Si缓冲层的生长温度对SiGe组分、结构的影响

利用同步辐射X射线高分辨衍射、掠入射表面衍射、原子力显微镜、电子显微镜等手段研究了SiGe外延层的生长质量、组分与作为缓冲层Si的生长温度之间的关系. 研究表明, 在外延薄膜中Ge的含量为32±2%; 当Si缓冲层生长温度在400—500\textcelsius范围内, SiGe外延层质量高, 没有生长位错出现. X射线反射及原子力显微镜则显示对应最光滑的SiGe外延层表面的Si缓冲层的生长温度为450\textcelsius, 相应的表面粗糙度仅为大约15\AA.     

Ge薄层异质结构的同步辐射X射线反射法研究

用X射线反射方法研究了分子束外延技术生长的Si中Ge薄层异质结构的Ge原子分布特性.根据X射线反射理论及Parratt数值计算方法对实验反射曲线的模拟,得到不同厚度的Ge薄层异质结构样品中Ge原子的深度分布为非对称指数形式:在靠近样品表面一侧的衰减长度为8埃,而在靠近样品衬底一侧的衰减长度为3埃,且分布形式与Ge原子层的厚度无关.讨论了不同结构参数(Ge原子薄层的深度、Ge原子分布范围、样品表面粗糙度、样品表面氧化层厚度等)对样品低角反射曲线的影响.     

应变Si沟道nMOSFET阈值电压模型

在研究分析弛豫SiGe衬底上的应变Si 沟道nMOSFET纵向电势分布的基础上,建立了应变Si nMOSFET阈值电压模型,并利用该模型对不同的器件结构参数进行仿真,获得了阈值电压与SiGe层掺杂浓度和Ge组分的关系、阈值电压偏移量与SiGe层中Ge组分的关系、阈值电压与应变Si层掺杂浓度和厚度的关系. 分析结果表明：阈值电压随SiGe层中Ge组分的提高而降低,随着SiGe层的掺杂浓度的提高而增大;阈值电压随应变Si层的掺杂浓度的提高而增大,随应变Si层厚度增大而增大. 该模型为应变Si 器件阈值电压设计 关键词： 应变硅 阈值电压 电势分布 反型层     

Ge薄层异质结构的同步辐射X射线反射法研究

用X射线反射方法研究了分子束外延技术生长的Si中Ge薄层异质结构的Ge原子分布特性．根据X射线反射理论及Parratt数值计算方法对实验反射曲线的模拟,得到不同厚度的Ge薄层异质结构样品中Ge原子的深度分布为非对称指数形式：在靠近样品表面一侧的衰减长度为8埃,而在靠近样品衬底一侧的衰减长度为3埃,且分布形式与Ge原子层的厚度无关。讨论了不同结构参数(Ge原子薄层的深度、Ce原子分布范围、样品表面粗糙度、样品表面氧化层厚度等)对样品低角反射曲线的影响．     

硅基低位错密度厚锗外延层的UHV/CVD法生长

利用超高真空化学气相淀积系统, 基于低温缓冲层和插入应变超晶格的方法, 在Si(100)衬底上外延出厚度约为880 nm的纯Ge层. 采用X射线双晶衍射、高分辨透射电镜、原子力显微镜和光致发光谱分别表征了其结构及光学性质. 测试结果显示外延Ge的X射线双晶衍射曲线半高宽为273", 表面均方根粗糙度为0.24 nm, 位错密度约为1.5×10⁶ cm². 在室温下观测到外延Ge的直接带跃迁光致发光, 发光峰值位于1540 nm. 表明生长的Si基Ge材料具有良好的结晶质量, 可望在Si基光电子器件中得到应用.     

硅/锗基场效应晶体管沟道中载流子散射机制研究进展

随着金属-氧化物-半导体场效应晶体管(Metal-Oxide-Semiconductor Field Effect Transistor,MOSFET)特征尺寸不断减小,应变技术、新沟道材料和新器件结构等技术被学术界及产业界认为是继续提升器件性能的有效方法。本文从应变技术、新沟道材料和新结构器件三个方面研究载流子在输运中的散射机制:(1)应变技术:双轴拉伸应变能够改变载流子在不同能级之间的分布以及沟道的表面粗糙度,从而影响库伦散射和表面粗糙度散射;(2)新沟道材料:在不同晶面的锗(Germanium, Ge)晶体管中,电子在高场条件下的散射存在差异,声子散射在Ge(100)晶体管中占主导,而表面粗糙度散射在Ge(110)、(111)晶体管中占主导。在SiGe晶体管中,合金散射主要作用于有效电场强度比较小的区域;(3)新结构器件:载流子超薄绝缘层上锗(Germanium-on-Insulator, GeOI)晶体管输运时,会同时受到上下界面的影响,库伦散射和表面粗糙度散射随着Ge层厚度降低而增加。Ge层厚度的降低会改变电子在不同能谷间的分布,进而影响电子的散射。     

在Si衬底上用分子束外延低温生长Ge薄膜

本文报道了室温下淀积的薄层Ge在Si衬底表面上通过加热形成结晶的Ge岛,然后在此“带结构”的衬底表面上用分子束外延(MBE)方法生长Ge薄膜的反射式高能电子衍射(RHEED),俄歇电子能谱(AES)研究结果。X射线双晶衍射的测试结果表明,衬底表面的Ge岛有助于释放外延层的失配应力,提高外延层的晶体质量。 关键词：     

Si/Gen/Si(001)异质结薄膜的掠入射荧光X射线吸收精细结构研究

利用掠入射荧光X射线吸收精细结构(XAFS)方法研究了在400℃的温度下分子束外延生长的Si/Gen/Si(001)异质结薄膜(n=1,2,4和8个原子层)中Ge原子的局域环境结构.结果表明,在1至2个Ge原子层(ML)生长厚度的异质结薄膜中,Ge原子的第一近邻配位主要是Si原子.随着Ge原子层厚度增加到4 ML,Ge原子的最近邻配位壳层中的Ge-Ge配位的平均配位数增加到1.3.当Ge原子层厚度增加到8 ML时,第一配位壳层中的Ge-Ge配位占的比例只有55%.这表明在400℃的生长条件下,Ge原子有很强的迁移到Si覆盖层的能力.随着Ge层厚度从1增加到2,4和8 ML,Ge原子迁移到Si覆盖层的量由0.5 ML分别增加到1.5,2.0和3.0 ML.认为在覆盖Si过程中Ge原子的迁移主要是通过产生Ge原子表面偏析来降低表面能和Ge层的应变能.     

用不同的Mo靶溅射功率制备Mo/Si多层膜

 用磁控溅射法制备了周期厚度和周期数均相同的Mo/Si多层膜，用原子力显微镜和小角X射线衍射分别研究了Mo靶溅射功率不相同时，Mo/Si多层膜表面形貌和晶相的变化。随后在国家同步辐射实验室测量了Mo/Si多层膜的软X射线反射率。研究发现，随着Mo靶溅射功率的增大，Mo/Si多层膜的表面粗糙度增加，Mo的特征X射线衍射峰也增强，Mo/Si多层膜的软X射线峰值反射率先增大后减小。     

氧化SiGe/Si多量子阱制备Si基SiGe弛豫衬底

SiGe弛豫衬底是制备高性能Si基SiGe光电子器件的基础平台。本文通过1050℃不同时间氧化SiGe/SiMQW材料,分析氧化过程中Ge组分、弛豫度的变化趋势,制备位错密度低、表面平整、弛豫度超过60%的Si基Si0.75Ge0.25缓冲层。     

Vertical ordering of islands in Ge-Si multilayers

Growth and ordering of GeSi islands in Ge-Si multilayer systems during deposition by Low-Pressure Chemical Vapour Deposition (LPCVD) at 700°C on Si (001) substrates have been investigated for different layer distances by transmission electron microscopy of cross-section and plane-view specimens. Vertical ordering of GeSi islands with almost perfect correlation is observed for distances between the Ge layers of 100 nm. At larger interlayer distances, a continuous decrease of the correlation is found. Vertical ordering in the multilayer system is modelled in terms of the elastic interaction between island nuclei in a newly forming layer and close islands in a buried layer below. Lateral ordering parallel to < 100 >, as observed previously in larger Ge-Si multilayer systems is not found in our systems, consisting of two Ge layers. This difference indicates that lateral ordering in the upper Ge layers of a large multilayer system is triggered by vertical ordering.     

23.4nm软X射线多层膜反射镜研制

为了满足类氖-锗X射线激光研究的需要,设计制备了23.4 nm软X射线多层膜反射镜.依据多层膜选材原则并考虑材料的物理化学特性选择新的材料Ti与Si组成材料对.设计优化材料多层膜的周期厚度(d),材料比例(Γ),周期数(N),计算出Ti/Si反射率曲线.通过实验优化各种镀膜工艺参数,制备出了23.4 nm的Ti/Si多...     

Structure and morphology of Cu/Ni film grown by electrodeposition method: A study of neutron reflectivity and AFM

We present detailed study of structure and interface morphology of an electrodeposited Cu/Ni film using X-ray diffraction, X-ray reflectivity, neutron reflectivity and atomic force microscopy (AFM) techniques. The crystalline structure of the film has been determined by X-ray diffraction, which suggest polycrystalline growth of the film. The depth profile of density in the sample has been obtained from specular X-ray and neutron reflectivity measurements. AFM image of the air-film interface shows that the surface is covered by globular islands of different sizes. The AFM height distribution of the surface clearly shows two peaks and the relief structure (islands) on the surface in the film, which can be treated as a quasi-two-level random rough surface structure. We have demonstrated that the detailed morphology of air-film interfaces, the quasi-two-level surface structure as well as morphology of the buried interfaces can be obtained from off-specular neutron reflectivity data. AFM and off-specular neutron reflectivity measurements also show that the morphologies of electrodeposited surface is distinctively different as compared to that of sputter-deposited surfaces in the sample.     

Formation of Ge islands from a Ge layer on Si substrate during post-growth annealing

We have deposited a 12 nm thick Ge layer on Si(1 0 0) held at 200 °C by thermal evaporation under high vacuum conditions. Upon subsequent thermal annealing in vacuum, self-assembled growth of nanostructural Ge islands on the Ge layer occurred. Atomic force microscopy (AFM) and grazing incidence small-angle X-ray scattering (GISAXS) were used to characterize such layers. GISAXS measurements evidenced the formation of cylinder shaped structures upon annealing at 700 °C, which was confirmed by AFM measurements with a very sharp tip. A Ge mass transport from the layer to the islands was inferred by X-ray reflectivity and an activation energy of 0.40 ± 0.10 eV for such a process was calculated.     

Raman spectroscopy of strained GeSi alloys deposited on Ge substrates

The Raman scattering method has been successfully used to investigate the properties of GeSi alloys deposited on Ge substrates in this paper. The effect of Si composition and strain in the GeSi alloy on the Raman shifts of Ge-Ge, Ge-Si and Si-Si phonon modes is studied. The relationship between them have been derived by the assumption that the Raman shifts is nearly linear with Si composition and strain in the GeSi alloys. The experimental data show reasonable agreement with the fits.     

Strain-driven morphology of Si1-xGex islands grown on Si(100)

A study has been carried out on the morphology and structure of three-dimensional (3D) SiGe islands grown by molecular beam epitaxy (MBE) on Si(100) substrates. Samples of Si1-xGex alloys have been prepared to investigate the effects either of the alloy composition or of the growth temperature. Atomic force microscopy (AFM) evidenced the growth of 3D islands and transmission electron microscopy (TEM) demonstrated wetting layer growth on Si(100), independently on the deposition conditions. Energy dispersive spectroscopy (EDS) micro-analyses carried out on cross-sections of large Si1-xGex islands with defects allowed a measurement of the Ge distribution in the islands. To the best of our knowledge, these have been the first experimental evidences of a composition change inside SiGe islands. The interpretation of the experimental results has been done in terms of strain-enhanced diffusion mechanisms both of the growing species (Si and Ge) and of small islands.     

Perfect alignment of self-organized Ge islands on pre-grown Si stripe mesas

Self-organized Ge islands grown on patterned Si(001) substrates have been investigated. Selective epitaxial growth (SEG) of Si is carried out with gas-source molecular beam epitaxy to form Si stripe mesas followed by subsequent Ge island growth. Self-aligned Ge islands with regular spacing are formed on the <110>-oriented ridges of the Si mesas. The regular spacing is driven by the repulsive interaction between the neighbor islands through the substrates. A mono-modal distribution of the islands has been observed on the ridges of the Si mesas. The spatial confinement as well as the preferential nucleation is believed to be the mechanism of this alignment of the self-organized Ge islands. Received: 16 July 1999 / Accepted: 6 August 1999 / Published online: 24 March 2000     

Evolution of stress and strain relaxation of Ge and SiGe alloy films on Si(0 0 1)

The growth of Ge and SiGe alloy films on Si substrates has attracted considerable interest in the last years because of their importance for optoelectronic devices as well as Si-based high speed transistors. Here we give a short overview on our recent real time stress measurements of Ge and SiGe alloy films on Si(0 0 1) performed with a sensitive cantilever beam technique and accompanied by structural investigations with atomic force microscopy. Characteristic features in the stress curves provide detailed insight into the development and relief of the misfit strain. For the Stranski–Krastanow system Ge/Si(0 0 1) as well as for SiGe films with Si contents below 20%, the strain relaxation proceeds mainly into two steps: (i) by the formation of 3D islands on top of the Ge wetting layer; (ii) via misfit dislocations in larger 3D islands and upon their percolation.     

Room-temperature SiGe light-emitting diodes

In the present paper the electroluminescence of PIN diodes with either strained SiGe/Si or Ge islands in the i-region has been investigated experimentally and by quantitative modelling. The modelling helped to improve the diode structure. Consequently, diodes with strained Si_0.80Ge_0.20 could be improved so as to reveal emission up to room temperature, if the thickness was high enough. To overcome the thickness limitation due to plastic relaxation, we used selective epitaxy on small areas. We also present results for diodes with Ge islands in the active region. The internal quantum efficiency of light emitting diodes with strained SiGe was at room temperature 10⁻⁴, while diodes with islands emitted ten times less light.