Rapid thermal annealing effects on the structural and optical properties of ZnO films deposited on Si substrates

The structural and optical properties of ZnO films deposited on Si substrate following rapid thermal annealing (RTA) have been investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), and photoluminescence (PL) measurements. After RTA treatment, the XRD spectra have shown an effective relaxation of the residual compressive stress, an increase of the intensity and narrowing of the full-width at half-maximum (FWHM) of the (0 0 2) diffraction peak of the as-grown ZnO film. AFM images show roughening of the film surface due to increase of grain size after RTA. The PL spectrum reveals a significant improvement in the UV luminescence of ZnO films following RTA at 800 °C for 1 min.     

Optical properties of GaInNAs/GaAs prepared by molecular beam epitaxy

Optical properties of GaInNAs are studied with emphasis on photoluminescence (PL) and photoreflectance (PR) using GaInNAs single quantum wells (GaInNAs-SQW) and thick GaInNAs layers lattice-matched to GaAs (LM-GaInNAs) grown by solid-source molecular-beam epitaxy. First, a blue-shift of band-gap energy as a result of a rapid thermal annealing (RTA) has been confirmed by both PL and PR. Temperature-dependent PL and PR spectra were measured. At low temperature, GaInNAs-SQWs exhibited a PL due to the localized exciton (LE), and the localization was strongly reduced by RTA. A very high-quality GaInNAs-SQW exhibited very intense PL with small half-width (10–20 meV for 8–300 K) without LE emission. In LM-GaInNAs, low-temperature PL exhibited both the LE emission and a deep PL band. Temperature-dependent PL showed that LM-GaInNAs contains large number of non-radiative centers. PR spectra of LM-GaInNAs were composed of more than two transitions, and their relative intensity depended on temperature and annealing.     

Effect of GaAs(1 0 0) 2° surface misorientation on the formation and optical properties of MOCVD grown InAs quantum dots

The influence of GaAs(1 0 0) 2° substrate misorientation on the formation and optical properties of InAs quantum dots (QDs) has been studied in compare with dots on exact GaAs(1 0 0) substrates. It is shown that, while QDs on exact substrates have only one dominant size, dots on misoriented substrates are formed in lines with a clear bimodal size distribution. Room temperature photoluminescence measurements show that QDs on misoriented substrates have narrower FWHM, longer emission wavelength and much larger PL intensity relative to those of dots on exact substrates. However, our rapid thermal annealing (RTA) experiments indicate that annealing shows a stronger effect on dots with misoriented substrates by greatly accelerating the degradation of material quality.     

Residual defects in high-energy B-, P- and As-implanted Si by rapid thermal annealing

The annealing behavior of secondary defects generated in 2 MeV B- and P-, and 1 MeV As-implanted (100) Si with a dose of 5×10¹⁴ ions/cm² has been investigated after rapid thermal annealing (RTA) treatment using cross-sectional TEM observations. The results are compared with ones obtained by furnace annealing (FA) treatment. RTA is more effective than FA for the defect density reduction of deep defects existing beyond 2 m depths from the surface in B- and P-implanted layers. However, when a dislocation loop diameter is close to the substrate surface, as in the case of As implantation, the loops climb up to the surface by 1250 °C RTA. Moreover, repeated RTA is effective for the suppression of secondary defect growth in B- and P-implanted layers, while there is no difference in defect density or configuration for As implantation between repeated and simple RTA.     

Cu(In,Ga)Se2太阳能电池快速热退火效应

利用光致发光（PL）分析快速热退火对Cu(In,Ga)Se2 (CIGS)电池的影响,研究退火对薄膜缺陷的影响。Cu(In,Ga)Se2电池的PL谱中总共有 7个峰,即2个可见波段峰和5个红外波段峰。退火温度较低,可减少薄膜体内缺陷,提高载流子浓度,改善薄膜质量;退火温度过高,则会引起正常格点处元素扩散,元素化学计量比改变,体内缺陷增加,吸收层带隙降低,反而会对CIGS薄膜造成破坏。     

The effect of annealing under hydrostatic pressure on the visible photoluminescence from si-ion implanted SiO2 films

We have studied the influence of the hydrostatic pressure during annealing on the intensity of the visible photoluminescence (PL) from thermally grown SiO₂ films irradiated with Si⁺ ions. Post-implantation anneals have been carried out in an Ar ambient at temperatures T_a of 400°C and 450°C for 10 h and 1130°C for 5 h at hydrostatic pressures of 1 bar–15 kbar. It has been found that the intensity of the 360, 460 and 600 nm PL peaks increases with rising hydrostatic pressure during low-temperature annealing. The intensity of the short-wavelength PL under conditions of hydrostatic pressure continues to rise even at T_a=1130°C. Increasing T_a leads to a shift in the PL spectra towards the ultraviolet range. The results obtained have been interpreted in terms of enhanced, pressure-mediated formation of ≡Si–Si≡ centres and small Si clusters within metastable regions of the ion-implanted SiO₂.     

Thermal stability of CdZnO thin films grown by molecular-beam epitaxy

CdZnO thin films with near-band-edge (NBE) photoluminescence (PL) emission from 2.39 eV to 2.74 eV were grown by plasma-assisted molecular-beam epitaxy on c-plane sapphire substrates with 800 °C in situ annealing. CdZnO thin films evolve from pure wurtzite (wz) structure, to mixture of wz and rock-salt (rs) structures confirmed by X-ray diffraction studies. Rapid-thermo-annealing (RTA) was performed on in situ annealed CdZnO samples. Pure wz CdZnO shows insignificant NBE PL peak shift after RTA, while mixture structure CdZnO shows evident blue shifts due to phase change after annealing, indicating the rs phase CdZnO changes to wz phase CdZnO during RTA process.     

Amorphous Si/insulator multilayers grown by vacuum deposition and electron cyclotron resonance plasma treatment

a-Si/insulator multilayers have been deposited on (0 0 1) Si by electron gun Si evaporation and periodic electron cyclotron resonance plasma oxidation or nitridation. Exposure to an O or N plasma resulted in the formation of a thin SiO₂ and SiN_x layer whose thickness was self-limited and controlled by process parameters. For thin-layer (2 nm) Si/SiO₂ and Si/SiN_x multilayers no visible photoluminescence (PL) was observed in most samples, although all exhibited weak “blue” PL. For the nitride multilayers, annealing at 750°C or 850°C induced visible PL that varied in peak energy with Si layer thickness. Depth profiling of a-Si caps on thin insulating layers revealed no detectable contamination for the SiN_x layers, but substantial O contamination for the SiO₂ films.     

Structural and optical properties of Si/SiO2 multi-quantum wells

Structural and optical properties of Si/SiO₂ multi-quantum wells (MQW) were investigated by means of Raman scattering and photoluminescence (PL) spectroscopy. The MQW structures were fabricated on a quartz substrate by remote plasma enhanced chemical vapour deposition (RPECVD) of alternating amorphous Si and SiO₂ layers. After layer deposition the samples were subjected to heat treatments, i.e. rapid thermal annealing (RTA) and furnace annealing. Distinct PL signatures of confined carriers evidenced formation of Si-nanocrystals (nc-Si) in annealed samples. Analyses of Raman spectra also show presence of nc-Si phase along with amorphous-Si (a-Si) phase in the samples. The strong influence of the annealing parameters on the formation of nc-Si phase suggests broad possibilities in engineering MQW with various optical properties. Interestingly, conversion of the a-Si phase to the nc-Si phase saturates after certain time of furnace annealing. On the other hand, thinner Si layers showed a disproportionately lower crystalline volume fraction. From the obtained results we could assume that an interface strain prevents full crystallization of the Si layers and that the strain is larger for thinner Si layers. The anomalous dependence of nc-Si Raman scattering peak position on deposited layer thickness observed in our experiments also supports the above assumption.     

Growth of metallic nanowires on anisotropic Si substrates: Pb on vicinal Si(0 0 1), Si(7 5 5), Si(5 3 3), and Si(1 1 0)

The spontaneous formation of mesoscopic Pb-wires, on 4° off-cut Si(0 0 1) vicinal surface, Si(7 5 5), Si(5 3 3), and Si(1 1 0) substrates was studied by low-energy electron microscopy. Before the deposition of Pb the substrates were modified by predeposition of a submonolayer amount of Au followed by annealing. The Au-induced reconstruction creates quasi-one-dimensional facets and superstructures. Their width ranged from several hundred nm in the case of the vicinal Si(0 0 1) down to atomic scale size, for the Si(1 1 0) surface. The best-developed arrays of parallel aligned mesoscopic wires were obtained during the deposition of Pb on substrates cooled slightly below room temperature. Wires with length to width ratio reaching 130 were produced on the Si(7 5 5) and the Si(5 3 3) substrates. The width of these nanowires was uniform over the whole substrate and was about 60 nm. The driving forces for the formation of the mesoscopic wires are the anisotropic strain due to the large misfit between the Pb and the Si lattice and one-dimensional diffusion of Pb.     

Improvement of photoluminescence mechanism of CTA-treated Si-implanted SiO2 films by using RTA

In this paper, a shift in the photoluminescence (PL) peak from blue to near-infrared region was observed in the Si⁺-implanted 400-nm-thick SiO₂ films with the rapid thermal annealing (RTA) method only. As the Si⁺-fluence was 1×10¹⁶ ions/cm², a blue band was observed in the films after RTA at 1050 °C for 5 s in dry-N₂ atmosphere; then, the band shifted from blue to orange upon increasing the holding temperature of RTA to 1250 °C in the films after the isochronal RTA in dry N₂. Furthermore, while the fluence was increased to 3×110¹⁶ ions/cm² and the holding temperature was at the same range between 1050 and 1250 °C, the PL peak occurred between red and near-infrared regions. Although the RTA and conventional thermal annealing (CTA) methods produce a similar mechanism, the CTA method needs a much longer annealing-time and a higher Si⁺-implanted dose than the RTA method for producing the same shift and intensity of PL peak from the as-implanted sample. Therefore, the RTA method can produce the mechanism in the Si⁺-implanted sample with the PL energy between blue and near-infrared band in place of the CTA method.     

Activation of Mg-doped P-GaN by using two-step annealing

One- and two-step rapid thermal annealing (RTA) for activating Mg-doped p-type GaN films had been performed to compare with conventional furnace annealing (CFA). The two-step annealing process consists of two annealing steps: the first step is performed at 750 °C for 1 min and the second step is performed at 600 °C for 5 min in pure O₂ or air ambient. It is found that the samples annealed in air ambient exhibit poor electrical properties as compared to those annealed in pure O₂. Compared to one-step RTA annealing and CFA annealing, the samples with two-step annealing exhibit higher hole concentration and lower resistivity. This means that the two-step annealing is a powerful method to enhance the electrical performance of Mg-doped p-type GaN films. Similar results were also evidenced by photoluminescence (PL) measurement. Possible mechanism was confirmed by secondary ion mass spectrometry analysis.     

退火对a-SixC1-x:H薄膜带尾态的影响

本文研究了退火后的a-Si_xC_1-x:H薄膜的光致发光光谱,采用发光光谱的峰值能量与测量温度之间的关系判别带尾宽度的大小。实验表明,发光峰值能量随退火温度的升高而移向低能。用指数带尾模型计算了带尾宽度。结果表明,随着退火温度的上升带尾变小。文中对这些结果进行了讨论。 关键词：     

Annealing effect on the optical properties in Si delta-doped Al0.24Ga0.76As/In0.15Ga0.85As/GaAs pseudomorphic high electron mobility transistor structures

The optical properties of Si delta-doped Al_0.24Ga_0.76As/In_0.15Ga_0.85As/GaAs pseudomorphic high electron mobility transistor structure (PHEMTs) are estimated after the process of rapid thermal annealing (RTA) in the temperature range 500–750°C. After layer intermixing and decrease of 2DEG densities of PHEMTs just occurs around the annealing temperature of 650°C, the 12H transition peak at 1.354 eV above the annealing temperature of 650°C is newly observed from the photoluminescence (PL) and photoreflectance (PR) spectra. From the results of PL and PR measurements in the annealed PHEMTs, it is found that remarkable modification of band profile in InGaAs QW occur at annealing temperature above 650°C.     

氮等离子体辅助脉冲激光沉积生长p型ZnO:N薄膜的光学和电学性质

通过氮气等离子体辅助脉冲激光沉积(PLD)技术制备了氮掺杂氧化锌(ZnO:N)薄膜.经过低温快速热退火(RTA)处理后,ZnO:N薄膜呈现p型导电特性.利用X射线光电子能谱(XPS)、光致发光(PL)和霍尔测量对ZnO:N薄膜中N的化学状态及其光学和电学性质进行了系列的研究.结果表明:所制得的p型ZnO:N薄膜为高度补...     

The effect of thickness and annealing condition on the microstructure and magnetic properties of Fe/Pt multilayer thin films

[Fe(0.5 nm)/Pt(0.5 nm)]₄₀, [Fe(1 nm)/Pt(1.5 nm)]₂₀ and [Fe(3 nm)/Pt(3 nm)]₁₀ multilayer were prepared by DC magnetron sputtering. By conventional furnace annealing (CA) at 270–600 °C for various time, all of the films still remained the disordered structure with the soft magnetic phase. By rapid thermal annealing (RTA) at 500 °C for various time, we obtained the [Fe(1 nm)/Pt(1.5 nm)]₂₀ and [Fe(3 nm)/Pt(3 nm)]₁₀ films with L1₂ ordered FePt₃ phase which was almost ferromagnetic at room temperature. However, the [Fe(0.5 nm)/Pt(0.5 nm)]₄₀ films was still disordered state even under RTA. Compared with CA, RTA exposed an outstanding effect on accelerating the phase transition when the film thickness is over [Fe(0.5 nm)/Pt(0.5 nm)]₄₀.     

XPS and RBS investigations of Si–Er–O interactions on a Si(1 0 0)-2x1 surface

The interactions among erbium, oxygen and silicon atoms on a Si(1 0 0)-2x1 reconstructed surface have been studied by means of X-ray photoelectron spectroscopy and Rutherford backscattering spectrometry. Erbium and oxygen were deposited at 600 °C on the Si surface and their behavior has been observed after different thermal processes. It was found that at 600 °C, the formation of a stable surface complex Er–O–Si is obtained together with Si oxidation; after an 800 °C annealing, the amount of oxygen bound to Si decreases and the remaining O atoms are mainly bonded to Er. An abrupt change was observed after 900 and 1000 °C annealings, which bury the Er atoms about 60 Å below the substrate surface. Our results give some hints to hypotise the O diffusion towards the Si bulk.     

Formation of high quality gallium nitride thin films on Ga-diffused Si(1 1 1) substrate

High quality gallium nitride thin films have been successfully grown on the Ga-diffused Si(1 1 1) substrates through ammoniating Ga₂O₃ thin films deposited by r.f. magnetron sputtering. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM), atomic force microscope (AFM) and photoluminescence (PL) were used to characterize the synthesized samples. The analyses reveal that the formed films are high quality polycrystalline hexagonal gallium nitride. The as-formed GaN films show a flat surface topography with RMS roughness varied from 29 to 48 Å. The strong near-band-edge-emission peak around 368 nm was observed at room temperature. This is a novel method to fabricate GaN thin films based on the direct reaction between Ga₂O₃ and NH₃ on the Ga-diffused Si(1 1 1) substrates.     

Thermal stability of atomic-layer-deposited ultra-thin niobium oxide film on Si (1 0 0)

Ultra-thin Nb₂O₅ films with excellent uniformity have been grown on Si (1 0 0) by atomic-layer-deposition using Nb(OC₂H₅)₅ and H₂O precursors, and the corresponding thermal stability has been studied through atomic force microscope, transmission electron microscope and X-ray photoelectron spectroscopy. The results indicate that the ultra-thin (∼3 nm) Nb₂O₅ film is gradually built up into distributed large islands with increasing rapid thermal annealing (RTA) temperature. Meanwhile, both crystalline and amorphous phases are formed in the matrix of Nb₂O₅ annealed at 700 °C. In terms of the as-prepared sample, an interfacial layer (IL) with a thickness of around 1.5 nm is observed, that is composed of niobium silicate (Nb-O-Si). Further, the high temperature RTA leads to a thickened IL, which is attributed to the formation of more Nb-O-Si bonds and new silicon oxide (Si-O-Si) adjacent to the Si (1 0 0).     

INFRARED EMISSION FROM Si IMPLANTED WITH HIGH Er CONCENTRATION

Erbium-doped silicon has been fabricated by ion implantation performed on a metal vapour vacuum arc ion source. After rapid thermal annealing (RTA), 1.54μm photoluminescence was observed at 77K. Rutherford backscattering spectrum indicated that Er ions are mainly distributed near the surface of the samples, and Er concentration exceeded 10²¹cm^-3. Needle nanometre crystalline silicon (nc-Si) was formed on the substrate surface. Band edge emission spectrum at 10K verified that the minority carrier lifetime increased upon RTA. The photocarrier mediated processes enabled energy transferring from nc-Si (or c-Si) to the Er³⁺ ions and resulted in light emission of 1.54μm.