高分子发光二极管载流子注入过程研究

采用交流阻抗谱，电容-电压，电容-频率等实验方法，研究了共轭高分子MEH-PPV(poly［2-methoxy，5-(2-ethylhexoxy)-1，4-phenylene vinylene］)发光二极管的载流子注入过程.对于结构为ITO/PEDOT/MEH-PPV/Ba/Al的发光器件，实验结果表明，电极界面是欧姆接触的，载流子的注入是非平衡的，器件薄膜中存在陷阱容易俘获注入电荷，形成空间电荷区，陷阱密度约为3.75×10¹⁶cm^-3. 关键词： 高分子发光二极管 交流阻抗谱 cole-cole图 载流子注入     

SrTiO3金属-绝缘体-半导体结构的介电与界面特性

采用金属有机分解法在p型Si衬底上制备了SrTiO3（STO）薄膜.研究了STO薄膜金属 绝缘体 半导体(MIS)结构的介电和界面特性.结果表明，STO薄膜显示出优异的介电性能，在10kHz处的介电常数约为105，损耗低于001，这来源于多晶结构和良好的结晶性；MIS结构中的固定电荷密度Nf和界面态密度Dit分别约为15×1012cm-2和(14—35)×1012cm-2eV-1，这主要与Si/STO界面处形成的低介电常数界面层有关. 关键词： SrTiO3薄膜 MIS结构 介电性能 Si/STO界面     

SrTiO3金属-绝缘体-半导体结构的介电与界面特性

采用金属有机分解法在p型Si衬底上制备了SiTiO3(STO)薄膜.研究了STO薄膜金属-绝缘体-半导体(MIS)结构的介电和界面特性.结果表明,STO薄膜显示出优异的介电性能,在10kHz处的介电常数约为105,损耗低于0.01,这来源于多晶结构和良好的结晶性;MIS结构中的固定电荷密度Nf和界面态密度Dit分别约为1.5×1012cm-2和(1.4-3.5)×1012 cm-2 eV-1,这主要与Si/STO界面处形成的低介电常数界面层有关.     

分子束外延生长Si/GaP(111)异质结的界面特性

本文研究了分子束外延(MBE)生长的n-N型Si/GaP(111)异质结的界面特性。采用C-V法测量Si/GaP(111)异质结的表观载流子浓度分布n(x),从中导出了异质界面的导带失配值和界面电荷密度。实验结果表明,n-N型Si/GaP(111)是一种弱整流结构。导带失配△E_c=0.10eV,界面电荷密度σ_i=8.8×10¹⁰cm^-2。通过表现载流子浓度n(x)的理论计算曲线与实验曲线符合较好,说明了实验结果的可靠性 关键词：     

MOS结构电离辐射效应模型研究

基于氧化层空穴俘获和质子诱导界面陷阱电荷形成物理机制的分析,分别建立了MOS结构电离辐射诱导氧化层陷阱电荷密度、界面陷阱电荷密度与辐射剂量相关性的物理模型.由模型可以得到,在低剂量辐照条件下辐射诱导产生的两种陷阱电荷密度与辐射剂量成线性关系,在中到高辐射剂量下诱导陷阱电荷密度趋于饱和,模型可以很好地描述这两种陷阱电荷与辐射剂量之间的关系.最后讨论了低剂量辐照下,两种辐射诱导陷阱电荷密度之间的关系,认为低辐射剂量下两者存在线性关系,并用实验验证了理论模型的正确性.该模型为辐射环境下MOS器件辐射损伤提供了更 关键词： MOS结构 辐射 界面陷阱 氧化层陷阱     

分子束外延生长Si/GaP珐()异质结的界面特性

本文研究了分子束外延(MBE)生长的n-N型Si/GaP(Ⅲ)异质结的界面特性。采用C-V法测量Si/GaP(Ⅲ)异质结的表观载流子浓度分布n(x),从中导出了异质界面的导带失配值和界面电荷密度。实验结果表明,n-N型Si/GaP(Ⅲ)是一种弱整流结构。导带失配△E_c=0.10eV,界面电荷密度σ_i=8.8×10~(10)cm~(-2)。通过表现载流子浓度n(x)的理论计算曲线与实验曲线符合较好,说明了实验结果的可靠性。     

一个非晶InGaZnO薄膜晶体管线性区陷阱态的提取方法

非晶InGaZnO(a-IGZO)薄膜在制备过程中形成的缺陷和弱键以陷阱态的形式非均匀分布在a-IGZO的带隙中, 这些陷阱态会俘获栅压诱导的电荷, 影响a-IGZO薄膜晶体管线性区迁移率、沟道电子浓度等, 进而影响线性区的电学性能. 本文基于线性区沟道迁移率与沟道内的自由电荷与总电荷的比值成正比, 分离出自由电荷以及陷阱态电荷. 由转移特性和电容电压特性得到自由电荷以及陷阱态电荷对表面势的微分, 分离出自由电子浓度和陷阱态浓度. 通过对沟道层与栅绝缘层界面运用泊松方程以及高斯定理, 考虑了沟道表面势与栅压的非均匀性关系, 得出自由电子浓度以及陷阱态浓度与表面势的关系, 最后通过陷阱态浓度与表面势求导得到线性区对应的态密度.     

电离辐射对部分耗尽绝缘体上硅器件低频噪声特性的影响

本文针对辐射前后部分耗尽结构绝缘体上硅(SOI)器件的电学特性与低频噪声特性开展试验研究. 受辐射诱生埋氧化层固定电荷与界面态的影响, 当辐射总剂量达到1 M rad(Si) (1 rad = 10^-2 Gy)条件下, SOI器件背栅阈值电压从44.72 V 减小至12.88 V、表面电子有效迁移率从473.7 cm²/V·s降低至419.8 cm²/V· s、亚阈斜率从2.47 V/dec增加至3.93 V/dec; 基于辐射前后亚阈斜率及阈值电压的变化, 可提取得到辐射诱生界面态与氧化层固定电荷密度分别为5.33×10¹¹ cm^{- 2}与2.36×10¹² cm^-2. 受辐射在埋氧化层-硅界面处诱生边界陷阱、氧化层固定电荷与界面态的影响, 辐射后埋氧化层-硅界面处电子被陷阱俘获/释放的行为加剧, 造成SOI 器件背栅平带电压噪声功率谱密度由7×10^{- 10} V²·Hz^-1增加至1.8×10^-9 V² ·Hz^-1; 基于载流子数随机涨落模型可提取得到辐射前后SOI器件埋氧化层界面附近缺陷态密度之和约为1.42×10¹⁷ cm^-3·eV^-1和3.66×10¹⁷ cm^-3·eV^-1. 考虑隧穿削弱因子、隧穿距离与时间常数之间关系, 本文计算得到辐射前后埋氧化层内陷阱电荷密度随空间分布的变化.     

部分耗尽SOI晶体管电离辐射损伤的物理模型

从氧化层俘获空穴和质子诱导界面态形成的物理机制出发,建立部分耗尽SOI器件总剂量辐射诱导的氧化层陷阱电荷和界面态物理模型,模型可以很好地描述辐射诱导氧化层陷阱电荷和界面态与辐射剂量的关系,并从实验上对上述模型结果给予验证.结果表明,在实验采用的辐射剂量范围内,辐射诱导产生的氧化物陷阱电荷与辐射剂量满足负指数关系.模型中如果考虑空穴的退火效应,可以更好地反映高剂量辐照下的效应;辐射诱导产生的界面态与辐射剂量成正比例关系.     

晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容散射机制

制备了晶格匹配In_(0.17)Al_(0.83)N/GaN异质结圆形平面结构肖特基二极管,通过测试和拟合器件的电容-频率曲线,研究了电容的频率散射机制.结果表明:在频率高于200 kHz后,积累区电容随频率出现增加现象,而传统的电容模型无法解释该现象.通过考虑漏电流、界面态和串联电阻等影响对传统模型进行修正,修正后的电容频率散射模型与实验结果很好地符合,表明晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容随频率散射是漏电流、界面态和串联电阻共同作用的结果.     

Influence of inserting AlN between AlSiON and 4H-SiC interface for the MIS structure

A control of interface between gate insulating film and semiconductor is required to achieve high-power field effect transistors (FET) using SiC. To improve the interface between the high-k layer and SiC, we propose inserting an AlN layer as an interfacial layer. The reason for selecting AlN film is that it has a wide bandgap, as well as almost the same lattice constant as that of 4H-SiC. The insertion of AlN film between 4H-SiC and the insulating film effectively reduces the interfacial roughness. The roughness of the interface between AlN and SiC can be suppressed compared with that of the thermal oxidized SiC. Moreover, the AlSiON film was deposited on the AlN layer as a high dielectric gate insulating film with low leakage current at high temperature and low space charge. The C-V characteristics of the AlSiON/AlN/SiC MIS structure with an AlN buffer layer are improved by increasing the deposition temperature of the AlN film. This demonstrates that AlSiON/AlN/SiC is one of attractive MIS structures for SiC devices.     

钙钛矿型HoNiO3中电荷歧化的第一原理研究

应用第一原理的密度泛函方法,研究钙钛矿型过渡金属氧化物HoNiO_3的电子结构. HoNiO_3在正交结构（空间群为Pbnm）和单斜结构（空间群为P2_1/n）的电子密度图表明Ni在正交相中只存在Ni^３＋一种组态，而在单斜相中则存在Ni^(3-δ)+和Ni^(3+δ) +两种不同的组态. 电荷歧化特征值δ可由Ni3d电子态密度中非键t_2g部 分反映. 通过t_2g态密度在正交和单斜相的相对变化，可以算得δ 值为0.34±0.01. 关键词： HoNiO＿3 电荷歧化 电子结构 第一原理计算     

The TITAN mass measurement facility at TRIUMF-ISAC

The TITAN facility at TRIUMF-ISAC will use four ion traps with the primary goal of determining nuclear masses with high precision, particularly for short lived isotopes with lifetimes down to approximately 10 ms. The design value for the accuracy of the mass measurement is 1 ×10^???8. The four main components in the facility are an RF cooler/buncher (RFCT) receiving the incoming ion beam, an electron beam ion trap (EBIT) to breed the ions to higher charge states, a cooler Penning trap (CPET) to cool the highly charged ions, and finally the measurement Penning trap (MPET) for the precision mass determination. Additional goals for this system are laser spectroscopy on ions extracted from the RFCT and beta spectroscopy in the EBIT (in Penning trap mode) on ions that are purified using selective buffer gas cooling in the CPET. The physics motivation for the mass measurements are manifold, from unitarity tests of the CKM matrix to nuclear structure very far from the valley of stability, nuclear astrophysics and the study of halo-nuclei. As a first measurement the mass of ¹¹Li will be determined. With a lifetime of 8.7 ms and a demonstrated production rate of 4×10⁴ ions/sec at ISAC the goal for this measurement at TITAN is a relative uncertainty of 5×10^???8. This would check previous conflicting measurements and provide information for nuclear theory and models.     

Charge storage characteristics in Al/AlN/Si metal–insulator–semiconductor structure based on deep traps in AlN layer

Charge storage characteristics in an Al/AlN/p-Si metal–insulator–semiconductor (MIS) structure have been investigated by capacitance–voltage and long-term capacitance measurements. Good program/erase behavior is observed in the AlN/Si structure, which is attributed to the trapping and detrapping of charges in deep traps of the AlN layer. In the long-term retention mode, a clear memory window is found 2000 s after removing a program/erase voltage of ±3 V, indicating good charge retention capability of the MIS structure. Further investigation shows that for a program pulse width of 500 ms, the charge storage does not occur when the pulse amplitude is smaller than a threshold value of ∼1 V. The trapped charge density increases linearly with increase of the pulse amplitude (>1 V) and tends to saturate at 2.5 V. With increasing program pulse width, the trapped charged density increases a little more than logarithmically. PACS 73.40.Kp; 72.20.Jv; 71.55.Eq     

AlGaN/AlN/GaN结构中二维电子气的输运特性

对使用金属有机物汽相沉积法生长的AlGaN/AlN/GaN结构进行的变温霍尔测量，测量结果指出在AlN/GaN界面处有二维电子气存在且迁移率和浓度在2K时分别达到了1.4×10⁴cm²·V^-1·s^-1和9.3×10¹²cm^-2，且在200K到2K范围内二维电子气的浓度基本不变，变磁场霍尔测量发现只有一种载流子(电子)参与导电.在2K温度下，观察到量子霍尔效应，Shubnikov-de Haas (SdH) 振荡在磁场约为3T时出现，证明了此结构呈现了典型的二维电子气行为.通过实验数据对二维电子气散射过程的半定量分析，推出量子散射时间为0.23ps，比以往报道的AlGaN/GaN结构中的散射时间长，说明引入AlN层可以有效减小合金散射，进一步的推断分析发现低温下以小角度散射占主导地位.     

薄热氮氧化硅介质膜中的电流传导机构

本文回顾了半导体介质膜中几种主要导电机构。提出了陷阶辅助二步隧穿模型来描述深度氮氧化膜SiO_xN_y的电导特性,而浅度氮氧化膜的电导则可用增强Fowler-Nordheim隧穿来描述。根据模型计算的理论曲线和实验结果符合得很好,决定二步隧穿过程的主要参数φ_t和N_t在2.46—2.56eV和1.2×10¹⁹—7.2×10²⁰cm^-3范围内。这些结果和前人实验结果相一致,并从俄歇分析结果得到满意解释。上述二步隧穿模型同样适用于MNOS结构或含有陷阶的其他介质MIS结构的电导过程。 关键词：     

Transport studies of carbon-rich a-SiC x :H film through admittance and deep-level transient spectroscopy measurements

An intrinsic, carbon-rich a-SiC _x :H thin film, prepared by the plasma-enhanced chemical vapour deposition (PECVD) technique, has been studied mainly by AC admittance and small-pulse deep-level transient spectroscopy (DLTS) measurements on an Al/a-SiC _x :H/p-Si metal–insulator–semiconductor (MIS) structure. The effects of measurement temperature, voltage and small-signal AC modulation frequency on the MIS capacitor are qualitatively and quantitatively described. The kinetics of charge injection from the silicon substrate into the a-SiC _x :H film, as a function of temperature and voltage bias stresses, are reported. Nearest-neighbour and variable-range hopping mechanisms are considered. An activation energy of ～?0.09?eV, and a density of states (DOS) of about 10¹⁹?cm^?3/eV were found. The value of the DOS is in agreement with the effective interface DOS of above 10¹²?cm^?2/eV assessed by both capacitance and DLTS measurements. The frequency (or temperature) dependence of the MIS capacitor over the whole DC voltage range is considered in detail. Single- and double-step carrier exchange mechanisms between the a-SiC _x :H film and the silicon substrate, in the accumulation and depletion voltage regimes, respectively, are proposed.     

Mg掺杂对AlGaN薄膜特性的影响

利用高精度x射线衍射和拉曼散射光谱，对MOCVD生长的不同Mg掺杂量的AlGaN薄膜的c轴 晶格常数、摇摆曲线和拉曼频移进行测量发现：当Mg掺杂剂量较小时，E2模式向 低频方向漂移表明张力应力有所增加，但是摇摆曲线和A1(LO)模式半高宽减小表 明薄膜质量有所提高；随着Mg掺杂剂量的增加，E2模式反向漂移表明此时薄膜中 存在压力应力，同时薄膜质量有所下降.最后根据拉曼频移和应力改变进行拟合得出相应的 线性表达式为Δσ＝-0298+0562·ΔE. 关键词： AlGaN:Mg 异质外延 x射线衍射 拉曼散射     

Electrical characteristics of insulating aluminum nitride MIS nanostructures

Capacitance-voltage measurements of high quality PECVD and MBE grown aluminum nitride (AlN) thin films have been performed. The prepared films have shown polycrystalline (0 0 2)-preferential orientation, and were deposited on p-type Si (1 0 0) substrates with Pt forming the metal gate in a metal-insulator-semiconductor (MIS) configuration. The structure, crystallinity, texture and insulating properties have been found to depend on film thickness and were substantially influenced by the increase of the thickness. C-V measurements of the epitaxial and PECVD films were carried out and their insulating characteristics with increasing thickness (200-1000 nm) were investigated. The epitaxial films exhibited no hysteresis in capacitance behaviour, owing to better crystalline quality over the PECVD grown ones. Capacitance curves versus bias voltage have also been acquired at different temperatures; 10 K, 30 K and 50 K for deposited polycrystalline AlN films of (0 0 2) orientation. We have found that the defects trapped in the Pt/AlN/Si structure played a key role in dominating the overall behaviour of the C-V measurement curves. The trapped charges at the interface between the AlN insulating film and Si substrate caused the capacitance characteristics to shift to negative voltages, and the estimated charge density was of the order of 10¹⁰ and 10⁸ cm⁻² eV⁻¹ for the PECVD and epitaxial samples respectively. The I-V measurements referred to space-charge conduction mechanism, and the deduced leakage current was found to be of the order of 10⁻⁹ A at 200 nm film thickness.