生物质燃烧中碱金属和氯沉积烧结行为分析

采用化学热力学平衡的方法,对秸秆燃烧中K、Na、Cl的转化规律及形成的产物进行了研究,并与锅炉采样结果对照,讨论了生物质锅炉过热器严重积灰烧结的原因。研究结果表明,生物质中的K、Na、Cl在燃烧温度小于600℃时只存在于固相中。当温度大于600℃时产生气态的KCl、NaCl、KOH、NaOH、K、Na等。现场采样结果表明,生物质锅炉的过热器积灰烧结问题正是由这些气态碱金属化合物的凝结和硫酸盐化而引起的。     

Stable 85Rb micro vapour cells: fabrication based on anodic bonding and application in chip-scale atomic clocks

We describe the microfabrication of 85 Rb vapour cells using a glass-silicon anodic bonding technique and in situ chemical reaction between rubidium chloride and barium azide to produce Rb.Under controlled conditions,the pure metallic Rb drops and buffer gases were obtained in the cells with a few mm 3 internal volumes during the cell sealing process.At an ambient temperature of 90 C the optical absorption resonance of 85 Rb D1 transition with proper broadening and the corresponding coherent population trapping (CPT) resonance,with a signal contrast of 1.5% and linewidth of about 1.7 kHz,have been detected.The sealing quality and the stability of the cells have also been demonstrated experimentally by using the helium leaking detection and the after-9-month optoelectronics measurement which shows a similar CPT signal as its original status.In addition,the physics package of chip-scale atomic clock (CSAC) based on the cell was realized.The measured frequency stability of the physics package can reach to 2.1×10 10 at one second when the cell was heated to 100 C which proved that the cell has the quality to be used in portable and battery-operated devices.     

基于微电子机械系统技术的高灵敏度电容式微传声器的研制

基于微电子机械系统（ＭＥＭＳ）技术的微传声器是当前国际上研究的热点。使用 ＭＥＭＳＩ艺制备的薄膜一般有着不可忽视的残余应力,极大的降低了膜的机械灵敏度。理论分析和数值模拟表明,纹膜结构可在不改变工艺条件的前提下,显著的降低残余应力的不良影响,大幅度增加膜的灵敏度。本文提出了一种使用ＭＥＭＳ技术制作的纹膜结构电容式微传声器,其制作工艺简单、重复性好,所用材料也能与 ＩＣＩ艺很好的兼容。圆片级测试的结果表明,在 １０ Ｖ的偏置电压下,这种微传声器在 ７ ｋＨｚ以下具有平直的频响,开路灵敏度可达 ４０ ｍv／Ｐａ,而其占用的芯片面积仅为 １．５ ×ｌ．５ ｍｍ２。进一步的研究可望将信号处理电路集成于片内,形成完整的微声学系统。     

硅通孔(TSV)的工艺引入热应力及其释放结构设计

在3D SiP(三维系统级封装)的TSV(硅通孔)的工艺制造过程中,热应力会引发TSV周围的载流子迁移率的改变,进而改变3D系统级封装芯片的性能.针对这一问题,提出了一种TSV热应力释放槽结构,以期解决微机电系统(MEMS)应用的大尺寸TSV的热应力问题.在释放槽内外,硅衬底表面的应力得到有效隔离,表面应力大大降低.在结合可行工艺参数的基础上,通过数值模拟对比了3D与2D模型的区别、不同TSV材料的区别,计算应力释放槽的深度、位置、宽度等因素对硅衬底表面应力释放的效果,给出了TSV应力释放槽的布局建议.研究结果表明含有释放槽的TSV,释放槽外热应力可以减小至无释放槽情况下的40%~60%,保留区域的面积也相应降低.     

High Spatial Resolution of an Optical Addressing Spatial Light Modulator Made by Photorefractive Semi—Insulting Multiple Quantum Wells

We use nondegenerate four-wave mixing to study the spatial resolution of photorefractive semi-insulating mulatiple quantum wells grown by molecular beam epitaxy.By optimizing the experimental conditions,we have demonstrated that our sample has spatial resolution up to 2.5μm,which approaches the theoretical limit.We also analyse the factors that affect the spatial resolution of multiple quantum wells.