Flame‐retardant epoxy resins with high glass‐transition temperatures. II. Using a novel hexafunctional curing agent: 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane

We synthesized a novel phosphorus‐containing triamine [9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐yl‐tris(4‐aminophenyl) methane (dopo‐ta)] from the nucleophilic addition of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and pararosaniline chloride, using triethylamine as an acid receiver. We confirmed the structure of dopo‐ta by IR, mass, and NMR spectra and elemental analysis. dopo‐ta served as a curing agent for diglycidyl ether of bisphenol A (DGEBA) and dicyclopentadiene epoxy (hp7200). Properties such as the glass‐transition temperature (T_g), thermal decomposition temperature, flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The T_g's of cured DGEBA/dopo‐ta and hp7200/dopo‐ta were 171 and 190 °C, respectively. This high T_g phenomenon is rarely seen in the literature after the introduction of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.80 wt % for DGEBA/dopo‐ta/diamino diphenylmethane (DDM) systems and 1.46 wt % for hp7200/dopo‐ta/DDM systems. The dielectric constants for DGEBA/dopo‐ta and hp7200/dopo‐ta were 2.91 and 2.82, respectively, implying that the dopo‐ta curing systems exhibited low dielectric properties. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5971–5986, 2005     

Curing studies of epoxy resins with phosphorus‐containing amines

The curing system of diglycidyl ether of bisphenol A (DGEBA) with two phosphorus‐containing amine compounds—bis(3‐aminophenyl)methyl phosphine oxide and bis(4‐aminophenyl)‐bis(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl)methane—was studied with differential scanning calorimetry under isothermal and nonisothermal conditions and compared with the DGEBA/diamino diphenyl methane system. The isoconversional method was used to evaluate the dependence of the effective activation energy on the extent of conversion. Modulated differential scanning calorimetry and dynamic mechanical thermal analysis were used to study the phenomena of vitrification and gelation. The thermal and flame‐retardant properties were evaluated, and the limiting oxygen index values of the phosphorylated resins, above 30, confirmed that phosphorus‐containing epoxy resins are effective flame retardants. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 1676–1685, 2006     

Epoxy resins from novel monomers with a bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐) substituent

A new diepoxide and a new diamine, both bearing bis‐(9,10‐dihydro‐9‐oxa‐10‐oxide‐10‐phosphaphenanthrene‐10‐yl‐)‐substituted methylene linkages, were prepared through the reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide with benzophenone derivatives via a simple addition reaction followed by a dehydration reaction. These two compounds were used as monomers for preparing cured epoxy resins with high phosphorus contents. The resultant epoxy resins showed high glass‐transition temperatures (between 131 and 196 °C). All of the cured epoxy resins exhibited high thermal stability, with 5% weight loss temperatures over 316 °C, and excellent flame retardancy, with limited oxygen index values of 37–50. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 40: 359–368, 2002     

Flame retardant and toughening behaviors of bio‐based DOPO‐containing curing agent in epoxy thermoset

Based on bio‐based furfural, a phosphorus‐containing curing agent (FPD) was successfully synthesized, via the addition reaction between 9,10‐dihydro‐9‐oxa‐10 phosphaphenanthrene‐10‐oxide (DOPO) and furfural‐derived Schiff base. Then, as co‐curing agent, FPD was used to prepare flame retardant epoxy thermosets (EP) cured by 4, 4′‐diaminodiphenyl methane. The incorporated FPD improved the flame retardancy and toughness of epoxy thermoset, simultaneously. When 5 wt% FPD was added into EP, the FPD/EP achieved 35.7% limited oxygen index (LOI) value and passed UL94 V‐0 rating, meanwhile. In FPD/EP thermoset, the incorporated FPD reduced the thermal decomposition rate, increased the charring capacity, and inhibited the combustion intensity of epoxy thermoset. Through gas‐phase and condensed‐phase actions in weakening fuel supply, suppressing volatile combustion, and enhancing charring barrier effect, FPD decreased the heat release of burning epoxy thermoset, significantly. For the outstanding effectiveness on both flame retardancy and toughness, the study on FPD provides a promising way to manufacture high‐performance epoxy thermoset.     

Preparation of phosphinated bisphenol from acid‐fragmentation of 1,1,1‐tris(4‐hydroxyphenyl)ethane and its application in high‐performance cyanate esters

We reveal a route for the preparation of phosphinated bisphenol, 1,1‐bis(4‐hydroxyphenyl)‐1‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane (2) , via a one‐pot reaction of 1,1,1‐tris(4‐hydroxyphenyl)ethane and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) in the catalysis of p‐toluenesulfonic acid. A two‐step reaction mechanism, acid‐fragmentation of 1,1,1‐tris(4‐hydroxyphenyl)ethane followed by nucleophilic addition of DOPO, is proposed for the synthesis. Based on (2) , a dicyanate ester derivative, 1,1‐bis(4‐cyanatophenyl)‐1‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane (3) was prepared and co‐cured with a commercially available dicyanate ester, the dicyanate ester of bisphenol A (BACY). Experimental data show that incorporating (3) into BACY enhances the flame retardancy and dielectric properties with little penalty to the thermal properties. A thermoset with T_g 274 °C, coefficient of thermal expansion (CTE) 49 ppm/°C, D_k 3.04 (1 GHz), T_d (5%,) N₂: 435 °C, air: 424 °C, and UL‐94 V‐0 rating can be achieved via this approach. © 2011 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2011.     

Development of novel phosphorus‐containing epoxy resins from renewable resources

Novel biobased epoxy resins were prepared from two fatty acid derivatives; epoxidized 10‐undecenoyl triglyceride and epoxidized methyl 3,4,5‐tris(10‐undecenoyloxy)benzoate, with 4,4′‐diaminodiphenylmethane as a crosslinking agent. The flame retardancy of these epoxy resins was improved by the addition of 10‐[2′, 5′‐bis(9‐oxiranyl‐nonayloxy)phenyl]‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and by crosslinking with a phosphorus‐containing curing agent, bis(m‐aminophenyl)methylphosphine oxide. The thermal, thermomechanical, and flame‐retardant properties of the cured materials were measured with differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, and the limiting oxygen index. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6717–6727, 2006     

Synthesis of thermosetting polyetherimide‐containing allyl groups

An allyl‐containing diphenol, 1‐(3‐allyl‐4‐hydroxyphenyl)‐1‐(4‐hydoxyphenyl)‐1‐(6‐oxido‐6H ‐dibenz[c,e][1,2]oxaphosphorin‐6‐yl)ethane (1) , was prepared from a one‐pot reaction of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide, 4‐hydroxyacetophenone, and 2‐allylphenol in the presence of p‐toluenesulfonic acid monohydrate. Then, an allyl‐containing dietheramine, 1‐(4‐(4‐aminophenoxy)phenyl)‐1‐(3‐allyl 4‐(4‐aminophenoxy)‐phenyl)‐1‐(6‐oxido‐6H‐dibenz[c,e][1,2] oxaphosphorin‐6‐yl)ethane (3) , was prepared from the nucleophilic substitution of (1) with 4‐fluoronitrobenzene, followed by the reduction of the dinitro groups by Fe/HCl. A flexible polyetherimide (PEI) (4) with a curable characteristic was prepared from the condensation of (3) and 4,4′‐oxydiphthalic anhydride (ODPA) in m‐cresol in the presence of isoquinoline. Curing PEI (4) at 300 °C leads to PEI (5) , which exhibits much a higher T_g value (307 °C) and a lower coefficient of thermal expansion (CTE) (29 ppm/°C) than PEI (4) (T_g = 253 °C, CTE 52 ppm/°C). © 2013 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2013     

Facile and efficient preparation of phosphinate‐functionalized aromatic diamines and their high‐Tg polyimides

Two novel phosphorus‐functionalized aromatic diamines, 1,1‐bis(4‐aminophenyl)‐1‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)ethane ( 1 ) and bis(4‐aminophenyl)‐(6‐oxido‐6H‐dibenz <c,e> <1,2> oxaphosphorin‐6‐yl)phenylmethane ( 2 ), were prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide, 4‐aminoacetophenone, or 4‐aminobenzophenone in excess aniline using p‐toluenesulfonic acid monohydrate as catalyst by an efficient, one‐pot procedure. The effect of electron withdrawing/donating groups on the stabilization of the resulting carbocation seems critical for the success of the process and was discussed in detail. Based on diamines ( 1–2 ), a series of new polyimides, (5a–5d) and (6a–6d) , were prepared, respectively. Polyimides (5a–5d) are flexible and creasable. In contrast, polyimides (6a–6d) are brittle because of the structure rigidity, according to the analysis based on the NMR temperature‐dependent spectra of ( 2 ). Polyimides 5 displaying high T_g (318–392 °C), high moduli (3.39–4.49 GPa), low coefficient of thermal expansion (42–50 ppm/°C), and moderate thermal stability (T_d 5 wt % at 426–439 °C), are excellent high‐T_g and flame‐retardant materials. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 2486–2499, 2009     

Flame‐retardant epoxy resins with high glass‐transition temperatures from a novel trifunctional curing agent: Dopotriol

A novel phosphorus‐containing trifunctional novolac (dopotriol) was synthesized through the addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide and rosolic acid. The structure of dopotriol was confirmed with NMR spectroscopy and elemental analyses. The dopotriol was blended with phenol novolac in the ratios of 10/0, 8/2, 6/4, 4/6, 2/8, and 0/10 to serve as a curing agent for diglycidyl ether of bisphenol A. Thermal properties, such as the glass‐transition temperature, thermal decomposition temperature, and flame retardancy, moisture absorption, and dielectric properties of the cured epoxy resins were evaluated. The activity and activation energy of curing were studied with the methods of Kissinger and Ozawa by dynamic differential scanning calorimetry scans. The glass‐transition temperatures of the cured epoxy resins were 138–159 °C, increasing with the phosphorus content. This is rarely seen in the literature after the addition of a flame‐retardant element. The flame retardancy increased with the phosphorus content, and a UL‐94 V‐0 grade was achieved with a phosphorus content of 1.87%. Similar dielectric properties and moisture absorption were observed for these phosphorus‐containing epoxy resins, and this implied that the addition of phosphorus to epoxy did not affect the dielectric properties and moisture absorption. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 2862–2873, 2005     

Preparation and characterization of phosphorus‐containing Mannich‐type bases as curing agents for epoxy resin

Two novel phosphorus‐containing Mannich‐type bases, [(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]‐amino}‐ ethylamino)‐phenyl‐methyl]‐phosphonic acid diethyl ester (PEDA) and ({2‐[2‐(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]– amino}‐ethylamino)‐ethylamino]‐ethylamino}‐phenyl‐methyl)‐phosphonic acid diethyl ester (PTTA) were prepared and employed as curing agents in an attempt to prepare flame retardant epoxy systems. Through a curing reaction, phosphorus was incorporated in the backbone of the epoxy polymer. The processing characteristic of these systems was studied in terms of gel time at different temperatures. Thermal and flame retardancy properties of the cured epoxy thermosets were characterized by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and flammability test. The degradation activation energy was calculated by Kissinger's model. The results showed that the gel time of the phosphorus‐containing epoxy systems was prolonged; the glass transition temperature (T_g) was increased due to the introduction of phosphorus and the initial degradation activation energy of phosphorus‐containing epoxy systems was lower than phosphorus‐free epoxy systems. High char yield (23–27 wt%) and limiting oxygen index (LOI) values of 28–30 were observed for the phosphorus‐containing epoxy thermosets, indicating their improvement in flame retardancy. Copyright © 2008 John Wiley & Sons, Ltd.     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Synthesis of a novel bis‐spiroorthoester containing 9,10‐dihydro‐9‐oxa‐10‐phosphaphenantrene‐10‐oxide as a substituent: Homopolymerization and copolymerization with diglycidyl ether of bisphenol A

A new bis‐spiroorthoester‐containing monomer, bis[(1,4,6‐trioxaspiro‐[4.4]‐nonan‐2‐yl)‐methyl] 2‐[10‐(9,10‐dihydro‐9‐oxa‐10‐phosphaphenantrene‐10‐oxide‐10‐yl)] maleate (SOE‐DOPOMA), was synthesized with good yields by an esterification reaction with a hydroxylated spiroorthoester (2‐hydroxymethyl‐1,4,6‐trioxaspiro‐[4.4]‐nonane) and a phosphorus‐containing diacid {2‐[10‐(9,10‐dihydro‐9‐oxa‐10‐phosphaphenantrene‐10‐ oxide‐10‐yl)] maleic acid}, both of which were previously synthesized. SOE‐DOPOMA was characterized with ¹H, ¹³C, and ³¹P NMR spectroscopy. This new spiroorthoester was crosslinked with ytterbium triflate as a cationic initiator. A mixture of SOE‐DOPOMA and diglycidyl ether of bisphenol A was also crosslinked under the same conditions. The curing was studied with differential scanning calorimetry and monitored with Fourier transform infrared spectroscopy. The materials were characterized with differential scanning calorimetry, thermogravimetric analysis, and thermodynamomechanical analysis. The shrinkage effect on cationic crosslinking was assessed with gas pycnometry, and the flame‐retardant properties were determined with limiting oxygen index measurements. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 1980–1992, 2007.     

Phosphinated phenols from acid‐fragmentation of bisphenols and their unsymmetrical diamine derivatives for copolyimides

Four novel diamines (9–12) were prepared by a two‐step procedure from phosphinated phenols (1–4) that were prepared from acid‐fragmentation of four bisphenols, including bisphenol A, 4,4′‐isopropylidenebis(2,6‐dimethylphenol), cis(4‐hydroxyphenyl)cyclohexane, and 9,9′‐bis(4‐hydroxyphenyl)fluorene, followed by nucleophilic addition of 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO). Copolyimides based on (9–12) /4,4′‐diaminodiphenyl ether (ODA)/dianhydride were prepared. The structure‐property relationship on the copolyimides was discussed. Due to the structural similarity, (9) /ODA‐based copolyimides were compared with (10) /ODA‐based copolyimides, while (11) /ODA‐based copolyimides were compared with (12) /ODA‐based copolyimides. The dimethyl substitutents cause (10) /ODA‐based copolyimides to display higher T_g, modulus, dimensional stability, contact angle, and better solubility than (9) /ODA‐based copolyimides. (12) /ODA‐based copolyimides that exhibit fluorene moieties display higher T_g and thermal stability, but a lower contact angle and poorer solubility than (11) /ODA‐based copolyimides that exhibit cyclohexane moieties. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 390–400     

Synthesis and property of phosphorus‐containing bismaleimide by a novel method

A series of novel addition products (phosphorus content: 0.5, 1, 2, and 3 wt %) were synthesized from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and 4,4′‐bismaleimidodiphenylmethane (BMI). NMR and IR were used to confirm the structures of the synthetic bismaleimides. Dynamic mechanical analysis scans showed the glass‐transition temperatures of these cured BMIs decreased with phosphorus content. Thermal gravimetric analysis heating scans indicated that they had high thermal stability. Limiting oxygen index measurements implied that the flame retardancy was improved by the incorporation of DOPO. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2260–2268, 2000     

Flame‐retardant epoxy resins from o‐cresol novolac epoxy cured with a phosphorus‐containing aralkyl novolac

A novel phosphorus‐containing aralkyl novolac (Ar‐DOPO‐N) was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) first with terephthaldicarboxaldehyde and subsequently with phenol. The chemical structures of the synthesized compounds were characterized with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. Ar‐DOPO‐N blended with phenol formaldehyde novolac was used as a curing agent for o‐cresol formaldehyde novolac epoxy, resulting in cured epoxy resins with various phosphorus contents. The epoxy resins exhibited high glass‐transition temperatures (159–177 °C), good thermal stability (>320 °C), and retardation on thermal degradation rates. High char yields and high limited oxygen indices (26–32.5) were observed, indicating the resins' good flame retardance. Using a melamine‐modified phenol formaldehyde novolac to replace phenol formaldehyde novolac in the curing composition further enhanced the cured epoxy resins' glass‐transition temperatures (160–186 °C) and limited oxygen index values (28–33.5). © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 2329–2339, 2002     

Syntheses and flame retarding properties of DOPO polymers,melamine polymers,and DOPO‐melamine copolymers

The 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) polymers, melamine polymers, and DOPO‐melamine copolymers have been successfully synthesized, and their flame retarding properties have also been investigated by blending with polypropylene (PP)/styrene‐ethylene‐butylene‐styrene (SEBS) alloys. Experimental results establish that all of them are good polymeric flame retardants. No blooming or color stains occur when they are incorporated into PP/SEBS alloys. Among lab‐made polymeric flame retardants, DOPO‐ melamine copolymers exhibit the best thermal stability and nonflammability. PP/SEBS alloys containing DOPO‐melamine copolymers display comparable thermal resistance and flame retarding behavior (T_d = 290°C; char yield: 15.6%, LOI: 23, and flammability: UL‐94 V0) as the alloys containing common commercial flame retardants (i.e., DOPO, melamine, and ammonium polyphosphate). Copyright © 2013 John Wiley & Sons, Ltd.     

Synthesis and properties of thermosetting polymers from a phosphorous‐containing fatty acid derivative

A new phosphorous‐containing fatty acid diepoxide was obtained from 10‐undecenoyl chloride and 10‐(2′,5′‐dihydroxyphenyl)‐9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and crosslinked with 4,4′‐diaminodiphenylmethane and bis(m‐aminophenyl)methylphosphine oxide. The properties of the thermosetting materials were evaluated by differential scanning calorimetry, dynamic mechanical thermal analysis, thermogravimetric analysis, and limiting oxygen index (LOI). Thermal and thermooxidative degradation was studied by gas chromatography/mass spectrometry, FTIR, ³¹P magic angle spinning NMR spectroscopy, and scanning electron microscopy. LOI values indicate good flame‐retardant properties that are related to the formation of a protective phosphorous‐rich layer that slowed down the degradation and prevented it from being total. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 5630–5644, 2006     

A novel halogen‐free co‐curing agent with linear multi‐aromatic rigid structure as flame‐retardant modifier in epoxy resin

A novel halogen‐free 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO)‐containing co‐curing agent, 6,6′‐(1,4‐phenylenebis(((4‐(phenylamino)phenyl)amino)methylene))bis(dibenzo[c,e][1,2]oxaphosphinine 6‐oxide) (DPN) was synthesized via a simple 1‐pot or 2‐step procedure with yield of 86.2% and 70.8%, respectively. The molecular structures of 4,4′‐((1,4‐phenylenebis(methanylylidene))bis(azanylylidene))bis(N‐phenylaniline) (DPN intermediate) and DPN are characterized by FTIR, NMR, and MS. TGA tests show that the char yield of DPN/EP composites raises to 30.9% when the molar ratio of DPN to 4,4‐diaminodiphenyl methane(DDM) is 20:80. T_g values of DPN/EP composites tested by DSC and DMA are similar to neat epoxy resin (EP), which is due to the secondary amine in DPN that participates in the cross‐linking reaction of epoxy resin. The storage modulus in the rubber stage (E′‐190 °C) of flame‐retardant epoxy resin is close to that of neat EP, while their tanδ's are lower, which indicates the similarity of samples' cross‐linking density due to the participation of DPN in the cross‐linking reaction. The results show that when the molar ratio of DPN and DDM is 5:95, the epoxy has a higher T_g value and better mechanical properties than other samples. The introduction of DPN efficiently improves the flame‐retardant properties of epoxy resin with V‐0 rating of UL‐94 vertical burning test, non‐dripping, 41% of limit oxygen index (LOI) value, low peak heat release rate (PHRR), and total heat release (THR).     

Enhanced thermal properties and flame retardancy of unsaturated polyester‐based hybrid materials containing phosphorus and silicon

A phosphorus and silicon containing liquid monomer (9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide–vinyltrimethoxysilane (DOPO–VTS)) was synthesized by the reaction between DOPO and VTS. DOPO–VTS and methacryloxypropyltrimethoxylsilane were introduced into unsaturated polyester resin to prepare flame retardant UPR/SiO₂ (FR‐UPR/SiO₂) hybrid materials by sol–gel method and curing process. DOPO–VTS contributes excellent flame retardancy to UPR matrix, which was confirmed by the limiting oxygen index and microscale combustion calorimeter results. The thermogravimetric analysis (TGA) results indicate that the FR‐UPR/SiO₂ hybrid materials possess higher thermal stability and residual char yields than those of pure UPR at high temperature region. The thermal degradation of materials was investigated by TGA/infrared spectrometry (TG‐IR) and real‐time infrared spectrometry (RT‐IR), providing insight into the thermal degradation mechanism. Moreover, scanning electron microscopy (SEM) and X‐ray photoelectron spectroscopy (XPS) were used to explore the morphologies and chemical components of the residual char. Copyright © 2013 John Wiley & Sons, Ltd.     

High‐Tg and low‐dielectric epoxy thermosets based on a propargyl ether‐containing phosphinated benzoxazine

A propargyl ether‐containing benzoxazine (4) was prepared from a potassium carbonate‐catalyzed nucleophilic substitution of propargyl bromide and a phenolic OH‐containing benzoxazine (3) , which was prepared from 1‐(4‐hydroxyphenyl)‐1‐(4‐aminophenyl)‐1‐(6‐oxido‐6H ‐dibenz <c,e><1,2> oxaphosphorin‐6‐yl)ethane (1) by a three‐step procedure. The curing reactions of (4) were monitored by IR and DSC. A reaction mechanism was proposed based on the observation. Benzoxazines (3) and (4) were applied as epoxy curing agents. The microstructure and the structure‐property relationship of the resulting thermosets are discussed. The double‐strand structure in (4) ‐cured epoxy thermosets afforded higher crosslinking density, and led to higher thermal properties. In addition, the (4) ‐cured epoxy thermosets possess half the amount of highly polar hydroxyl groups than those of the (3) ‐cured epoxy thermosets, resulting in a lower dielectric constant, dissipation factor, and water absorption. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014 , 52, 1359–1367