GaInP/GaAs/Ge三结太阳电池的电子辐照损伤效应

研究了1 MeV和1.8 MeV电子辐照下GaInP/GaAs/Ge三结太阳电池的辐照损伤效应.电学性能研究结果表明,GaInP/GaAs/Ge三结太阳电池的开路电压、短路电流和最大功率随辐照剂量的增加发生明显衰降,在1 MeV电子辐照下剂量为1×10¹⁵cm^-2时,与辐照前相比最大功率衰降了17.7%.暗I-V特性分析表明,高能电子辐照下三结电池串、并联电阻的变化是引起太阳电池电学性能衰降的重要原因.光谱响应分析结果表明,GaInP 关键词： GaInP/GaAs/Ge太阳电池 电子辐照 电学性能 光谱响应     

位移损伤剂量法评估空间GaAs/Ge太阳电池辐照损伤过程

本文针对GaAs/Ge太阳电池,利用位移损伤剂量法研究了其在轨服役条件下的性能退化行为.首先在地面模拟辐照环境中,试验获得了在不同能量的电子和质子辐照下的电池性能随辐照注量的退化行为.基于上述实验结果以及计算获得的带电粒子在电池中的非电离能量损失(NIEL)获得了不同能量电子辐照位移损伤的等效指数n为1.7,电子损伤剂量转化为质子损伤剂量等效系数为5.2,并进一步建立了电池性能随位移损伤剂量的退化方程.利用该方法对国产GaAs/Ge太阳电池在500,22000和36000 km轨道带电粒子辐 关键词： GaAs/Ge太阳电池 辐照损伤 带电粒子 位移损伤剂量     

质子辐照CH3NH3PbI3基钙钛矿太阳能电池的损伤效应

针对钙钛矿太阳能电池(PSCs)的空间应用,研究了动能为0.1—20.0 MeV的质子在CH₃NH₃PbI₃(简称MAPbI₃)薄膜及其太阳能电池中引起的损伤效应.结果表明, PSCs具有良好质子辐照稳定性,当0.1 MeV(2.0 MeV)质子的注量超过1×10¹³ p/cm² (1×10¹⁴ p/cm²)时,才会引起电池光电性能的降低. PSCs载流子传输层的辐照退化可能是造成电池性能降低的主要原因. MAPbI₃中的有机成分MAI会在质子辐照作用下发生分解,分解产生的气态产物(NH₃和CH₃I)将最终导致PSCs表面金电极的剥落.对于具有更大离子射程的10 MeV和20 MeV质子,入射质子会在PSCs的玻璃基底中产生色心缺陷,造成玻璃对可见光透射率的降低.色心缺陷可以在室温或100℃条件下发生热退火,降低玻璃的透射损失.     

GaInP/GaAs/Ge三结太阳电池不同能量质子辐照损伤模拟

以GaInP/GaAs/Ge三结太阳电池为研究对象,开展了能量为0.7, 1, 3, 5, 10 MeV的质子辐照损伤模拟研究,建立了三结太阳电池结构模型和不同能量质子辐照模型,获得了不同质子辐照条件下的I-V曲线,光谱响应曲线,结合已有实验结果验证了本文模拟结果,分析了三结太阳电池短路电流、开路电压、最大功率、光谱响应随质子能量的变化规律,利用不同辐照条件下三结太阳电池最大输出功率退化结果,拟合得到了三结太阳电池最大输出功率随位移损伤剂量的退化曲线.研究结果表明,质子辐照会在三结太阳电池中引入位移损伤缺陷,使得少数载流子扩散长度退化幅度随质子能量的减小而增大,从而导致三结太阳电池相关电学参数的退化随质子能量的减小而增大.相同辐照条件下,中电池光谱响应退化幅度远大于顶电池光谱响应退化幅度,中电池抗辐照性能较差,同时中电池长波范围内光谱响应的退化幅度比短波范围更大,表明中电池相关电学参数的退化主要来源于基区损伤.     

质子辐照对纯铝薄膜微观结构的影响

利用透射电子显微镜(TEM)详细分析了不同剂量的质子辐照纯铝薄膜样品的微观结构, 质子的能量E=160 keV.实验表明,质子辐照能够在Al薄膜中诱发空位位错圈,在实验范围内,位错密度随辐照剂量的增加而增加;质子辐照在1×10¹¹—4×10¹¹/mm²范围内随辐照剂量的增加,位错圈数量密度以及位错圈尺寸都随之增加.在较高剂量6×10¹¹/mm²辐照下,位错圈数量密度减小,但其尺寸显著 关键词： 质子辐照 空位簇缺陷 位错圈 微观结构     

975 nm量子阱激光二极管的质子位移损伤

针对典型卫星轨道辐射环境下激光二极管(LD)的可靠性评估问题，对自研的975 nm GaAs基量子阱(QW)LD开展了10 MeV质子、3×10⁸～3×10¹¹ cm^-2注量的地面模拟辐照实验。结合蒙特卡罗软件仿真模拟和数学分析方法，全面研究了器件位移损伤退化规律，以及不同注量、不同辐照缺陷对器件功率特性、电压特性和波长特性等关键参数的影响。结果显示，质子辐照会引入非辐射复合中心等缺陷并破坏界面结构，导致载流子浓度降低、光电限制能力下降，宏观上体现为器件阈值电流增加、输出功率下降、波长红移和单色性受损。同时，3×10¹⁰ cm^-2以上注量的10 MeV质子等效位移损伤剂量辐照会对975 nm QW LD性能产生较大影响。     

不同能量质子辐照诱发CCD图像传感器性能退化实验与分析

为了评估电荷耦合器件(CCD)在空间科学探测以及航天卫星成像等空间辐射环境中应用的可靠性,揭示了CCD转换增益以及线性饱和输出等重要性能参数的退化机制及其实验规律。辐照实验在质子回旋加速器上进行,质子能量为60 MeV和100 MeV,质子注量分别为1×10¹⁰ cm^-2、5×10¹⁰ cm^-2和1×10¹¹ cm^-2。将CCD的主要性能参数在两个不同能量质子辐照后进行比较,实验结果表明,CCD的性能参数对质子辐照产生的电离损伤和位移损伤非常敏感,辐照后转换增益和线性饱和输出明显下降,且暗信号尖峰和暗电流明显增大。此外,分析了质子辐照CCD诱发的电离损伤和位移损伤,给出了CCD性能参数退化与质子辐照能量和注量的变化关系曲线。     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

不同能量质子辐照诱发子电池GaAs退化模拟研究

为了研究空间辐照诱发的子电池GaAs相关参数的退化行为,以三结太阳电池的子电池GaAs为研究对象,开展了不同辐照条件下的质子辐照模拟研究,建立了子电池GaAs结构模型,得到了不同辐照能量和注量下短路电流、开路电压、转化因子、最大功率的退化结果。利用现有实验数据,验证了不同能量质子辐照诱发的子电池GaAs的归一化最大功率随质子注量的退化。结合子电池GaAs在不同辐照条件下的最大功率退化结果,得到了归一化最大功率随位移损伤剂量的退化方程。研究结果表明:质子辐照诱发的辐照缺陷是导致子电池退化的直接原因,子电池GaAs的短路电流、开路电压、转化因子和最大功率随质子注量的增加而逐渐退化。当质子注量大于1×10~(11) cm~(-2)时,子电池GaAs的归一化电学参数的退化幅度与质子注量的对数值近似成正比,电学参数的退化随质子辐照能量的减小而逐渐增加。质子辐照诱发的子电池GaAs的外量子效率在长波长范围内的退化情况比其在短波长范围内的退化情况更严重。     

Mo/Si多层膜在质子辐照下反射率的变化

为了检验应用在极紫外波段空间太阳望远镜上Mo/Si多层膜反射镜在空间辐射环境下反射率的变化情况, 模拟了部分空间太阳望远镜运行轨道的辐射环境, 利用不同能量和剂量的质子对Mo/Si多层膜反射镜进行辐照实验.辐照前后反射率测量结果显示,由于带电粒子的辐照损伤,质子辐照会使Mo/Si多层膜反射镜的反射率降低,且质子能量越低、剂量越大,对多层膜的反射率影响越明显. 当质子能量E=160keV,剂量＝6×10¹¹/mm²时,反射率降低4.1%;能量E=100keV,剂量=6×10¹¹/mm²时, 反射率降低5.7%;能量E=50keV,剂量=8×10¹²/mm²时,反射率降低10.4%. 用原子力显微镜测量辐照后Mo/Si多层膜反射镜的表面粗糙度比辐照前明显增加,致使散射光线能量逐渐增大并最终导致反射率的降低. 关键词： 质子辐照 Mo/Si多层膜反射镜 辐照损伤     

Comparison of 1 MeV electron,Co-60 gamma and 1 MeV proton irradiation effects on silicon NPN transistors

The total dose effects of 1?MeV electrons on the dc electrical characteristics of silicon NPN transistors are investigated in the dose range from 100?krad to 100?Mrad. The different electrical characteristics such as Gummel characteristics, excess base current (ΔI_B), dc current gain (h_FE), transconductance (g_m), displacement damage factor (K) and output characteristics were studied in situ as a function of total dose. A considerable increase in base current (I_B) and a decrease in h_FE, g_m and I_CSat was observed after 1?MeV electron irradiation. The collector–base (C–B) junction capacitance of transistors was measured to estimate the change in the effective carrier concentration. After 1?MeV electron irradiation, a considerable degradation in capacitance was observed. The plot of (1/C²) versus voltage shows that the effective carrier concentration and built-in voltage (V_bi) increase marginally upon 1?MeV electron irradiation. The results of 1?MeV electron irradiation were compared with 1?MeV proton and Co-60 gamma irradiation results in the same dose range. The degradation for 1?MeV electron and Co-60 gamma-irradiated transistors was significantly less when compared to 1?MeV proton-irradiated transistor. The 1?MeV proton, 1?MeV electron and Co-60 gamma-irradiated transistors were subjected to isochronal annealing to analyze the recovery of the electrical parameters.     

Comparison of effect of 5 MeV proton and Co-60 gamma irradiation on silicon NPN rf power transistors and N–channel depletion MOSFETs

NPN transistors and N-channel depletion metal oxide semiconductor field effect transistors (MOSFETs) were irradiated with 5?MeV protons and ⁶⁰Co gamma radiation in the dose ranging from 1?Mrad(Si) to 100?Mrad(Si). The different electrical characteristics of the NPN transistor such as Gummel characteristics, excess base current (ΔI_B), dc current gain (h_FE), transconductance (g_m), displacement damage factor (K) and output characteristics were studied as a function of total dose. The different electrical characteristics of N-channel MOSFETs such as threshold voltage (V_th), density of interface trapped charges (ΔN_it), density of oxide trapped charges (ΔN_ot), transconductance (g_m), mobility (µ) and drain saturation current (I_DSat) were studied systematically before and after irradiation in the same dose ranges. A considerable increase in the base current (I_B) and decrease in the h_FE, g_m and collector saturation current (I_CSat) were observed after irradiation in the case of the NPN transistor. In the N-channel MOSFETs, the ΔN_it and ΔN_ot were found to increase and V_th, g_m, µ and I_DSat were found to decrease with increase in the radiation dose. The 5?MeV proton irradiation results of both the NPN transistor and N-channel MOSFETs were compared with ⁶⁰Co gamma-irradiated devices in the same dose ranges. It was observed that the degradation in 5?MeV proton-irradiated devices is more when compared with the ⁶⁰Co gamma-irradiated devices at higher total doses.     

Swift heavy ions-induced degradation on the electrical characteristics of silicon NPN power transistors

ABSTRACT

The pre- and post-irradiation effects on the DC electrical characteristics of 100?MeV Phosphorous (P⁷⁺) and 80?MeV Nitrogen (N⁶⁺) ion-irradiated NPN transistors were studied in the dose range from 600?krad (Si) to 100?Mrad (Si). The different electrical characteristics, such as Gummel characteristics, excess base current (ΔI_B?=?I_B-Post?–?I_B-Pre), current gain (h_FE), damage constant (K) and output characteristics, were measured in situ after ion irradiation. The considerable increase in the base current (I_B) at lower V_BE and slight decrease in the collector current (I_C) at higher V_BE were observed after ion irradiation. The C–V measurements revealed that the doping concentration (N_d) was found decreased, while the built-in potential (V_bi) increased after irradiation. The ion-irradiated results are compared with ⁶⁰Co gamma-irradiated results in the same dose range. The SRIM simulation was performed to understand the range of ions and energy loss in the transistor structure. The SRIM simulation showed that 100?MeV P⁷⁺ and 80?MeV N⁶⁺ ions can easily pass through the active region of transistors by creating ionization and displacement damages in the device structure. The irradiation results showed that ions induce more degradation in the electrical characteristics when compared to ⁶⁰Co gamma radiation at the same dose range.     

95 MeV Oxygen Ion Irradiation Effects on N-Channel Mosfets

The N-channel metal oxide semiconductor field effect transistors (MOSFETs) were exposed to 95 MeV oxygen ions in the fluence range of 5 × 10¹⁰ to 5 × 10¹³ ions/cm². The influence of ion irradiation on threshold voltage (V_TH), linear drain current (I_DLin), leakage current (I_L), drain conductance (gD), transconductance (gm), mobility (μ) and drain saturation current (I_DSat) of MOSFETs was studied systematically for various fluence. The V_TH of the irradiated MOSFET was found to decrease significantly after irradiation. The interface (N_it) and oxide trapped charge (N_ot) were estimated from the subthreshold measurements and were found to increase after irradiation. The densities of oxide-trapped (ΔN_it) charge in irradiated MOSFETs were found to be higher than those of the interface trapped charge (ΔN_ot). The I_DLin and I_DSat of MOSFETs were also found to decrease significantly after irradiation. Studies on effects of 95 MeV oxygen ion irradiation on gm, gD and μ show a degradation varying from 70 to 75% after irradiation. The mobility degradation coefficients for N_it(α_it) and N_ot(α_it) were estimated. The results of these studies are presented and discussed.     

Displacement damage analysis and modified electrical equivalent circuit for electron and photon-irradiated silicon solar cells

Solar modules and arrays are the conventional energy resources of space satellites. Outside the earth's atmosphere, solar panels experience abnormal radiation environments and because of incident particles, photovoltaic (PV) parameters degrade. This article tries to analyze the electrical performance of electron and photon-irradiated mono-crystalline silicon (mono-Si) solar cells. PV cells are irradiated by mono-energetic electrons and poly-energetic photons and immediately characterized after the irradiation. The mean degradation of the maximum power (P_max) of silicon solar cells is presented and correlated using the displacement damage dose (D_d) methodology. This method simplifies evaluation of cell performance in space radiation environments and produces a single characteristic curve for P_max degradation. Furthermore, complete analysis of the results revealed that the open-circuit voltage (V_oc) and the filling factor of mono-Si cells did not significantly change during the irradiation and were independent of the radiation type and fluence. Moreover, a new technique is developed that adapts the irradiation-induced effects in a single-cell equivalent electrical circuit and adjusts its elements. The “modified circuit” is capable of modeling the “radiation damage” in the electrical behavior of mono-Si solar cells and simplifies the designing of the compensation circuits.     

Temperature and 8 MeV electron irradiation effects on GaAs solar cells

GaAs solar cells hold the record for the highest single band-gap cell efficiency. Successful application of these cells in advanced space-borne systems demand characterization of cell properties like dark current under different ambient conditions and the stability of the cells against particle irradiation in space. In this paper, the results of the studies carried out on the effect of 8 MeV electron irradiation on the electrical properties of GaAs solar cells are presented. The I–V (current-voltage) characteristics of the cells under dark and AM1.5 illumination condition are studied and 8 MeV electron irradiation was carried out on the cells where they were exposed to graded doses of electrons from 1 to 100 kGy. The devices were also characterized using capacitance measurements at various frequencies before and after irradiation. The effect of electron irradiation on the solar cell parameters was studied. It is found that only small changes were observed in the GaAs solar cell parameters up to an electron dose of 100 kGy, exhibiting good tolerance for electrons of 8 MeV energy.