Imidazole‐type thermal latent curing agents with high miscibility for one‐component epoxy thermosetting resins

Epoxy resins are important thermosetting resins widely employed in industrial fields. Although the epoxy–imidazole curing system has attracted attention because of its reactivity, solidification of a liquid epoxy resin containing imidazoles proceeds gradually even at room temperature. This makes it difficult to use them for one‐component epoxy resin materials. Though powder‐type latent curing agents have been used for one‐component epoxy resin materials, they are difficult to apply for fabrication of fine industrial products due to their poor miscibility. To overcome this situation and to improve the shelf life of epoxy–imidazole compositions, we have developed a liquid‐type thermal latent curing agent 1 , generating an imidazole with a thermal trigger via a retro‐Michael addition reaction. The latent curing agent 1 has superior miscibility toward epoxy resins; in addition, it was confirmed that the epoxy resin composition has both high reactivity at 150 °C, and long‐term storage stability at room temperature. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2680–2688     

Thermal and water absorption properties of cyanate ester resins modified by fluoride‐containing and silicone‐containing components

In order to enhance the moisture resistance of cyanate ester resins, modifiers containing silicon or fluorine moieties were introduced. The curing behaviors of the obtained resins, as well as thermal, water absorption, and dielectric properties of all cured polymers, were investigated in detail. Results show that properties of fillers in polymer have great influence on the thermal property and of polymer. In all cases, modifier exhibited percolation threshold at 5 wt%. Compared with pristine cyanate ester resins (CE), when the methyl phenyl silicone resin B filler was added, the cured polymer exhibited water absorption as low as 0.39% and excellent thermal oxygen stability at 300°C. The introduction of silicon H improved thermal oxidative stability at 400°C without significant compromise in processability or mechanical properties.     

Performance of methylphenyl hydrogen-containing silicone oils for LED encapsulation

Three-dimensional light-emitting diodes (LEDs) are the preferred light source for bulb lamps due to their 360° illumination. Addition curing silicone resins have usually been used to encapsulate LEDs. LED-filament encapsulation needs silicone resins having high thermal performance and thixotropy. Herein, a low refractive index and highly anti-thermal aging silicone oil was synthesized by hydrolysis and co-condensation method, and used to prepare an encapsulation material for high-power LED-filament. The cured silicone materials were characterized by thermogravimetric analysis (TGA) and thermal aging test under 180°C and 250°C. The results demonstrated that the thermal stability of the cured silicone resins with short-chain phenyl silicone as a crosslinker was higher than that with long-chain methyl silicone oil crosslinker. Owing to the excellent thermal stability, appropriate hardness, high transparency and photoelectric efficiency, this LED encapsulation material is a promising candidate for high-power LED package.     

基于甲基三苯乙炔基硅烷的新型聚三唑树脂的制备与性能

首先采用格氏试剂法合成了甲基三苯乙炔基硅烷(MTPES),通过傅里叶变换红外光谱(FT-IR)、核磁共振氢谱(1 H-NMR)对其结构进行了表征。然后以MTPES和4,4’-二叠氮甲基联苯(BAMBP)为原料制备了新型聚三唑树脂(MPTA)。利用FT-IR和差示扫描量热(DSC)研究了MPTA树脂的固化行为,通过动态力学热分析(DMA)和热重分析(TG)研究了炔基与叠氮基配比对树脂热性能的影响,并通过测试凝胶时间随贮存时间的变化研究了树脂及其四氢呋喃(THF)溶液的贮存稳定性。结果表明,固化后的树脂玻璃化转变温度(Tg)达到236℃,在氮气中的5%热失重温度(T_(d5))在320℃左右。MPTA树脂在35℃和25℃下分别贮存7d和20d后,100℃下树脂的凝胶时间分别为40min和25min,MPTA树脂的THF溶液在同样条件下贮存28d后,凝胶时间分别为54min和61min,具有比现有聚三唑树脂更好的贮存稳定性。单向T700碳纤维-MPTA复合材料常温下的弯曲强度为1 660 MPa,弯曲模量为129 GPa,150℃下的弯曲强度保留率为70%。     

含磷有机硅杂化环氧树脂固化体系性能研究

通过磷酸与γ-环氧丙氧基三甲氧基硅烷反应得到含磷有机硅氧烷,并加入到环氧树脂/4,4'-二氨基二苯基甲烷体系中混合,通过溶胶-凝胶的方法制备了含磷有机硅杂化环氧树脂固化物.对固化体系进行了玻璃化转变温度、热失重、阻燃、拉伸强度、冲击强度测试分析.结果表明,该固化体系的阻燃性得到提高,极限氧指数在25.8～29.3,玻璃化转变温度得到提高,在161～179℃;虽然初始分解温度比纯环氧树脂固化物低,但800℃残炭率可以达到26.5%,提高了36%;拉伸强度得到提高,在71～94 MPa,冲击强度可以达到14.36 kJ/m2,提高了14%.该固化体系具有较好的阻燃性能和热性能,同时具有较好的力学性能.     

Phthalonitrile Resins Derived from Vanillin: Synthesis,Curing Behavior,and Thermal Properties

Vanillin was used as sustainable source for phthalonitrile monomer synthesis, and allyl/propargyl ether moieties were introduced to improve the processability at the minimal cost of thermal properties. The synthesis route was optimized to minimize side-reactions and simplify post-processing, and the monomers were obtained in high purity and good yields. The curing behavior, mechanism, and processability of the monomers were studied, and the thermal properties of cured polymers were evaluated. Of the two monomers, the allyl ether-containing one exhibited a wide processing window of 185 °C, and was mainly cured into phthalocyanine and linear aliphatic structures through self-catalytic curing process. Also, the glass transition temperature was higher than 500 °C. In contrast, the propargyl ether-containing monomer could only be partially cured, and heat resistance was found to be compromised. Compared with traditional petroleum-based phthalonitrile resins, the biobased monomers could be cured without the addition of catalysts, and improvement in processability was achieved at no cost of thermal performances.     

Synthesis and thermal decomposition of a novel hyperbranched polyphosphate ester used for flame retardant systems

A novel hyperbranched polyphosphate ester (HPPE) was synthesized via the polycondensation of bisphenol-A as an A₂ monomer and phosphoryl trichloride as a B₃ monomer at 100 °C, without gelation. The initial molar ratio of A₂ to B₃ was set to be 1.5:1. The final product was precipitated from methanol. ³¹P NMR spectroscopy was used to monitor the reaction. The formed HPPE was characterized by FTIR and ¹H NMR to confirm its end groups. Differential scanning calorimetry data revealed that the cured bisphenol-A epoxy resin with HPPE as a curing agent possessed improved glass transition temperature. Dynamic mechanical thermal analysis also showed the increase in the glass transition temperature. The thermal degradation properties and flame retardancy were investigated by thermogravimetric analysis and limiting oxygen index (LOI). The results showed that the incorporation of HPPE into bisphenol-A epoxy resin increased its thermal stability and char yield during the decomposition by raising the second stage decomposition temperature. The LOI value increased from 23 to 31 when HPPE, instead of bisphenol-A, was used as a curing agent.     

A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package

In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature(40 °C/2 h then 60 °C/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.     

Synthesis,structure, and characterization of nematic liquid‐crystalline thermosets based on bisacrylates

Four bisacrylate mesogenic monomers and the corresponding liquid‐crystalline thermosets were synthesized. The chemical structures of the intermediate compounds and monomers obtained were confirmed by elemental analyses, Fourier transform infrared, and ¹H NMR and ¹³C NMR spectra. The mesomorphic properties and thermal stability were investigated with differential scanning calorimetry, thermogravimetric analysis, polarized optical microscopy, and X‐ray diffraction measurements. The influence of the curing temperatures and time on the phase behavior and thermal stability of the thermosets was discussed. All the monomers and thermosets exhibited a nematic schlieren texture. However, the monomers only showed the melting transition, and the thermosets displayed the glass transition. The experimental results demonstrated that the monomer structures strongly affected the phase behavior and the curing reaction rate, and the glass‐transition temperatures and thermal stability of the thermosets increased with the curing temperature and time. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 4478–4485, 2005     

Bismaleimides chain-extended by imidized benzophenone tetracarboxylic dianhydride and their polymerization to high temperature matrix resins

Heat-resistant polymers were obtained by thermal polymerization of several bismaleimides or their substituted derivatives. The chain of the polymer precursors was extended by incorporation of imidized benzophenone tetracarboxylic dianhydride between the maleimide rings in order to impart a degree of flexibility in the polymers. The bismaleimides and their corresponding tetraamic acids were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. The differential thermal analysis (DTA) thermograms of the monomers showed exotherms at 200–340°C attributed to the thermally induced polymerization reactions. The influence of different substituents in the maleic double bond on the curing temperature was investigated. The thermal stability of the cured resins was evaluated by thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). They were stable up to 367–433°C both in nitrogen and air atmosphere and afforded 57–68% char yield at 800°C under anaerobic conditions. The structure of the aromatic and aliphatic diamines utilized for imidization was correlated with the thermal stability of the cured resins. The bismaleimide derived from p-phenylenediamine gave the most heat-resistant resin because of its higher rigidity.     

Preparation, thermal properties and flame retardancy of phosphorus- and silicon-containing epoxy resins

Phosphorus- and silicon-containing epoxy resins were prepared from (2,5-dihydroxyphenyl)diphenyl phosphine oxide (Gly-HPO), diglycidyloxy methylphenyl silane (DGMPS) and 1,4-bis(glycidyloxydimethyl silyl)-benzene (BGDMSB) as epoxy monomers and diaminodiphenylmethane (DDM), bis(3-aminophenyl)methyl phosphine oxide (BAMPO) and bis(4-aminophenoxy)dimethyl silane (APDS) as curing agents. Epoxy resins with different phosphorus and silicon content were obtained. Their thermal, dynamic mechanical and flame retardant properties were evaluated. The high LOI values confirmed that epoxy resins containing hetero-atoms are effective flame retardants, but a synergistic efficiency of phosphorus and silicon on flame retardation was not observed.     

有机硅改性磺酸型聚氨酯/丙烯酸酯复合乳液的制备

将磺酸型聚酯多元醇、异佛尔酮二异氰酸酯（IPDI)和三羟甲基丙烷(TMP)在无有机溶剂参与的情况下进行预缩聚,以硅烷偶联剂γ-氨丙基三乙氧基硅烷（KH550）作为改性剂,加入双官能团单体甲基丙烯酸-β-羟乙酯(HEMA),得到含乙烯基和有机硅封端的聚氨酯作为种子乳液,然后与甲基丙烯酸甲酯(MMA)、丙烯酸丁酯(BA)混合单体共聚,合成了有机硅改性磺酸型聚氨酯/丙烯酸酯复合乳液。 红外光谱的表征确定了有机硅改性磺酸型聚氨酯/丙烯酸酯复合乳液的化学结构;透射电子显微镜观察证实了此复合乳液具有明显的核壳结构;热重分析表明,经有机硅和丙烯酸酯改性后,胶膜的最大热失重温度提高了20 ℃,X射线衍射分析表明胶膜的结晶度降低,有利于提高膜的韧性。 力学性能测试及吸水率测试结果表明,当有机硅含量为1.9%时,胶膜的拉伸强度最高达到25.03 MPa,断裂伸长率为328%,此时膜的吸水率最低。     

Fire- and heat-resistant adhesive resins based on maleimido and citraconimido substituted 1-[(dialkoxyphosphinyl)methyl]-2,4- and -2,6-diaminobenzenes

A novel class of fire- and heat-resistant bisimide resins was prepared by thermal polymerization of maleimido or citraconimido derivatives of 1-[(dialkoxyphosphinyl)methyl]-2,4- and -2,6-diaminobenzenes (1). The neat bisimide resin prepared by curing 1-[di(2-chloroethoxyphosphinyl)methyl]-2,4- and -2,6-bismaleimidobenzene exhibited a limiting oxygen index 75% higher and smoke evolution about 30 times lower compared with the parent polymer obtained by curing m-phenylenebismaleimide. The char yield of cured bisimide resins at 700°C was 58–70% in a nitrogen atmosphere and 35–60% in air. An increase in formula weight between the imide groups slightly reduced the char yield. The polymer precursors were synthesized by reacting the phosphorus-containing diamines (1) (1 mol) with maleic anhydride/citraconic anhydride (2 mol) or by reacting the monomaleimido derivative of (1) with benzophenone tetracarboxylic dianhydride/methylenebis(4-phenylisocyanate) in a 2:1 mole ratio. The monomers were characterized by elemental analysis, Fourier-transform–infrared (FT-IR), proton nuclear magnetic resonance (¹H-NMR) spectroscopy, and gas chromatography–mass spectroscopy (GC-MS). Direct cleavage of the P? C bond and inversion of the synthesis reaction may occur during their pyrolysis. The thermal polymerization of the monomers was investigated by differential scanning calorimetry (DSC). Biscitraconimides are thermally polymerized at a relatively lower temperature than the corresponding bismaleimides.     

Curing and thermal behaviour of DGEBA using mixture of biuret and 4,4′-diaminodiphenylsulfone

Curing behaviour of DGEBA was investigated in the presence of varying molar ratio of biuret and 4,4′-diaminodiphenylsulfone (DDS) by means of Differential scanning calorimetery. The multiple heating rate method (5, 10, 15 and 20 °C min⁻¹) was used to study the curing behaviour of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rates, structure of biuret as well as on the ratios of biuret:DDS used. Ozawa method was used for calculating the activation energy of curing reaction. The thermal stability of the isothermally cured resins was evaluated by recording the thermogravimetric traces in nitrogen atmosphere. All the samples were stable up to 330 °C.     

Effects of silphenylene units on the thermal stability of silicone resins

A series of silicone resins containing silphenylene units were synthesized by a hydrolysis-polycondensation method, with methyltriethoxysilane, dimethyldiethoxysilane and 1,4-bis(ethoxydimethylsilyl)benzene. Their thermal degradation behaviours were studied by thermogravimetric analysis (TGA), differential thermogravimetry (DTG) and Fourier-transform infrared (FTIR) spectroscopy, and the effect of silphenylene units on the thermal stability of silicone resins was also investigated. Results showed that the thermal stability of silicone resins was improved by the introduction of silphenylene units into the backbone. Under nitrogen atmosphere, the temperature for maximum degradation rate of silicone resins with silphenylene units was lower compared to the pure methylsilicone resin. With the increase of silphenylene units, the amount of degradation residues increased under nitrogen atmosphere while it decreased under air atmosphere. Additionally, the short-term and long-term stability of silicone resins were also improved by the introduction of silphenylene units.     

含双螺环三聚磷腈单元的苯并噁嗪树脂的结构和热稳定性

以双螺环取代三聚磷腈基双苯甲酰氯和4-氨基(N-苯基)苯并噁嗪单体为原料合成了一种含双螺环取代三聚磷腈结构单元的苯并噁嗪树脂单体(HCP-5);采用傅立叶变换红外光谱仪(FT-IR)和核磁共振谱仪(1 H NMR,13 C NMR,31P NMR)表征了苯并噁嗪树脂单体的结构,基于FT-IR和示差扫描量热法研究了其固化行为,并利用热重分析和示差热重分析研究了HCP-5树脂单体、均聚物及其与双酚A型苯并噁嗪树脂(Bz)共聚物的热稳定性.结果表明,HCP-5均聚物具有很好的热稳定性和成炭性,其在317℃下的热失重为5%,在800℃下的残炭率为50%,可用于普通苯并噁嗪树脂改性.此外,HCP-5/Bz(1∶1;质量分数)共聚物在332℃下的热失重为5%,在800℃下的残炭率为48%.     

The curing of epoxy resins with aminophenoxycyclotriphosphazenes

Aminophenoxycyclotriphosphazenes have been used as curing agents for epoxy resins. The thermal curing was performed in stages at 120–125 and 175–180°C followed by postcuring at 225°C to give tough brown polymers. The thermal curing reaction was monitored using FTIR and differential scanning calorimetry. Thermogravimetric analysis of the cured resins has shown thermal stability up to 350–340°C. The char yield obtained in nitrogen at 800°C was about 55–42% and in air at 700°C was about 40–32%. Graphite cloth laminates were prepared. The mechanical properties evaluated were found superior to those of commonly used epoxy resin systems. These resins are useful for making fire- and heat-resistant composites, laminates, molded parts, and adhesives.     

Preparation and properties of modified bismaleimide resins by novel bismaleimide containing 1,3,4‐oxadiazole

Bismaleimide (BMI) resin is a high‐performance thermosetting polymer, but its inherent brittleness hinder a broader range of application. Therefore, it has aroused wide concern to improve the toughness of BMI resins without scarification of their thermal stability. This paper reported some studies on modified BMI resins based on diallyl bisphenol A, novel BMI monomers, e.g. 2‐[3‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (m‐Mioxd) or 2‐[4‐(4‐maleimidophenoxy)phenyl]‐5‐(4‐maleimidophenyl)‐1,3,4‐ oxadiazole (p‐Mioxd) in different proportions (0.87:1, 1:1, 1.2:1; mol/mol). The curing mechanism and kinetics of the copolymerized systems were investigated by differential scanning calorimetry and Fourier transform infrared spectroscopy. Thermogravimetric analysis was applied to study the thermal properties of the cured resins, and the results indicated that the modified resins had excellent thermal stability with high residual weight percentage at 700°C (>50%), temperatures for 5% weight loss around 400°C. Besides, N,N′‐4,4′‐bismaleimidodiphenylmethylene and O,O′‐diallyl bisphenol A resin blends were modified by m‐Mioxd and p‐Mioxd, respectively. We investigated the effects of mole concentration of m‐Mioxd or p‐Mioxd on the curing process, mechanical properties, fracture toughness, and heat resistance of the modified resins. The results revealed that the introduction of m‐Mioxd and p‐Mioxd could improve the impact property of the modified BMI resins. When their proportion was 0.07, the impact strength increased 123.8% and 108.3%, respectively. The novel chain‐extended BMIs could reduce the crosslink density of cured resins and improve the brittleness effectively. Copyright © 2015 John Wiley & Sons, Ltd.     

The effect of nanoparticles on structural morphology, thermal and flammability properties of two epoxy resins with different functionalities

The effect of layered silicate nanoclays, nano-silica and double-walled carbon nanotubes (DWNTs) on the thermal stability and fire reaction properties of two aerospace grade epoxy resins (a high temperature curing tetra-functional and a low temperature curing bi-functional resin) has been investigated using thermal analysis, cone calorimetry, LOI and UL-94 techniques. The morphology of the polymer-clay nanocomposites, determined by X-ray diffraction and transmission electron microscopy indicated intercalated structures. The addition of nanoclays (5-wt%) to both resins had a thermal destabilisation effect in the low temperature regime (<400 °C), but led to higher char yield at higher temperatures. The inclusion of nano-silica at 30-wt% significantly improved the thermal stability of the resins while DWNTs had an adverse effect due to their poor dispersion in the matrix. The nanoclays and carbon nanotubes significantly increased the fire resistance of the tetra-functional epoxy resin while a minimal effect was observed for the bi-functional resin.     

Synthesis and Characterization of Melamine Formaldehyde Resins for Decorative Paper Applications

Melamine‐formaldehyde (MF) resins of improved environmental compatibility were synthesized at different molar ratios, temperature and pH. Five molar ratios of melamine and formaldehyde: 35:65, 36.5:63.5, 38.3:61.7, 41.1:58.9 and 42.4:58.6 were used to synthesize the corresponding resins. The prepared samples were characterized by using molecular weight determination viscometery, field emission scanning electron microscopy and thermogravimetric analysis. It was noticed that the solid content in the resin increases with an increase in pH. The maximum percentage of the solid content (51 %) was obtained for pH of 8.5 and temperature range of 95–98 ^oC. The refractive index of the final product was found increasing with an increase of melamine concentration in the resin. A similar trend was noticed in molecular weight of the resins with an increase in monomer yield. The maximum molecular weight of 114218 was obtained from the sample synthesized with MF molar ratio of 42.4:58.6.