Benzo[b] thiophene derivatives. XVIII. The sulfur isosteres of harmaline,harmine and related isomers

The sulfur analogs of harmaline, 7-methoxy-3,4-dihydro-1-methyl[1]benzothieno[2,3-c]-pyridine (Ib), harmine, 7-methoxy-1-methyl[1]benzothieno[2,3- c ]pyridine (IIb), and corresponding 6-methoxy isomers (Ic and IIc) have been synthesized for pharmacological evaluation as monoamine oxidase inhibitors.     

On the slope of the differential cross section for the photo- and electroproduction of vector mesons

The photo- and electroproduction of ? mesons at high energy is examined in a simple Regge-pole model with q² dependent residues. The behaviour of the differential cross section at t=0 and of its slope, as a function of the q² and of the photon energy, are correlated, and good fits to the data are obtained.     

Efficient 1645-nm Er:YAG laser

We report a resonantly fiber-laser-pumped Er:YAG laser operating at the eye-safe wavelength of 1645 nm, exhibiting 43% optical efficiency and 54% incident slope efficiency and emitting 7-W average power when repetitively Q switched at 10 kHz. To our knowledge, this is the best performance (conversion efficiency and average power) obtained from a bulk solid-state Q-switched erbium laser. At a 1.1-kHz pulse repetition frequency the laser produces 3.4-mJ pulses with a corresponding peak power of 162 kW. Frequency doubling to produce 822.5-nm, 4.7-kW pulses at 10 kHz was performed to demonstrate the laser's utility.     

High Entropy Alloys as Filler Metals for Joining

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.     

An electromagnetic,plane stress-wave generator

This paper describes a unique device that has been developed for the transient loading of models along straight and curved boundaries and that operates by discharge of a high-energy, high-voltage capacitor bank. In its present configuration, this device can generate uniform pressures from 1500 psi (10 MPa) to pressures that approach 100,000 psi (690 MPa) and that rise from zero to maximum pressure in 2 μs and decay to approximately zero in another 2 μs. The transient stress-wave patterns in photoelastic models loaded with this device have been recorded by a dynamic polariscope. The dynamic polariscope presently in use is identical to a static polariscope except that the light source is of a short enough duration (½ μs) to photographically stop the movement of the photoelastic-fringe patterns caused by the stress wave. With the stress-wave generator and the dynamic polariscope, transient photoelastic patterns have been recorded in a number of models. These patterns indicate that the scatter from duplicate shots performed with this technique is on the order of 3 percent. This represents considerable improvement over the 15-percent scatter normally experienced with sheet-explosive loading techniques. This improvement and the rapid turnaround between shots (approximately 5 min) are distinct advantages this system has over other methods of dynamic loading.     

Untersuchung verschiedener Lebensmittel

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