Removal of oxygen atoms from a SiO2 surface by incoherent vacuum ultraviolet excimer irradiation

We have demonstrated the non-thermal removal of oxygen atoms from an oxidized silicon surface (SiO₂) on a silicon wafer by the use of a low-power (0.3 mW cm^-2) incoherent vacuum ultraviolet (VUV) light source at 126 nm. X-ray photoelectron spectroscopy (XPS) has shown that a maximum Si concentration of 80% appears at the surface after a 20-h irradiation with 9.8 eV photons, as a result of oxygen removal from the SiO₂ matrix. The surface morphology, however, indicates no damage or melting on the surface even after the irradiation. Received: 15 April 2002 / Accepted: 17 April 2002 / Published online: 10 September 2002 RID="*" ID="*"Permanent address: Nano-Tech Photon Inc., Shimotomita 4132-1, Shintomi, Miyazaki, 889-1404, Japan RID="**" ID="**"Corresponding author. Fax: +81-985/583-899, E-mail: kubodera@opt.miyazaki-u.jp