| C-mount封装不同激光器芯片尺寸的热阻分析 |
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| 引用本文： | 马祥柱,霍晋,曲轶,杜石磊,王宇.C-mount封装不同激光器芯片尺寸的热阻分析[J].发光学报,2011,32(2):184-187. |
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| 作者姓名： | 马祥柱 霍晋 曲轶 杜石磊 王宇 |
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| 作者单位： | 1. 长春理工大学 高功率半导体激光国家重点实验室, 吉林 长春 130022;
2. 海特光电有限责任公司, 北京 100083 |
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| 摘 要： | 采用波长漂移法对基于C-mount封装类型的不同尺寸芯片的热阻进行测量,得到了使热阻最小的最佳芯片尺寸和铟焊料厚度.测量结果表明,在铟焊料厚度为10 μm、输出功率为2 W、条宽为200 μm、腔长为2 000 μm时,激光器芯片的热阻最小值为2.01℃/W.在铟焊料厚度为5 μm和10μm两种条件下,对腔长为2 00...
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| 关 键 词： | 热阻 C-mount封装 激光二极管 铟焊料 |
| 收稿时间： | 2010-06-30 |
Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package |
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| MA Xiang-zhu,HUO Jin,QU Yi,DU Shi-lei,WANG Yu.Thermal-resistor Analysis of The Laser Chips with Different Size in C-mount Package[J].Chinese Journal of Luminescence,2011,32(2):184-187. |
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| Authors: | MA Xiang-zhu HUO Jin QU Yi DU Shi-lei WANG Yu |
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| Institution: | 1. National Key Laboratory on High Power Semiconductor Laser, Changchun University of Science and Technology, Changchun 130022, China;
2. Hi-Tech Optoelectronics Co., Ltd., Beijing 100083, China |
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| Abstract: | Thermal-resistor of different chips based on C-mount package have been measured with the method of wavelength shift in this paper.Through the thermal-resistance measurement, we can get the best size of chip and the thickness of In solder to make the smallest thermal-resistance. The results show that when the thickness of In solder is 10 μm, the output power is 2 W, the bar width is 200 μm, the cavity length is 2 000 μm and the minimum thermal-resistor of the chip is 2.01 ℃/W.The thermal-resistors with carvity length of 2 000 μs have been measured when the In solder thickness is 5 μm and 10 μm. The results show that the thermal-resistor dropes from 2.01 ℃/W to 1.85 ℃/W for the 5 μm In solider. |
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| Keywords: | thermal-resistor C-mount package laser diode In-solder |
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