Thermal expansion behavior of solar cell encapsulation materials

The object of this paper is to determine the thermal expansion behavior of nine different encapsulants in order to identify possible deficiencies in production processes and allow for the optimization of the process parameters. High dimensional stability of the encapsulant is of great importance in photovoltaic (PV) module production to avoid problems during lamination and/or in application. For this purpose, the samples were heated twice in a thermo-mechanical analyzer (TMA) in tensile mode, and the coefficient of thermal expansion (CTE) over temperature was evaluated. To get additional information about transition temperatures of the encapsulants, differential scanning calorimetry (DSC) measurements were made. The TMA results for most samples showed anisotropic behavior which was eliminated after the first heating run. Three samples showed shrinkage with subsequent increased thermal expansion as well as anisotropic behavior. It could be shown that knowing the thermal expansion behavior of the solar cell encapsulants is highly relevant for the PV module lamination process, and Thermo-Mechanical Analysis proved to be a suitable method to evaluate and also for quality control of solar cell encapsulation films.     

Synthesis and characterization of poly(epoxy‐imide) crosslinked networks

Poly(epoxy imide)s were prepared by a reaction between a hydroxyl‐group‐containing soluble copolyimide and commercial epoxy resins at 220 °C for 2 h. Poly(epoxy imide) thin films exhibited higher thermal stability and lower dielectric constants than a commercial flip‐chip package material (U300). The thermal stabilities of the poly(epoxy imide)s were 1.4–2.0 times higher than that of U300. The thermal stability increased with increasing crosslink density and with decreasing bulky CF₃ groups (which were easily decomposable). The dielectric constants of the poly(epoxy imide)s were 1.1–1.3 times lower than that of U300, and this is highly desirable for the microelectronic packaging industry. The dielectric constant dramatically decreased when bulky CF₃ groups were added and when the functionalities of epoxy resins decreased. The residual stresses, slopes in the cooling curves, and glass‐transition temperatures of the poly(epoxy imide)s were measured with a thin‐film stress analyzer. Low residual stresses and slopes in the cooling curves were achieved with a higher crosslink density. However, in the presence of bulky CF₃ groups, the copolyimide backbone structure did not affect the residual stress values. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 4293–4302, 2004     

光伏组件封装材料进展

封装材料是影响目前太阳能等光伏组件使用性能的重要因素。结合最新研究进展,本文从化学观点出发,综述和评论了实用的乙烯-乙烯醋酸酯共聚物(EVA)、聚乙烯醇缩丁醛(PVB)和聚二甲基硅氧烷(PDMS)材料在使用过程出现的问题以及改性研究方法,强调了PDMS材料在太阳能光伏组件封装中的重要性。     

发展中的电子化工材料

本文介绍了国内外电子化工材料部分大类品种的现状及发展趋向,并提出至2000年发展我国电子化工材料的措施和建议。