光学仪器结构件粘接用胶的改性

本文论述了光学仪器产品结构件粘接用环氧树脂胶改性的可能性及其机理。对光学零件与金属框座及薄型、微小型金属结构件粘接用胶，选用含有聚丙二醇的二环氧化合物进行改性；对一般金属结构件及专用工具粘接用胶，选用端羟基丁腈共聚物（ＣＴＢＮ）进行改性。并分别添加适当的活性稀释剂及相应的固化剂，组成环氧树脂体系胶粘剂。经过多年的生产实践表明：它们均具有较好的增韧效果及粘接性能，粘接的结构件性能稳定可靠。     

尼龙1010—聚四氢呋喃多嵌段共聚物的ESCA研究

尼龙１０１０－聚四氢呋喃多嵌段共聚物（ＰＡ－ＰＴＭＧ）是一种性能良好的聚合物。本文用Ｘ射线光电子能谱（ＥＳＣＡ）和计算机分峰技术研究了不同软硬段分子量的ＰＡ－ＰＴＭＧ的表面化学组成，进行了试样ＥＳＣＡ谱峰归属的确定。结果表明，本体嵌段效果较好，但在样品表面上Ｏ／Ｎ原子比大于体相Ｏ／Ｎ原子比，即软段富集于表面，并且分相程度高的试样较分相程度低的试样其软段在表面富集得更多。     

光学塑料及其注射成型工艺的新进展

主要介绍光学塑料和塑料零件注射成型工艺在近几年来的新进展。其中包括：１．对ＣＲ３９的改性：共聚改性；ＣＲ３９分子内部改性；掺入无机化合物。２．ＥＡ光学塑料。３．对ＰＭＭＡ的改性。４．日本的新塑料ＡＲＴＯＮ５．光学塑料元件二次加工时所用的特殊抛光剂。６．利用注射压缩成型方法提高产品的质量。     

尼龙1010－聚四氢呋喃多嵌段共聚物的ESCA研究

尼龙１０１０－聚四氢呋哺多嵌段共聚物（ＰＡ－ＰＴＭＧ）是一种性能良好的聚合物。本文用Ｘ射线光电子能谱（ＥＳＣＡ）和计算机分峰技术研究了不同软硬段分子量的ＰＡ－ＰＴＭＧ的表面化学组成，进行了试样ＥＳＣＡ谱峰归属的确定。结果表明，本体嵌段效果较好，但在样品表面上Ｏ／Ｎ原子比大于体相Ｏ／Ｎ原子比，即软段富集于表面，并且分相程度高的试样较分相程度低的试样其软段在表面富集得更多。     

光学仪器胶粘剂应用现状及进展

本文是在对国内光学零件加工及光学仪器产品胶粘剂的应用现状与研究动态的调研基础上，结合作者的工作，综合介绍了光学零件加工过程中工艺用粘接材料与工艺材料用树脂结合剂；光学零件、光学分划元件、光学偏振元件、光学塑料元件等的胶合用光学胶；光学仪器产品结构用结构胶及非结构胶；光学仪器产品及部件用密封胶等的应用现状及其进展概况     

1－苄基－9－氢富勒烯－60LB多层膜的制备及其光学非线性性质

利用π－Ａ等温线、小角Ｘ射线衍射（ＳＡＸＤ）和光学测量方法研究了一种取代富勒烯（Ｃ６０－Ｂｅ）ＬＢ膜的结构特性。纯Ｃ６０－Ｂｅ分子以体相（ｂｕｌｋｐｈａｓｅ）的形式存在于气－液界面上。氮冠（醚）（ＮＣ）分子作为隔层材料，与Ｃ６０－Ｂｅ分子相混合可以制备性能优良的ＬＢ膜。π－Ａ、吸收和小角Ｘ光衍射测量表明：这种混合膜结构的改善是由于Ｃ６０－Ｂｅ分子镶嵌在ＮＣ分子的双脂链之间造成的。通过测量三次谐波产生（ＴＨＧ）可以推出Ｃ６０－Ｂｅ的三阶非线性系数χ（３）＝２．１×１０－１１ｅｓｕ。     

光学塑料注射成型的状态分析

本文通过对塑料光学元件注射成型过程的分析，以光学塑料熔体的状态方程以及流变学Ｈａ－ｇｅｎ－Ｐｏｉｓｅｌｌｉｌｅ方程为出发点，讨论并给出了光学塑料零件的成型工艺及模具浇注系统的设计准则。     

CAE在塑料光学零件注射成型中的应用

目前光学塑料非球面零件在各种光电仪器中的应用越来越普遍。针对在注射成型光学塑料零件时对质量的特殊要求,本文介绍了利用注射成型ＣＡＥ（ｃｏｍｐｕｔｅｒ ａｉｄｅｄｅｎｇｉｎｅｅｒｉｎｇ）软件Ｍｏｌｄｆｌｏｗ,通过对塑料填充过程、保压过程和冷却过程的模拟分析,对在成型中各工艺参数和模具结构影响光学塑料零件的残余应力和收缩率等最终质量问题进行了研究。从工艺参数的选取和模具结构设计等方面,提出了如何改善成型光学塑料零件质量的措施,给出了模具面形成型前补偿的方法。通过采用最大实体原则,利用Ｍｏｌｄｆｌｏｗ分析结果进行模具面形补偿最优化计算。     

PAN基活性炭纤维的表面及其孔隙结构解析

通过氮吸附等温线、Ｘ射线光电子能谱以及扫描电子显微镜（ＳＥＭ）对聚丙烯腈（ＰＡＮ－Ｐｏｌｙａｃｒｙｌｏｎｉｔｒｉｌｅ）－基活性炭纤维（ＡＣＦ－Ａｃｔｉｖａｔｅｄ Ｃａｒｂｏｎ Ｆｉｂｅｒ）的表面和孔隙结构进行了分析，结果表明吸附测量可以提供有关碳质吸附剂的孔结构复杂性；通过ＸＰＳ对ＰＡＮ基ＡＣＦ的表面官能团的种类及含量进行了表征，由ＳＥＭ对ＰＡＮ基ＡＣＦ的表面以及断面的孔隙结构进行直拉观察，提供了     

杂化溶胶改性紫外光固化胶粘剂的研究

 以自制的杂化溶胶对紫外光固化丙烯酸酯胶粘剂进行改性，得到了具有高粘接强度，对丙酮、乙醇、氯仿等具有明显的耐溶剂性的紫外光固化胶粘剂。实验发现：活性稀释剂中含有较多的羟基、羧基时，此胶粘剂对玻璃的粘接强度较高；胶层粘接力随杂化溶胶用量的增加先增大，后减小，当杂化溶胶中的固体质量为光敏树脂的60％时，胶粘剂的剪切强度达到最大（12MPa）。     

制作光盘和光纤的塑料及其发展动向

简要叙述光盘的结构原理、分类、光盘材料及其特性,并指出了材料的发展动向。对光纤的材料、塑料光纤的制备方法和特点以及发展方向与技术关键亦作了简要介绍。     

Tribological aspects in nanostructuring burnishing of structural steels

The paper studies tribological aspects of nanostructuring burnishing of steels. The efficiency of the process in improving the tribological properties of steels is assessed as regards the choice of an indenter material and lubricant-coolant reasoning from the friction coefficient at the “indenter-treated part” contact and from the absence of adhesive bond and fatigue microcracks. It is shown that synthetic diamond and dense boron nitride are promising indenter materials for nanostructuring burnishing of corrosion-resistant 20X13 steel and cement 20X steel. It is demonstrated that nanostructuring burnishing increases the wear resistance of structural steels under abrasive action and sliding friction in different media (lubricant, water, air, and argon) due to suppressed processes of microcutting, plastic edging, fatigue and oxidation wear, and adhesive bonding.     

照明用大功率发光二极管封装材料的优化设计

根据传热理论,建立了大功率发光二极管的有限元模型.选择了4种键合材料（高导热导电银胶、纳米银焊膏,大功率芯片键合胶、Sn70Pb30）,4种基板材料（Al2O3、AlN、Al-SiC、铜钼合金）.采用ANSYS有限元热分析软件进行了温度场仿真,得到了大功率发光二极管封装材料的最优选择.研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.结果表明:纳米银焊膏-AlN组合具有最优的散热效果|增加散热基板厚度提高散热能力的作用不大|单个发光二极管输出功率有限,应优化封装结构并采用多芯片阵列来满足照明级的需要|外接铝热沉能达到理想的散热效果.     

Optical alignment tolerances in double-side irradiated self-written waveguide-induced fiber arrays packages

In this paper, we present our experimental study on the optical alignment tolerance between the couplings of single-mode fibers (SMFs) connected with a double-side irradiation-induced self-written waveguide (SWW). The study firstly focuses on the coupling of two SMFs and then on the two fiber arrays (FAs) for parallel optical communication. The SWW was formed in dye-dispersed epoxy materials by the photopolymerization technique. Rhodamine 6G dye was dispersed in epoxy, which is commonly used in the photonic packaging industry as a bonding adhesive. Using double-side irradiated SWW, we found the alignment tolerance for such optical interconnect to relax significantly. All the formed SWWs were evaluated in terms of optical loss. In our study, up to 4 µm misalignment tolerance was allowed for only 1 dB loss penalty. In addition, the optical interconnect formed by this technique was also able to tolerate up to ± 10 µm lateral shift with only 1 dB extra loss. The wavelength-dependent loss (from 1520 to 1610 nm) and polarization-dependent loss were less than 0.4 dB. The double-side irradiated SWW-induced couplings between two FAs also provided low optical loss. They were found to be less sensitive to temperature changes, and no significant distortion in the digital signal transmission test was observed. We believe that the findings are useful and applicable to other dye-dispersed epoxy material systems for relaxing the alignment tolerance of the optical interconnects in various photonic packaging situations.     

惯性约束聚变实验用玻璃微球堵口特种胶研究

 通过对不同固化和热处理过程后的胶粘剂的剪切强度、表面形貌特征、热性能的研究，分析了增韧剂和偶联剂对环氧有机硅胶粘剂性能的影响。研究表明：随着增韧剂含量的增加，胶粘剂热分解温度下降；增韧剂质量分数为25%时，有机硅与环氧树脂相容性较好，制备的胶粘剂综合性能较好；硅烷偶联剂能改善胶层与金属界面的胶接强度，提高环氧有机硅胶粘剂的拉伸剪切强度。显微组织观察分析表明，环氧有机硅胶粘剂中环氧树脂分子链与有机硅高分子链处于一定微相分离状态。     

Adhesive bonding of composite aircraft structures: Challenges and recent developments

In this review paper,the challenges and some recent developments of adhesive bonding technology in composite aircraft structures are discussed.The durability of bonded joints is defined and presented for parameters that may influence bonding quality.Presented is also,a numerical design approach for composite joining profiles used to realize adhesive bonding.It is shown that environmental ageing and pre-bond contamination of bonding surfaces may degrade significantly fracture toughness of bonded joints.Moreover,it is obvious that additional research is needed in order to design joining profiles that will enable load transfer through shearing of the bondline.These findings,together with the limited capabilities of existing non-destructive testing techniques,can partially explain the confined use of adhesive bonding in primary composite aircraft structural parts.     

III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects

In this paper III‐V on silicon‐on‐insulator (SOI) heterogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter‐chip and intra‐chip optical interconnects. Two bonding technologies are used to realize the III‐V/SOI integration: one based on molecular wafer bonding and the other based on DVS‐BCB adhesive wafer bonding. The realization of micro‐disk lasers, Fabry‐Perot lasers, DFB lasers, DBR lasers and mode‐locked lasers on the III‐V/SOI material platform is discussed.     

基于THz-TDS的陶瓷纤维复合材料缺陷检测分析

新型陶瓷纤维复合材料由短切氧化硅纤维及其胶合物经高温烧结得到的一种轻质多孔材料,材料微观结构特性直接影响着宏观结构特性和功能特性.该类材料的孔隙度分布在84％ ～95％ 之间,微观孔径主要集中在100μm范围内,偶尔有少量纳米孔.陶瓷纤维复合材料以其耐高温、低密度、高比强和抗烧蚀等优异性能在超高声速飞行器外层隔热部件得...     

How acoustic cavitation can improve adhesion

In general, ultrasound is commonly used at low power level for non-destructive testing (NDT) and detection of delaminations in adhesive bonded structures. The present paper instead presents an approach where power ultrasound is used to improve interface formation prior to the bonding process and to ensure the quality of adhesive bonds by using acoustic cavitation in the liquid adhesive.Results from high-speed videos, rheological and thermal measurements and destructive testing of adhesive bonds with contaminated surfaces are presented and discussed. Power ultrasound can be used in general to improve adhesion and significantly to improve contamination tolerance and robustness of adhesive bonding processes.