC that was
fabricated by a standard 0.25um CMOS process and a microbolometer with a 16 x 16 sensor array was fabricated and characterized. 相似文献
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The design of high speed, compact and low power fat tree encoder circuits using static CMOS gates is presented. In this paper, we propose a modified 3 bit fat tree encoder (FTE) that can operate in high frequency without a sophisticated circuit structure. In addition, the technique of hardware sharing is adopted in this design to reduce the number of transistors. The study uses complementary metal oxide semiconductor (CMOS) 45 nm-technology. The proposed static design has improved delay and power compared to a conventional ROM encoder circuit implementation. The simulation result indicates that it functions successfully and works at 200-MHz speed. The average power consumption of the circuit under room temperature is 20.7 nW. The total core area is 0.011 mm2. As expected, the proposed design can be easily integrated in various kind of digital application. 相似文献