铝纳米晶的正电子湮没研究

采用自悬浮定向流-真空热压法,在不同压强下制得铝纳米晶材料,并利用X射线衍射(XRD)和正电子湮没寿命谱(PALS)分析手段对铝纳米晶的结构和微观缺陷进行表征.XRD分析表明:所制备的铝纳米晶的晶粒度为48 nm.PALS分析表明:铝纳米晶的微观缺陷主要为类空位以及空位团,而微孔洞很少;短寿命τ1,中间寿命τ2以及其对应的强度I1,I2随压强变化而呈现阶段性变化;压制压强(P)低于0.39 GPa时制得的纳米晶空位团随压强的增加而逐渐转变为类空位;0.39 GPa P 0.72 GPa时,各类缺陷发生消除;P 0.72 GPa时,各类缺陷进一步发生消除.随压强的提高,铝纳米晶的密度增加,其显微硬度也明显增高.     

退火温度对ZrO2纳米材料中Eu3+离子发光的影响

研究了退火温度对ZrO2纳米材料中Eu3+离子发光性质的影响.材料的结构、晶粒尺寸和形状以及晶格的排列分别由XRD,TEM表征.结果表明:用共沉淀法制备的ZrO2纳米材料具有不随退火温度变化、稳定的四方结构;材料的晶粒尺寸随退火温度的提高而增大;品格的排列由无序逐渐变为有序;发射光谱表明其主要发射在595 nm和604 nm处;在394 nm的紫外光辐照下得到了不同样品的604 nm荧光发射强度的变化不同.这种现象与样品中O2-离子含量和样品表面的表面缺陷有关;另外,电荷迁移带随退火温度的变化而变化.     

退火温度对ZrO2纳米材料中Eu3+离子发光的影响

研究了退火温度对ZrO₂纳米材料中Eu³⁺离子发光性质的影响. 材料的结构、晶粒尺寸和形状以及晶格的排列分别由XRD，TEM表征. 结果表明：用共沉淀法制备的ZrO₂纳米材料具有不随退火温度变化、稳定的四方结构；材料的晶粒尺寸随退火温度的提高而增大；晶格的排列由无序逐渐变为有序；发射光谱表明其主要发射在595 nm和604 nm处；在394 nm的紫外光辐照下得到了不同样品的604 nm荧光发射强度的变化不同. 这种现象与样品中O^2-离子含量和样品表面的表面缺陷有关；另外，电荷迁移带随退火温度的变化而变化.     

ICF物理实验用纳米Cu块体靶材的制备研究

 采用自悬浮定向流法制备了金属纳米粉体并采用真空手套箱专利技术和冷压法在高压（1.5 GPa）作用下保压40 min后，成功制备出了相对密度达97％和显微硬度达1.85 GPa的金属Cu纳米晶材料。经XRD分析，其晶粒大小为20 nm。正电子湮没(PAS)实验结果表明，其空隙大小和数量与采用惰性气体冷凝法原位压制(IGC)的样品相比，空位簇数量较多，微空隙的大小和数量基本相当。激光惯性约束聚变（ICF）模拟实验表明：采用该方法制备的纳米Cu块体材料靶的激光转换效率比常规Cu材料靶高5倍。     

形变充氢多晶纯钴中缺陷的正电子湮没研究

用正电子寿命和多普勒线形参数测量技术,研究了形变和形变充氢多晶钴试样的缺陷性质及其回复行为。观察到形变样品阴极充氢后,氢致缺陷为一定量的位错和空位以及少量的空位团。没有观察到微空洞和微裂纹的产生。单空位的回复温度范围为73—260℃,位错和空位团的退火发生在350—670℃温度范围。测得空位的迁移激活能为E_v^m=1.09±0.07eV。 关键词：     

退火对Hf_(1-x)Y_(x)O_(2 )体系的结构与磁性的影响

利用溶胶凝胶法制备不同掺杂浓度的Hf_(1-x)Y_(x)O_(2 )(α=0,0.07,0.3,0.5)系列样品,探究了不同退火时间对样品的结构、形貌、磁学性质的影响.X射线衍射分析表明,随着掺杂浓度的提高,样品从单斜相逐渐转变为立方相.掺杂浓度为=0.07的样品为单斜和立方的混合相,且随着退火时间的延长,单斜相的比例逐渐增加.扫描电子显微镜结果表明,样品为几十微米大小的不规则颗粒,不同退火时间对样品形貌无显著影响.磁性测量结果表明,掺杂样品在室温下具有铁磁特性,而且可以利用掺杂浓度和退火时长进行调控.我们认为Hf_(1-x)Y_(x)O_(2 )体系的室温铁磁性可能与Y掺杂导致的样品内氧空位及缺陷有关.     

Co掺杂纳米ZnO微结构的正电子湮没研究

利用正电子湮没技术研究了10 at.% Co掺杂的Co₃O₄/ZnO纳米复合物中退火对缺陷的影响. 利用X射线衍射(XRD)测量了Co₃O₄/ZnO纳米复合物的结构和晶粒尺寸. 随着退火温度升高,Co₃O₄相逐步消失,ZnO晶粒尺寸也有显著增加. 经过1000 ℃以上退火后,Co₃O₄相完全消失,并出现了CoO的岩盐结构. 正电子湮没寿命测量显示出Co₃O₄ /ZnO纳米复合物中存在大量的Zn空位和空位团. 这些空位缺陷可能存在于纳米复合物的界面区域. 当退火温度达到700 ℃后Zn空位开始恢复,空位团也开始收缩. 900 ℃以上退火后,所有空位缺陷基本消失,正电子寿命接近ZnO完整晶格中的体态寿命值. 符合多普勒展宽谱测量也显示Co₃O₄ /ZnO纳米复合物经过900 ℃以上退火后电子动量分布与单晶ZnO基本一致,表明界面缺陷经过退火后得到消除. 关键词： ZnO 界面缺陷 正电子湮没     

影响纳米Cu固体材料性能的工艺参数研究

 采用正交试验方法，通过XRD，MHV2000型显微硬度计（数显）和基于浮力原理等测试手段研究了压制压力、保压时间、退火温度和退火时间对自悬浮定向流－冷压法制备纳米Cu固体材料性能（晶粒大小、密度及显微硬度）的影响。结果表明：对晶粒度而言，退火温度是显著性影响因素，同时表明纳米Cu固体具有较好的热稳定性；对密度而言，压制压力是显著性影响因素；对显微硬度而言，退火时间是显著性影响因素。     

He离子注入ZnO中缺陷形成的慢正电子束研究

在ZnO单晶样品中注入了能量为20—100keV、总剂量为4.4×10¹⁵cm^-2的He离子.利用基于慢正电子束的多普勒展宽测量研究了离子注入产生的缺陷.结果表明，He离子注入ZnO产生了双空位或更大的空位团.在400℃以下退火后，He开始填充到这些空位团里面，造成空位团的有效体积减少.经过400℃以上升温退火后，这些空位团的尺寸开始增大，但由于有少量的He仍然占据在空位团内，因此直到800℃这些空位团仍保持稳定.高于800℃退火后，由于He的脱附，留下的空位团 关键词： 慢正电子束 ZnO 离子注入 缺陷     

退火对ZnO:Al薄膜光致发光性能的影响

 采用溶胶-凝胶工艺在石英衬底上制备ZnO:Al（AZO）薄膜，通过不同温度的退火处理，研究了退火对AZO薄膜结构和光致发光特性的影响。XRD图谱表明：所制备的薄膜具有c轴高度择优取向，随着退火温度的升高，(002)峰的强度逐渐增强，同时(002)峰的半高宽逐渐减小,表明晶粒在不断增大。未退火样品的光致发光（PL）谱由361 nm附近的紫外带边发射峰和500 nm附近的深能级发射峰组成。样品经退火后，以500 nm为中心的绿带发射逐渐减弱，而带边发射强度有所增强,并且逐渐红移到366 nm附近，与吸收边移动的测试结果相吻合。对经过不同时间退火的样品分析表明，AZO薄膜的发光特性与退火时间也有很大关系，时间过短可见波段的发射较强，但时间过长会使晶粒发生团聚，导致紫外发射峰强度减弱。     

退火温度对Cu:ZnO薄膜绿光发射的影响

利用溶胶-凝胶法在Si衬底上制备了不同退火温度的Cu:ZnO薄膜.利用X射线衍射(XRD)、X射线光电子能谱(XPS)、扫描电子显微镜和光致发光谱研究了样品的晶格结构、表面形貌、成分及其发光特性.结果表明:所有样品均具有高度的c轴择优取向,随着退火温度的升高,样品的结晶质量变好,样品的表面都被晶粒覆盖,强而稳定的绿光发射被观察到.绿光强度随退火温度的升高先增加后减小,发光中心位置不随退火温度的变化而改变,这样的绿光发射强而稳定.XRD和XPS结果表明,随退火温度的升高Cu2+还原为Cu+,导致Cu:ZnO薄膜形成的缺陷是VZn,所以绿光发射是由VZn引起的.Cu2+还原为Cu+时,Cu:ZnO薄膜中VZn浓度增加,使绿光发射强度增大.当退火温度超过800?C时,Cu2+的还原能力变差,绿光发射强度减弱.     

退火温度及退火气氛对ZnO薄膜的结构及发光性能的影响(英文)

采用脉冲激光沉积技术在Si/蓝宝石衬底上制备了ZnO薄膜,结合快速退火设备研究了不同退火温度(500~900℃)及退火气氛(N2,O2)对薄膜的结构及其发光性能的影响。并优化条件得到具有最小半峰全宽及最大晶粒尺寸的薄膜。X射线衍射(XRD)结果表明:氮气氛下退火的ZnO薄膜最佳退火温度为900℃;氧气氛下退火的ZnO薄膜最佳退火温度为800℃。红外(IR)光谱中,退火后Zn-O特征振动峰红移,说明在退火过程中,原子重新排布后占据较低能量位置;同样的退火温度下,氮气氛下退火的薄膜质量更优。同步辐射光电子能谱(synchrotron-based XPS)分别表征了未退火及N2,O2下900℃退火的ZnO薄膜,分峰拟合结果表明氧气氛下退火产生更多的氧空位。结构表征结合光致发光(PL)谱表明绿光的发光峰与氧空位有关。     

Influence of Annealing Treatment on Structural,Optical, Electric,and Thermoelectric Properties of MBE-Grown ZnO

In this paper, we have reported the influence of annealing treatment on structural, optical, electrical, and thermoelectric properties of MBE-grown ZnO on Si substrate. After growth, a set of as grown ZnO was annealed in oxygen environment at 500–800°C and another set was annealed in different environments (vacuum, oxygen, zinc, and vacuum + zinc) at 600°C for one hour in a programmable furnace. X-ray diffraction (XRD) results demonstrated that all annealed samples exhibited a major diffraction peak related to (002) plane. The full width at half maximum (FWHM) of this plane decreased and crystalline size increased for oxygen annealed sample and it increased when samples were annealed in zinc, vacuum, and successively annealed in vacuum and zinc. Further, photoluminescence spectrum revealed that the intensity of band edge emission increased and defect emission decreased as annealing temperature (oxygen environment) increased while it decreased for rest of annealing ambient. It is suspected that annealing in oxygen environment causes compensation of the oxygen vacancies by the incoming oxygen flux, while annealing in zinc and vacuum generates more oxygen vacancies. Hall and Seebeck measurements are also consistent with these arguments.     

Effect of annealing on properties of electrochemically deposited CdTe thin films

Thin films of CdTe have been deposited onto stainless steel and fluorine-doped tin oxide (FTO)-coated glass substrates from aqueous acidic bath using electrodeposition technique. The different preparative parameters, such as deposition time, bath temperature and pH of the bath have been optimized by photoelectrochemical (PEC) technique to get good quality photosensitive material. The deposited films are annealed at different temperature in presence of air. Annealing temperature is also optimized by PEC technique. The film annealed at 200 °C showed maximum photosensitivity. Different techniques have been used to characterize as deposited and also as annealed (at 200 °C) CdTe thin film. The X-ray diffraction (XRD) analysis showed the polycrystalline nature, and a significant increase in the XRD peak intensities is observed for the CdTe films after annealing. Optical absorption shows the presence of direct transition with band gap energy 1.64 eV and after annealing it decreases to 1.50 eV. Energy dispersive analysis by X-ray (EDAX) study for the as-deposited and annealed films showed nearly stoichiometric compound formation. Scanning electron microscopy (SEM) reveals that spherically shaped grains are more uniformly distributed over the surface of the substrate for the CdTe film.     

Tensile behavior of post-irradiation annealed Cu–Ni alloy

The present paper investigates the tensile properties of post-irradiation annealed Cu–Ni alloy. The specimens were irradiated with a 15 MeV electron beam at room temperature and the post-irradiation annealing (PIA) of the specimens was carried out under vacuum at 450 °C for 15–120 min. The yield stress (YS), ultimate tensile stress (UTS), percentage elongation, stress relaxation rate and activation volume of both as-irradiated and post-irradiation annealed specimens were examined at room temperature using a universal testing machine. The results show that PIA of the specimen at 450 °C for 15 min decreases its YS and UTS, whereas the percentage elongation is increased. The changes in the tensile parameters become more pronounced with increases in annealing time. Effects of PIA on the stress relaxation rate and activation volume indicate that the relaxation rate of post-irradiation annealed specimens increases, and the activation volume decreases, with an increase in annealing time.     

Surface modification of CIGS film by annealing and its effect on the band structure and photovoltaic properties of CIGS solar cells

The composition of Cu(In,Ga)Se₂ (CIGS) films employed in CIGS solar cells is Cu deficient. There can be point defects, including Cu vacancies, Se vacancies, and metal anti-site defects. The surface composition and defects are not well controlled right after CIGS film fabrication with a three-stage co-evaporation process. This fabrication technique can result in a large variation in cell efficiency. In order to control the CIGS film in a reproducible way, we annealed the CIGS film in air, S, or Se. With this annealing procedure, the Cu content of the CIGS surface was significantly reduced and Ga content was strongly increased. An intrinsic CIGS layer with a lower valence-band maximum and a wider ban gap was formed at the surface. By annealing the CIGS film, the open-circuit voltage and fill factor were significantly improved, which indicates that the surface intrinsic layer acts as a hole-blocking layer so that the surface recombination rate is suppressed. In addition to CIGS film annealing, with subsequent annealing of the completed devices using rapid thermal annealing, the efficiency and reproducibility of CIGS solar cells were markedly improved.     

热处理对MgO基片的表面形貌以及对CeO_2和Tl-2212薄膜生长的影响

研究了MgO基片在高温退火时表面形貌和表面结构的变化,以及它对CeO2缓冲层和Tl-2212超导薄膜生长的影响。原子力显微镜(AFM)研究表明,在流动氧环境中1100℃温度下退火,MgO的表面首先由未退火时的皱褶形貌,演化为光滑表面,随着退火时间的延长,表面形貌最终演化为具有光滑基底的独立生长峰结构。XRD测试表明,通过高温热处理可以大幅度提高MgO基片表面结晶的完整性。在1100℃温度下热处理8小时的MgO基片上可以生长出具有高度c轴取向的CeO2(001)缓冲层。然后在此缓冲层上制备了厚度为500nm的外延Tl-2212超导薄膜,其临界转变温度(Tc)达到108.6K,液氮温度下临界电流密度(Jc)为2.8mA/cm2,微波表面电阻Rs(77K,10GHz)约为360.9μΩ。     

The phase transition in annealed mechanically alloyed Fe - Cu

Using M?ssbauer spectra and x-ray diffraction patterns, annealed mechanically alloyed Fe - Cu has been investigated in this paper. It is found that in [Formula: see text], after it has been milled, fcc-Cu has transformed into bcc-Cu, and some Cu atoms have diffused into the Fe. After the alloy has subsequently been annealed, it is found that bcc-Cu has transformed back into fcc-Cu, while the Cu atoms in the Fe have been separated. In [Formula: see text], after being milled, an fcc-Fe-rich phase has been formed, and after the alloy has subsequently been annealed, this has transformed back to bcc-Fe. The shorter the milling time and the higher the annealing temperature, the faster the transformation. In [Formula: see text], after it has been annealed, the fcc-Fe-rich phase has transformed to bcc-Fe also, and the fcc-Cu-rich phase remains when the annealing temperature increases. All of these results show that the fcc-Fe-rich phase in the milled samples is a metastable phase - it will transform to stable bcc-Fe when it is annealed - while the long-milling-product fcc-Cu-rich phase is a stable phase.     

银和铜膜中异常晶粒生长和织构变化的实验研究

用透射电子显微镜(TEM)和x射线衍射(XRD)方法对经300℃，2h退火的Ag和Cu自由膜和Si基体上的Ag和Cu附着膜的异常晶粒生长和织构变化进行了实验研究.XRD分析表明：Ag和Cu沉积膜均有(111)和(100)择优取向.但经退火处理后，Ag和Cu自由膜的(111)织构稍有加强.相反，Si基体上的Ag和Cu附着膜的(100)和(110)织构明显加强，同时用TEM在Cu附着膜中观察到了两个(110)和四个(211)取向的异常大晶粒.根据表面能和应变能的各向异性对实验结果进行了分析.