反应介质pH值和前驱体用量对PSt/TiO_2复合微球结构形态及TiO_2空心微球形貌的影响

首先用聚乙烯亚胺(PEI)对粒径为360 nm的单分散无皂聚苯乙烯(PSt)乳胶粒进行修饰,得到表面荷正电的PSt种子乳液,然后将其滴加到溶有钛酸正丁酯(TBT)的乙醇与水的混合介质中,通过溶胶-凝胶(sol-gel)法制备出了核壳结构PSt/TiO2复合微球,系统研究了体系pH和TBT用量对复合微球结构形态的影响.研究表明,酸性条件不利于核壳结构PSt/TiO2复合微球的形成;当体系pH值为7.2时,可得到包覆完整、TiO2壳层厚度均一的PSt/TiO2复合微球,此后随着体系pH值的升高,包覆厚度逐渐提高;当pH值升高到11.0时,壳层厚度达到最大,但出现了包覆层不完整的复合微球.在固定聚合体系pH为8.5,EtOH/H2O质量比为100/6,表面修饰PSt种子乳液用量为0.5 g(固含量为4%)的条件下,随着TBT用量从0.01 g增加到0.16 g,复合微球壳层厚度从约0 nm逐渐增加到60 nm;当TBT用量增加到0.32 g时,壳层厚度迅速降至12nm,微球表面变得粗糙,并出现大量未包覆微粒;此后随着TBT用量的增加,包覆层厚度逐渐减少,未包覆微球逐渐增多.结果显示,当复合微球中TiO2包覆层达到一定厚度时,经煅烧后才能得到形貌完整的TiO2中空微球.     

聚苯乙烯/银核/壳复合微球的制备及其表征

通过分散聚合法制备了单分散性好,粒径均一的聚苯乙烯(PS)微球.以PS微球为核,用浓硫酸进行表面改性,使其表面带有负电.加入一定量的[Ag(NH3)2]+溶液,由于静电吸引,使其吸附在PS微球表面,通过化学还原的方法制备了PS/Ag核/壳结构复合微球.采用透射电镜(TEM)、扫描电镜(SEM)、红外光谱(IR)、X射线衍射(XRD)以及紫外-可见光谱对PS/Ag复合微球进行表征.结果表明:通过PS微球的表面改性,在其表面引入了磺酸基团,提高了微球表面的电负性和亲水性,对包覆过程起到了很好的促进作用;通过稳定剂(PVP)和不同还原剂(一缩二乙二醇DEG和乙二醇EG)的使用,形成的PS/Ag核/壳复合微球形貌不一样,同时研究表明制备出的PS/Ag复合微球可以用于催化剂催化还原有机染料溶液,表现出很好的催化活性.     

P(St-AM)核壳聚合物微球的制备及其光子晶体膜

采用一步乳液聚合法,调节引发剂用量,制备了不同粒径的具有核壳结构的功能性聚(苯乙烯-丙烯酰胺)乳胶微球.用透射电子显微镜表征了乳胶微球的核壳结构和粒径,所制微球的粒径分别为195,217,234和255 nm.用红外光谱对微球的化学成分进行了表征,证实聚丙烯酰胺已包覆在聚苯乙烯外层.通过竖直沉积自组装法制备了聚合物微球的光子晶体薄膜.扫描电子显微镜表征了所制光子晶体膜的表面形貌,反射和透射光谱表征了光子禁带.结果表明,聚合物微球以面心立方紧密堆积,其(111)面与基底平行;微球粒径不同,光子晶体的光子禁带不同.制备了不同光子禁带的光子晶体,禁带分别位于473,515,574和630 nm,相应的薄膜分别呈蓝色、绿色、黄色和红色,对于光子晶体的拓展和应用具有重要的意义.     

交联核壳结构PBA/PS和PBA/PMMA纳米微球的制备与应用

考察了聚丙烯酸丁酯/聚苯乙烯(PBA/PS)以及聚丙烯酸丁酯/聚甲基丙烯酸甲酯(PBA/PMMA)交联核壳结构纳米高分子微球的制备方法,并对其在尼龙复合材料中的应用进行了初步研究.结果表明,通过交联剂的引入使粒子核层和壳层内部均形成了高度交联的结构,可以限制亲水性较小的聚苯乙烯(PS)壳层向粒子内部迁移的趋势;制备出的微球平均粒径为40~50 nm,粒径分布很窄.采用饥饿态加料方式加入第二单体不仅可以使微球具有较高的产率和凝胶率,而且可以使其具有更理想的核壳结构和更窄的粒径分布.此外,将合成出的PBA/PMMA核壳粒子对尼龙6基体进行复合的结果表明,由于该微球表面与尼龙6基体之间具有较强的界面相互作用且微球具有较大的形变能力,可以在基体中形成良好的分散,在保持材料强度的同时有效地提高了其刚性和韧性.     

聚苯乙烯/Ag核壳结构纳米微粒的制备及表征

用种子乳液聚合法合成了聚苯乙烯（PS）/Ag复合纳米粒子,进一步利用分步聚合技术实现了聚甲基丙烯酸甲酯(PMMA)在微球表面功能化,分别用TEM、XRD、TG-DTA及FT-IR对其结构和形貌进行了表征,并考察了其摩擦学性能.结果表明,在所选择的实验条件下,合成了以Ag纳米微粒为核,PS、PMMA为壳层的核壳结构复合纳米微球,其中Ag纳米核平均粒径约12 nm,复合微球粒径约25 nm,颗粒较均匀并且在有机溶剂中有良好的分散性,作为润滑油添加剂,具有良好的抗磨性能.     

二氧化硅/聚苯乙烯单分散性核/壳复合球的制备

采用无皂乳液聚合包覆 ,制备了二氧化硅 聚苯乙烯单分散核 壳 (SiO2 PS)复合颗粒 ,包覆层厚度达到 10 0nm .选择 80～ 2 5 0nm二氧化硅粒径作为核颗粒 .为提高包覆效率 ,二氧化硅颗粒先用偶联剂甲基丙烯酰 (3 三甲氧基硅烷 )丙酯 (MPS)进行不同程度的表面改性 .控制MPS的结合率和单体的初始浓度可提高包覆效率 ,同时得到了单分散性复合颗粒 ,用透射电镜 (TEM)观察复合粒子的核 壳形态 .用动态光散射法 (DLS)测量表明所得复合颗粒具有单分散性 .     

微米级PS-PEDOT核壳型导电微球的合成与拉曼表征

以分散聚合法制备的微米级聚苯乙烯(PS)微球为模板、3,4-乙烯二氧噻吩(EDOT)为单体、过硫酸铵(APS)为引发剂,通过氧化聚合制备了PS-PEDOT核壳型复合导电微球。采用扫描电镜、透射电镜等对导电微球的形貌和结构进行了表征,重点采用拉曼光谱研究了其核壳结构特征。并研究了超声分散、溶液pH以及单体配比对导电微球形貌的影响。实验结果表明:超声的引入可提高导电微球的单分散性,改善微球的形貌。随着pH的降低或单体配比的增加,导电聚合物在PS微球表面的负载量随之增加,当m(EDOT)/m(PS)由0.60增加到1.25时,导电微球的平均粒径由1.76μm增加到1.91μm。     

单分散PS/SiO_2纳米复合微球的制备与表征

采用一种简单和低成本的方法制备单分散SiO2包覆聚苯乙烯(PS)(PS/SiO2)核-壳型纳米复合微球.首先在聚乙烯吡咯烷酮(PVP)存在下制备了PS纳米微球,然后在NH4OH/乙醇溶液中通过溶胶-凝胶过程在PS微球表面包覆SiO2.PS纳米微球的制备在水介质中进行,无需使用共单体,使用的是常用的过硫酸钾自由基引发剂;包覆处理前不用进行溶剂交换或离心处理.研究了PVP,NH4OH和原硅酸乙酯(TEOS)的用量对PS/SiO2纳米复合微球尺寸和形态的影响.随着PVP用量增加,PS微球变小,因此得到较小的PS/SiO2纳米复合微球;NH4OH用量对SiO2包覆层的厚度没有影响,但对SiO2包覆层的表面形态有影响,随着NH4OH用量增加包覆层表面变得粗糙;随着TEOS溶液用量增加,生成的SiO2增加,其包覆层的厚度增加.     

同轴电喷法制备PCL-蛋清体系复合微胶囊

以鸡蛋的卵清蛋白作为蛋白质药物模板、生物可降解材料聚己内酯(PCL)为药物载体模板,采用同轴电喷法制备PCL-蛋清体系的复合微球.研究了电导率、黏度对于电喷微球成型的影响.核壳溶液推进速率比、电压、溶液质量分数和接收距离等对于所得微球表面形态和结构的影响.利用扫描电子显微镜(SEM)研究了微球的表面形态,用荧光显微镜表征了微球的包覆模式.结果表明:同轴电喷法可以制备PCL-蛋清体系的复合结构微胶囊,其中推进速率比对微球形貌、粒径及其分布的影响比较明显,当PCL与蛋清溶液推进速率比大于10时,将出现具有包覆结构的微球.     

刚性聚合物微球透明增韧聚苯乙烯

通过多步复合乳液聚合方法合成了一种具有核壳结构的刚性聚合物微球.不同粒径、用量及核层交联密度的核壳微粒(C-S)与聚苯乙烯(PS)共混得到PS/C-S复合材料.通过对其冲击强度及透明性的研究表明增韧PS的最佳条件是核壳微粒的粒径大于100nm,复合材料中的微粒含量在2%～5%,核层具有适当的交联度.在未影响材料透明性的前提下,材料的韧性比纯PS提高2倍     

Preparation of hollow PPy (HPPy) microspheres via template methods with characterization of properties

Template-synthesis method was one of the important methods for the preparation of hollow microspheres. In present work, polystyrene (PS) microspheres were initially synthesized and effects of reaction conditions on the particle size and distribution of PS microspheres were studied. Then sulfonated PS (SPS) microspheres and spherical core (PS) /shell (polypyrrole, PPy) were synthesized by sulfonated and template method respectively. The method was that pyrrole (Py) on the surface of SPS microspheres were polymerized. Then PS (core)-PPy (shell) microspheres by dissolving PS inner core in N, N-Dimethylformamide (DMF), and hollow polypyrrole (HPPy) microspheres were obtained (Figure 1). Thereafter, HPPy microspheres were characterized by fourier transform infrared spectroscopy, X-ray diffraction, particle size analyzer, scanning electron microscope, thermal gravimetric analysis and KDY-4 four-probe resistance meter. The results showed that the size range of PS microspheres were 200～300 nm. HPPy microspheres have been successfully synthesized with good electrical conductivity and excellent thermal stability.     

Surface Formation of Single Silicon Wafer Polished with Nano-sized Al2O3 Powders

"Ice polishing single silicon wafers with nano-sized Al2O3 abrasives can be known as ice fixed abrasives chemical mechanical polishing (IFA-CMP). TAn abrasive slurry was made of nano-sized Al2O3 particles dispersed in de-ionized water with a surfactant and the slurry was frozen to form an ice polishing pad. Then polishing tests of blanket silicon wafers with the above ice polishing pad were carried out. The morphologies and surface roughness of the polished silicon wafers were observed and examined on an atomic force microscope. The subsurface damage was assessed by means of cross-section transmission electron microscopy. The surface chemical constituents of the polished silicon wafers were characterized using X-ray photoelectron spectroscopy in order to gain insight into the chemical mechanisms in the process. Scratch resistance of the single silicon wafer was measured by nanoscratching using a nanoindenter to explore the mechanical removal mechanism. The results show that a super smooth surface with an average roughness of 0.367 nm is obtained within 1000 nm￡1000 nm and there is a perfect silicon diamond structure without any microcracks in the subsurface. The removal of material is dominated by the coactions of ductile regime machining and chemical corrosion. In the end, a model of material removal of IFA-CMP is built."     

Co3O4/CeO2的氧化还原性能及反应条件对其CO氧化活性的影响

采用沉淀氧化法制备了Co₃O₄/CeO₂催化剂。运用XRD、BET和TPR表征手段,考察了不同钴铈比及焙烧温度对钴铈复合氧化物物理及化学性能的影响,并分别在干、湿条件下进行了一氧化碳氧化反应研究。结果表明,与纯的Co₃O₄相比,在不同比例的Co₃O₄/CeO₂均经723 K焙烧的各种催化剂中,钴铈原子比为9∶1的复合氧化物粒径较小,比表面积较大,说明适当比例铈的添加能使Co₃O₄具有较小的粒径。此氧化物经538 K温度焙烧制得的钴铈比为9∶1的复合氧化物中Co₃O₄平均粒径为7.2 nm, BET比表面积为167.6 m²/g。经TPR考察发现其具有最优的氧化还原性能。     

空心玻璃微珠/TiO2复合微球的制备及其性能研究

本文以脲为沉淀剂,通过化学沉淀法成功实现了锐钛矿型二氧化钛壳层在空心玻璃微珠表面的可控组装,从而制备出玻璃/二氧化钛核壳空心微球,并通过XRD、SEM、EDX和拉曼光谱对其结构、形貌、粒径、壳厚和化学组成进行了表征.提出了二氧化钛在空心玻璃微珠表面的定向生长的可能机制和形成过程.     

基于纳米氢氧化镁稳定的Pickering乳液悬浮聚合制备盔甲结构聚苯乙烯@氢氧化镁复合微球

以苯乙烯为单体、 偶氮二异丁腈(AIBN)为引发剂、 片状纳米氢氧化镁(MH)为Pickering稳定剂, 采用悬浮聚合法制备盔甲结构的聚苯烯@氢氧化镁(PS@MH)复合微球. 采用扫描电子显微镜(SEM)、 能谱分析(EDS)、 傅里叶变换红外光谱(FTIR)、 X射线衍射(XRD)、 热失重分析(TGA)和微型燃烧量热分析(MCC)等对PS@MH复合微球进行表征, 确认了其形貌和结构: 纳米氢氧化镁紧密包覆在聚苯乙烯微球表面, 形成了以纳米氢氧化镁为外层、 聚苯乙烯为内球的盔甲结构复合微球; 同时证明了具有盔甲结构的PS@MH复合微球能降低热释放速率, 抑制聚合物的降解. 该方法操作简单, 成本低廉, 制得的盔甲结构PS@MH复合微球粒径尺寸小、 分布窄, 球形度较高.     

Synthesis of CeO2@SiO2 core-shell nanoparticles by water-in-oil microemulsion. Preparation of functional thin film

Synthesis of nanoparticles under restricted environment offered by water-in-oil (W/O) microemulsions provides excellent control over particle size and shape, and inter-particle spacing. Such an environment has been involved to synthesize silica nanoparticles with a CeO2 core, so-called CeO2@SiO2. Aqueous fluids made up of ceria nanoparticles with a size close to 5 nm have been used as the water phase component. The starting CeO2 sols and obtained CeO2@SiO2 nanoparticles have been characterized by dynamic light scattering (DLS), X-ray diffraction, scanning and transmission electron microscopy, and specific surface area measurements. The microemulsion process has been characterized by DLS. Preliminary results on CeO2@SiO2 thin films are presented.     

CeO_2/Pt复合电极及其电催化特性

应用恒电位沉积(psd)和电位脉冲沉积(ppd)法在Pt基底制备CeO2/Pt复合电极,用能量色散X射线光谱(EDX)和X射线衍射(XRD)检测CeO2纳米粒子的成分和结构,场发射扫描电子显微镜(FESEM)观察样品形貌.结果表明:CeO2颗粒细小、致密.在KOH溶液中,CeO2/Pt对甲醇氧化和氧还原有电催化作用;若在稀硫酸中溶除CeO2/Pt电极(ppd)的部分CeO2,则电极的电催化作用进一步增强.     

Antibacteria and Detoxification Function of Polystyrene/TiO2 Nanocomposites

The composites of TiO₂ nanoparticles (anatase structure, average particle size 20–30 nm) as inorganic particle additive in the polystyrene (PS) were prepared by co‐rotating twin screw extruder. The structure and morphology of the composites were determined by scanning electron microscope (SEM), transmission electron microscopy (TEM) and x‐ray diffraction (XRD). Titanium (Ti) element distribution on the surface of PS/TiO₂ master batch was measured by energydispersive x‐ray microanalysis system. The mechanical properties such as tensile strength and Charpy impact strength were tested and revealed that reached the maximum value when the content of TiO₂ nanoparticles is at 1.0 wt%. The composites possess excellent antibacterial and detoxification effect on the familiar bacillus. The antibacteria efficiency of the composites is more than 99% and its detoxification efficiency on the bacterial endotoxin is more than 90%.     

氧化铝-g-聚丙烯酰胺复合磨粒的制备及表征

为提高α-Al₂O₃磨粒在水基介质中的分散稳定性，采用接枝聚合方法制备了Al₂O₃-g-聚丙烯酰胺复合粒子。采用FTIR、XPS、TOF-SIMS、激光粒度仪、SEM、沉降试验等对氧化铝复合粒子结构及分散性能等进行了表征。结果表明，聚丙烯酰胺以化学键形式接枝到Al₂O₃粒子表面，形成聚丙烯酰胺为壳，Al₂O₃为核的复合磨粒;接枝改性后的Al₂O₃粒子分散性明显提高，并且其分散性与Al₂O₃表面接枝量密切相关。     

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

In this work, surface analysis technology is employed to investigate the removal mechanism and the selection of abrasive during fused silica chemical mechanical polishing (CMP). Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro-ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano-abrasives, there are more SGM induced by nano-ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X-ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4-nm element contaminations on the polished surface of fused silica with nano-ceria and nano-alumina abrasives, respectively. While the surface polished by nano-silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano-silica. Comparing with ceria-based slurry, the silica-based slurry has better removal efficiency, and surface quality in fused silica precision machining.