Synthesis and thermal stability of the resins prepared from the reactions of 1,4-bis(2,2-dicyanovinyl)benzene with aromatic diamines and electrical conductivity of the resulting materials following pyrolysis

New thermosetting resins were prepared from the reaction of 1,4-bis(2,2-dicyanovinyl)benzene with aromatic diamines in varying molar ratios. The thermal stability of these resins was correlated with their composition and the curing conditions. They were stable in N₂ up to 370–448°C and afforded anaerobic char yields of 73–84% at 800°C after curing at 300°C for 20–60 h. The temperature dependence of the electrical resistivity of all resins pyrolyzed at 700°C for 15 h was studied in the temperature range from ?173–327°C (100–600 K). The results showed that at room temperature the unpyrolyzed polymers have insulating properties, whereas a dramatic decrease in the electrical resistivity is observed following pyrolysis. The temperature dependence of the electrical resistivity suggests that all of the materials studied have semiconducting properties. The observed electrical conductivity is thermally activated with activation energies ranging from 0.03–0.06 eV. © 1994 John Wiley & Sons, Inc.     

Heat-resistant polymers from melt-processable bisimido-bisphthalonitriles

Heat-resistant polymers which are processable into void-free components and suitable for composite applications have been synthesized by thermal/chemical polymerization of four newly developed bisimido-bisphthalonitriles containing silicon, ether, carbonyl, and hexafluoroisopropylidene groups. Thermal polymerization involving addition reactions was performed at 200–275°C for 2–10 h and then post-curing at 310°C for 10 h. Polymers VI, VII, VIII , and IX were obtained. The thermal polymerization was monitored using infrared spectroscopy. Thermal polymerization was also carried out in the presence of an aromatic diamine. A polyhexasocyclane ( V ) was synthesized by condensation polymerization of ether containing bisimido-bisphthalonitrile with 4,4′-diaminodiphenyl ether in solvent phenol. The synthesized polymers were evaluated for thermal stability using dynamic thermogravimetric analysis (TGA). Polymers VII, VIII, IX , and X showed thermal decomposition temperature in the range of 475–500°C in nitrogen and air atmosphere. The char yield of the polymers was in the range of 60–69% in nitrogen at 800°C. This study indicated that synthesized thermosetting polymers from ether and keto containing bisimido-bisphthalo-nitrile are potential candidates for development of graphite composites. © 1993 John Wiley & Sons, Inc.     

双马来酰亚胺增韧研究Ⅱ.链扩展双马来酰亚胺及其树脂的合成及表征

合成了一系列结构不同和链长短不一的双马来酰亚胺，并对其结构和性能作了表征，同时研究了它们的固化反应和固化产物的性能。用双马来酰亚胺和二烯丙基化合物反应制造了增韧树脂，研究了该树脂的固化和热稳定性。     

Thermosetting resins from a tetra-functional vinylbenzene compound possessing cyclic siloxane cores

Cyclic siloxane is an attractive building block for incorporation of silicon-containing units as well as their distinguished properties to polymer materials. This work reports the synthesis and characterization of a tetra-functional vinylbenzene compound possessing cyclic siloxane cores (cD₄-4VB). Synthesis of cD₄-4VB is carried out using cD₄-4SiH as the reactive precursor and multiple-step reactions, including hydrosilylation, deacetylation, and S_N2 substitution. cD₄-4VB is an effective monomer for preparation of the corresponding cyclic silicon-based thermosetting resins (CR-cD₄-4VB). CR-cD₄-4VB shows attractive film formability and good thermo-mechanical properties, including a storage modulus of 2.0 GPa, a glass transition temperature of 282°C, a thermal stability above 400°C, a high char yield (at 800°C in nitrogen) of 55 wt%, and a dielectric constant of 3.12 at 10 GHz. This kind of resins have potential of application for halogen-free flame retardants and high-performance polymer films.     

Novel toughened automotive clearcoats modified by a polyester‐amide hyperbranched polymer: structural and mechanical aspects

The present work attempts to study the mechanical properties and toughness behavior of a typical acrylic melamine clearcoat modified by a polyester‐amide hyperbranched polymer (HBP). Formulations were such that 0, 5, 10, 25 and 50% (molar percent) of total acrylic hydroxyl groups were stoichiometrically substituted by those of HBP. Bulk and surface of the clearcoats were studied by various mechanical techniques including hardness, tensile, dynamic mechanical thermal analysis (DMTA), nano‐indentation and scratch tests. In addition a scanning electron microscope (SEM) was utilized to observe the morphology of the fractured films. The bulk mechanical properties showed that a low loading (5 molar %) of HBP was sufficient to considerably increase the bulk hardness, cross‐linking density and toughness. DMTA and SEM results proved the occurrence of a single‐phase blend and that the shear deformation was the main toughening mechanism of HBP modified clearcoats. In general, it was revealed that the HBP not only could act as an excellent compatible toughening agent, but also maintained the clarity of the clearcoat and increased its scratch resistance. Copyright © 2013 John Wiley & Sons, Ltd.     

9,10-2H-9-氧杂-10-磷杂菲-10-氧化物基1,3-苯并噁嗪树脂的合成与表征

以水杨醛、对甲基苯胺(或对氟苯胺,对甲氧基苯胺)、9,10-2H-9-氧-10-磷杂菲-10-氧化物(DOPO)及甲醛为原料,通过三步反应合成了三个含DOPO基的1,3-苯并噁嗪化合物3a-3c.第一步,水杨醛与对位取代苯胺进行缩合反应生成亚胺(1a-1c);第二步,DOPO对亚胺进行加成反应得到仲胺(2a-2c);第三步,仲胺与甲醛在强酸性离子交换树脂催化下进行关环反应形成含DOPO的1,3-苯并噁嗪树脂.采用红外光谱、核磁共振谱和质谱等表征了化合物3a-3c,同时采用热失重分析技术测定了其热稳定性.结果表明,3a-3c由两对对映体组成,质谱条件下2a-2c和3a-3c均经裂解失去稳定的DOPO基团;3a-3c热降解反应包含两个热失重过程,分别在250和400℃下出现最大热释放速率.     

Synthesis of poly(isopropenylphenoxy propylene carbonate) and its facile side‐chain functionalization into hydroxy‐polyurethanes

4‐Isopropenyl phenol ( 4‐IPP ) is a versatile dual functional intermediate that can be prepared readily from bisphenol‐A ( BPA ). Through etherification with epichlorohydrin to the phenolic group of 4‐IPP , it can be converted into 4‐isopropenyl phenyl glycidyl ether ( IPGE ). On further reaction with carbon dioxide in the presence of tetra‐n‐butyl ammonium bromide ( TBAB ) as the catalyst, IPGE was transformed into 4‐isopropenylphenoxy propylene carbonate ( IPPC ) in 90% yield. Cationic polymerization of IPPC with strong acid such as trifluoromethanesulfonic acid or boron trifluoride diethyl etherate as the catalyst at ?40 °C gave a linear poly(isopropenylphenoxy propylene carbonate), poly( IPPC ), with multicyclic carbonate groups substituted uniformly at the side‐chains of the polymer. The cyclic carbonate groups of poly( IPPC ) were further reacted with different aliphatic amines and diamines resulting in formation of polymers with hydroxy‐polyurethane on side‐chains. Syntheses, characterizations of poly( IPPC ) and its conversion into hydroxy‐polyurethane crosslinked polymers were presented. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 802–808     

m‐Xylylene bismaleimide: a versatile building block for high‐performance thermosets

m‐Xylylene bismaleimide, Compimide ? ? Compimide® is a registered trademark.
MXBI (hereafter MXBI), was developed as a building block for formulating bismaleimide resins with improved processability. MXBI on its own, or in combination with 4,4′‐bismaleimidodiphenylmethane (Compimide MDAB, hereafter MDAB) and with 2,2′‐diallylbisphenol‐A as a co‐monomer, provides very low‐melting resin blends, which can be processed at temperatures around 60–80°C via RTM (Resin Transfer Moulding), VARIM (Vacuum Assisted Resin Infusion Moulding), prepregging, and wet filament winding (FW). Uncured and cured resin properties were evaluated. The mechanical property spectrum of the MXBI/MDAB/diallylbisphenol‐A system with varying MXBI/MDAB ratio shows almost equivalent contributions of MXBI and MDAB to the mechanical properties of a system. Higher MXBI proportions are responsible for lower resin viscosities and hence superior processability. Copyright © 2015 John Wiley & Sons, Ltd.     

Synthesis of fully lower‐rim,carbonate‐bridged calix[8]arenes and their curing behavior

Novel fully lower‐rim, carbonate‐bridged calix[8]arene derivatives were successfully synthesized in high yield by the condensation of p‐alkyl substituted calix[8]arenes with triphosgene. Different bases and catalysts were used for the preparation depending on the p‐alkyl substituted groups of the calix[8]arenes. The conformational features of the derivatives were examined by ¹H NMR analysis. Thermosetting formulations were prepared from a mixture of bisphenol A polycarbonate with calix[8]arene carbonate derivatives using sodium benzoate as a catalyst. Their crosslinking behaviors were studied using differential thermal/thermogravimetric analysis. No glass‐transition temperatures were observed after annealing at 280–300 °C. © 2001 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 39: 1149–1155, 2001     

Direct Measurement of Cure‐Induced Stress in Thermosetting Materials by Means of a Dynamic Mechanical Analyzer

Summary: Significant stresses develop during cure in functional and structural applications of polymeric materials ranging from glass fiber composites to advanced functional polymers used in microelectronics, optoelectronics, and biomaterials applications. These stresses arise from a combination of chemical shrinkage and stiffness buildup in a confined geometry. In this paper, a new method for direct measurement of cure‐induced stresses during curing of thermosetting materials by using the iso‐strain mode of a dynamic mechanical analyzer (DMA) has been developed. A thermal tape was used to facilitate maintaining a constant strain and initiate the iso‐strain measurement. Two quartz rods with a small gap were used to contain the material. The top of the quartz rod and one side of the thermal tape were secured by the fixed clamp, while the bottom quartz rod and the other side of the thermal tape were clamped with the moveable force probe. The cure force was thereby directly measured by the probe during the curing process. The cure stress buildup was observed to occur after a certain duration that corresponds to the gel point. Experimental results clearly show that curing at lower temperature could lead to higher cure stress due to the earlier onset of vitrification. An investigation of the stress buildup as a function of degree of cure indicates that a majority of the cure stress was generated in the vitrification regime. The methodology proposed herein provides an accurate experimental approach to investigate the cure‐induced stress generated in a thermosetting material in applications ranging from microelectronics and optoelectronics packaging to biomaterials amongst others.

Evolution of cure force and heat flow measured by means of DMA and DSC, respectively, at cure temperature 100 °C.