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Optical alignment tolerances in double-side irradiated self-written waveguide-induced fiber arrays packages
Authors:KW Cheng  SC Chan
Institution:Optoelectronic Laboratory, Department of Electronic Engineering, City University of Hong Kong, Hong Kong
Abstract:In this paper, we present our experimental study on the optical alignment tolerance between the couplings of single-mode fibers (SMFs) connected with a double-side irradiation-induced self-written waveguide (SWW). The study firstly focuses on the coupling of two SMFs and then on the two fiber arrays (FAs) for parallel optical communication. The SWW was formed in dye-dispersed epoxy materials by the photopolymerization technique. Rhodamine 6G dye was dispersed in epoxy, which is commonly used in the photonic packaging industry as a bonding adhesive. Using double-side irradiated SWW, we found the alignment tolerance for such optical interconnect to relax significantly. All the formed SWWs were evaluated in terms of optical loss. In our study, up to 4 µm misalignment tolerance was allowed for only 1 dB loss penalty. In addition, the optical interconnect formed by this technique was also able to tolerate up to ± 10 µm lateral shift with only 1 dB extra loss. The wavelength-dependent loss (from 1520 to 1610 nm) and polarization-dependent loss were less than 0.4 dB. The double-side irradiated SWW-induced couplings between two FAs also provided low optical loss. They were found to be less sensitive to temperature changes, and no significant distortion in the digital signal transmission test was observed. We believe that the findings are useful and applicable to other dye-dispersed epoxy material systems for relaxing the alignment tolerance of the optical interconnects in various photonic packaging situations.
Keywords:Optical interconnect  Alignment tolerance  Self-written waveguide (SWW)  Double-side irradiation  Fiber arrays (FAs)  Packaging
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