氮气流量对磁控溅射制备类金刚石薄膜性能的影响

采用磁控溅射法以石墨为靶材在玻璃衬底上沉积了类金刚石(DLC)薄膜,用原子力显微镜表征了不同氮气流量条件下生长薄膜的形貌,用拉曼光谱仪、X射线光电子能谱仪和分光光度计分析了样品的微结构、元素的价态和透光性能.结果表明:沉积的薄膜均为非晶结构.通入2sccm氮气时,薄膜的光学透过率大大提高,此时DLC薄膜内的氮元素含量为5.88%,sp3键百分比为64.65%,ID/IG值为1.81;掺氮DLC薄膜在可见光范围内光学透过率达到95.69%.随着氮气流量增加,DLC薄膜光学透过率呈现出下降的趋势.退火2h后不掺氮DLC薄膜光学透过率呈小幅度下降,而掺氮DLC薄膜的光学透过率几乎没有变化.     

椭偏法表征四面体非晶碳薄膜的化学键结构

采用自主研制的双弯曲磁过滤阴极真空电弧(FCVA)技术,在不同衬底负偏压下制备了四面体非晶碳(ta-C)薄膜。通过分光光度计和椭偏(SE)联用技术精确测量了薄膜厚度,重点采用椭偏法对不同偏压下制备的ta-C薄膜sp3 C键和sp2 C键结构进行了拟合表征,并与X射线光电子能谱(XPS)和拉曼光谱的实验结果相对比,分析了非晶碳结构的椭偏拟合新方法可靠性。结果表明,在-100V偏压时薄膜厚度最小,为33.9nm;随着偏压的增加,薄膜中的sp2 C含量增加,sp3 C含量减小,光学带隙下降。对比结果发现,椭偏法作为一种无损、简易、快速的表征方法,可用于ta-C薄膜中sp2 C键和sp3 C键含量的准确测定,且在采用玻璃碳代表纯sp2 C的光学常数及拟合波长选取250～1700nm时的椭偏拟合条件下,拟合数值最佳。     

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采用由脉冲负偏压调节的等离子体增强化学气相沉积方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。将反应过程中加在沉积区域的脉冲偏压固定在-350V,当占空比从0.162增大到0.864时,薄膜样品的形貌、成份和结构均不相同。扫描电镜照片表明,组成多孔氧化硅薄膜的颗粒在占空比增大时变得细腻,并且薄膜整体变得多孔且蓬松。拉曼光谱和红外光谱结果显示,薄膜样品中的非晶硅和Si-H键在较高的占空比下减弱甚至消失。占空比升高时氧化硅桥键所占比例持续增加。     

脉冲偏压占空比对多孔氧化硅薄膜性质的影响

采用由脉冲负偏压调节的等离子体增强化学气相沉积方法,以硅烷为源气体,在玻璃基片上沉积得到了多孔二氧化硅薄膜。将反应过程中加在沉积区域的脉冲偏压固定在-350V,当占空比从0.162增大到0.864时,薄膜样品的形貌、成份和结构均不相同。扫描电镜照片表明,组成多孔氧化硅薄膜的颗粒在占空比增大时变得细腻,并且薄膜整体变得多孔且蓬松。拉曼光谱和红外光谱结果显示,薄膜样品中的非晶硅和Si-H键在较高的占空比下减弱甚至消失。占空比升高时氧化硅桥键所占比例持续增加。     

脉冲直流偏压增强的高质量立方氮化硼薄膜的合成

采用磁增强活性反应离子镀系统成功地合成了立方氮化硼薄膜.通过给基片施加脉冲直流偏压以代替传统的射频偏压,增强了立方氮化硼的成膜稳定性,研究了基片的直流脉冲偏压、等离子体放电电流、通入气体流量比(Ar/N₂)和基片温度沉积参数对立方氮化硼薄膜形成的影响规律.结果表明:随着基片负偏压和放电电流的增大,薄膜中立方氮化硼的纯度提高,当基片负偏压为155V,放电电流为15A时,可获得几乎单相的立方氮化硼薄膜.基片温度为500℃和Ar/N₂流量比为10时,最有利于立方氮化硼 关键词： 立方氮化硼 活性反应离子镀 脉冲偏压     

含氮氟化类金刚石(FN-DLC)薄膜的研究:(Ⅰ)sp结构与化学键分析

以CF4,CH4和N2为源气体,利用射频等离子体增强化学气相沉积法,在不同功率下制备了含氮氟化类金刚石膜.用俄歇电子能谱、拉曼光谱、X射线光电子能谱和傅里叶变换红外光谱对薄膜的电子结构和化学键进行了表征,并结合高斯分峰拟合方法分析了薄膜中sp2,sp3结构比率.结果表明,制备的薄膜属于类金刚石结构,不同沉积功率下,薄膜内的sp2/sp3值在2.0—9.0之间,随着沉积功率的增加薄膜内sp2的相对含量增加.膜内主要有C—Fx(x=1,2),C—C,CC和CN等化学键.沉积功率增加,C—C基团增加,膜内F的浓度降低,C—F基团减少,薄膜的关联加强,稳定性提高.     

脉冲偏压电弧离子镀TiO2薄膜的力学与光学性能

用脉冲偏压电弧离子镀技术在玻璃基片上制备均匀透明的TiO₂薄膜.利用X射线衍射仪、原子力显微镜、扫描电子显微镜、紫外-可见透射光谱仪和纳米压痕仪等手段,对不同脉冲负偏压下合成薄膜的相结构、微观结构、表面形貌、力学和光学性能进行表征.结果表明，沉积态薄膜为非晶态.脉冲负偏压对薄膜性能有明显的影响.随偏压的增加，薄膜厚度、硬度和弹性模量均先增大后减小，前者峰值出现在100—200 V负偏压范围，后两者则在250—350V范围.300 V负偏压时薄膜硬度最高，薄膜达到原子级表面光滑度，均方 关键词： 2薄膜')" href="#">TiO₂薄膜 脉冲偏压电弧离子镀 硬度 折射率     

偏压对空心阴极放电等离子体溅射制备氮化碳薄膜的影响

利用空心阴极放电等离子体源在Si（100）单晶衬底上沉积了氮化碳薄膜．薄膜的表面形貌表明所得的薄膜非常的均匀光滑，用X光电子能谱、拉曼和红外吸收光谱对薄膜的结构、成分和化学键等进行了研究．在拉曼光谱中可以看到典型的G，D和C=N键的峰．当偏压为250V时．薄膜拉曼光谱中的D峰完全消失，此时薄膜的N／C比达到了0．81．通过对薄膜的XPS分析也表明薄膜中C—C，sp^2 CN和sp^3 CN键的组分也发生了明显的变化．当偏压为250V时薄膜的sp^3 CN相的含量达到了最大值为40％，同时氮含量也达到了最大值．实验结果给出了直接的证据：薄膜的结构模式可以通过改变偏压来得到控制．     

多腔耦合微波表面波PECVD法沉积 DLC薄膜研究

报道了利用多腔耦合微波表面波等离子体增强化学气相沉积(PECVD)的方法制备类金刚石(DLC)薄膜。通过发射光谱(OES)测量,对Ar等离子体中的各种放电参数以及全部四个腔室内放电的均匀性作出评估。采用表面轮廓仪测量了薄膜的厚度;薄膜的表面形貌、组成结构通过原子力显微镜(AFM)、激光拉曼光谱和X射线衍射光谱(XPS)进行了表征。在12.5μm厚度的有机薄膜聚酯(PET)表面沉积一定厚度DLC后,通过测量水蒸气透过率(WVTR)对DLC薄膜的阻隔性能进行了研究。结果表明,这种多腔耦合微波表面波等离子体装置,不仅能够实现四个腔室同时相对均匀的放电,也能够实现单个腔室的轴向均匀放电。制备的DLC薄膜结构致密、成分均匀,可以使PET薄膜阻隔性能提高约20倍。     

氢的强化刻蚀对金刚石薄膜品质的影响与sp2杂化碳原子的存在形态

用化学气相沉积方法制备了金刚石薄膜.在制备过程中，通过间歇式关闭甲烷气体，强化了氢对sp2杂化碳原子的刻蚀.用拉曼光谱和金相显微镜对薄膜进行了分析表征.结果表明，氢对sp2杂化碳原子的强化刻蚀并未影响金刚石薄膜的品质和微观结构.这一结论说明，在金刚石薄膜中，sp2杂化碳原子主要存在于金刚石晶粒表面和晶界碳原子之间,而不是以石墨或无定形碳颗粒为主要存在方式. 关键词： 化学气相沉积 金刚石薄膜 拉曼光谱 强化刻蚀     

Sputtering by fast electrons

Calculations are presented of collision cascade and knockon contributions to sputtering induced by fast electrons. The sputtering yield for MeV electrons bombarding carbon and iron is found to be ≈10^?7 to 10^?6. Important erosion effects on astrophysical grains are possible.     

Packet-Pulse Dual Magnetron Sputtering

Russian Physics Journal - The paper presents the results of experimental study of the discharge formed by a dual (DU) magnetron sputtering system (MSS) with aluminum targets in the mode of...     

溅射的同位素迷惑

影响多元材料溅射的机制是复杂的．在多元材料溅射中,同位素溅射是最简单的．虽然仅有质量效应在同位素溅射中起优势作用,但是在离子轰击溅射中,至今仍然是个“同位素迷惑”．争论的焦点有:（１）在零剂量时,同位素富集度是与出射角无关,还是与出射角有关？（２）同位素角效应是一次溅射效应,还是二次溅射效应？如何理解碰撞级联中的动量不对称性对同位素溅射的作用？文中综述了这些争论,并阐明了本小组的观点． Mechanisms affecting multicomponent material sputtering are complex. Isotope sputtering is the simplest in the multicomponent materials sputtering. Although only mass effect plays a dominant role in the isotope sputtering, there is still an isotope puzzle in suputtering by ion bombardment. The major arguments are as follows:(1) At the zero fluence, is the isotope enrichment ejection angle independent or ejection angle dependent? (2)Is the isotope angular effect the primary or the ...     

Sputtering of multicomponent materials

The nonlinear balance equation, describing the evolution of concentration profiles for a multicomponent target under the action of ion bombardment as a function of the depth inside the target and the incident ion fluence, was solved numerically. The quantities of interest have been calculated with reference to a binary system showing that the balance equation is consistent with the correct stoichiometry for the sputtering yield ratio in the stationary state.     

Sputtering of clusters from nickel-aluminium

A NiAl(1 1 1) single crystal was bombarded with 15 keV Ar⁺, and the resulting secondary neutrals were analysed by laser postionisation secondary neutral mass spectrometry. By measuring the individual cluster photoion intensity as a function of laser power, the sputter yields of 33 individual clusters were determined. The yield of Al_n clusters sputtered from NiAl falls with increasing cluster nuclearity as n^−8.7 while Ni_n and Al_m−nNi_n yields are proportional to n^−5.9 and n^−5.2, respectively. The distribution of thee yields of mixed Al_m−nNi_n clusters with n and m is found to diverge significantly from the expected distribution based on a random combinatorial approach, indicating that the energetics due to the chemical bonding in the clusters plays a significant role during cluster formation in the sputtering process.     

Sputtering in the high-voltage electron microscope

The 1.0 MeV electron microscope has been used to observe and analyse transmission sputtering caused by the electrons in the incident beam. The method, reviewed here, is particularly suitable for investigating low energy collision events. Total sputtering yields and angular distributions of sputtered atoms have been measured for (111) gold films to within a few eV of the sputtering threshold energy. It is shown that the results can be explained by the sputtering of surface atoms either directly by electrons, or indirectly by collision sequences generated down 〈110〉 directions. The necessity of using a many-body collision model to interpret the results is stressed. High resolution electron microscopy has been used to study the surface structure of (111) gold films during sputtering on a near-atomic level. It is shown how the results confirm a model where surface roughness develops due to the migration and agglomeration of surface vacancies produced during sputtering. The future scope of the 1.0 MeV electron microscope as an analytical tool for sputtering is also discussed. It is suggested that the rôle of long range focussed collision sequences in sputtering may be determined for materials of medium atomic number. A need for further high resolution studies of sputtered surfaces is identified; such studies are seen as complementary to those by other surface analysis techniques.     

Sputtering of metals at ion-electron irradiation

It has been found that, in contrast to the commonly accepted opinion, simultaneous irradiation by 15-keV Ar⁺ ions and 2.5-keV electrons at temperatures above 0.5T _m (T _m is the melting temperature) induces much larger sputtering of metallic copper, nickel, and steel than irradiation only by Ar⁺ ions. The effect increases with the temperature. At T = 0.7T _m, the sputtering coefficients in the case of ion-electron irradiation are more than twice as large as the sputtering coefficients in the case of irradiation by Ar⁺ ions. The experiments on the sublimation of copper show that the sublimation rate in the case of the heating of a sample by an electron beam is higher than that in the case of heating in an electric vacuum oven. The revealed effects are explained by the electron-induced excitation of adatoms (atoms stuck over the surface, which appear owing to ion bombardment). Excited adatoms have a smaller binding energy with the surface and are sputtered more easily.