基于MOCVD三步生长的GaAs/Si外延技术EI北大核心CSCD

在硅(Si)上外延生长高质量的砷化镓(GaAs)薄膜是实现硅基光源单片集成的关键因素。但是,Si材料与GaAs材料之间较大的晶格失配、热失配等问题对获得高质量的GaAs薄膜造成了严重影响。本文利用金属有机化学气相沉积(MOCVD)技术开展Si基GaAs生长研究。通过采用三步生长法,运用低温成核层、高温GaAs层与循环热退火等结合的方式,进一步降低Si基GaAs材料的表面粗糙度和穿透位错密度。并利用X射线衍射(XRD)ω-2θ扫描追踪采用不同方法生长的样品中残余应力的变化。最终,在GaAs低温成核层生长时间62 min(生长厚度约25 nm)时,采用三步生长、循环热退火等结合的方式获得GaAs(004)XRD摇摆曲线峰值半高宽(FWHM)为401″、缺陷密度为6.8×10^(7) cm^(-2)、5μm×5μm区域表面粗糙度为6.71 nm的GaAs外延材料,在材料中表现出张应力。     

Spatial and spectral filtering of tapered lasers by using tapered distributed Bragg reflector grating

A 1040 nm tapered laser with tapered distributed Bragg reflector (DBR) grating is designed and fabricated. By designing the grating with tapered layout, the tapered DBR grating exhibits the scattering effect on side backward-traveling waves, thus achieving additional suppression of parasitic oscillation. Under the suppression of parasitic oscillation, the spatial and spectral characteristics of the tapered laser are improved. The experimental results show that a near-Gaussian far-field distribution and a kink-free P-I characteristics are achieved, and a single peak emission with a wavelength of 1046.84 nm and a linewidth of 56 pm is obtained.     

Low Specific On-Resistance SOI LDMOS with Non-Depleted Embedded P-Island and Dual Trench Gate

A new silicon-on-insulator(SOI) trench lateral double-diffused metal oxide semiconductor(LDMOS) with a reduced specific on-resistance R_(on),sp is presented. The structure features a non-depleted embedded p-type island(EP) and dual vertical trench gate(DG)(EP-DG SOI). First, the optimized doping concentration of drift region is increased due to the assisted depletion effect of EP. Secondly, the dual conduction channel is provided by the DG when the EP-DG SOI is in the on-state. The increased optimized doping concentration of the drift region and the dual conduction channel result in a dramatic reduction in R_(on),sp. The mechanism of the EP is analyzed,and the characteristics of R_(on),sp and breakdown voltage(BV) are discussed. Compared with conventional trench gate SOI LDMOS, the EP-DG SOI decreases R_(on),sp by 47.1% and increases BV from 196 V to 212 V at the same cell pitch by simulation.     

高反射光学薄膜激光损伤研究进展

激光诱导损伤阈值是大功率光学系统中重要参数,其数值大小对激光系统的输出功率与稳定性具有重要影响。为了突破损伤阈值对激光光学系统输出功率的限制,科研人员主要从制备薄膜工艺、激光特性、薄膜特性以及薄膜后工艺等方面开展研究。本文介绍了高反膜理论、制备工艺;综述了近十年来国内外对高反膜损伤研究的成果;阐述了激光特性、薄膜特性以及薄膜后工艺对薄膜损伤阈值的影响。在此基础上,对提高高反膜损伤阈值的研究和发展趋势进行了分析与展望。     

Lateral characteristics improvements of DBR laser diode with tapered Bragg grating

Broad area semiconductor laser (BAL) has poor lateral beam quality due to lateral mode competition, which limits its application as a high-power optical source. In this work, the distributed Bragg reflector laser diode with tapered grating (TDBR-LD) is studied. By changing the lateral width, the tapered grating increases the loss of high-order lateral modes, thus improving the lateral characteristics of the laser diode. The measuring results show that the TDBR-LD can achieve a single-lobe output under 0.9 A. In contrast to the straight distributed Bragg reflector laser diode (SDBR-LD), the lateral far field divergence of TDBR-LD is measured to be 5.23° at 1 A, representing a 17% decline. The linewidth of TDBR-LD is 0.4 nm at 0.2 A, which is reduced by nearly 43% in comparison with that of SDBR-LD. Meanwhile, both of the devices have a maximum output power value of approximate 470 mW.     

水平腔面发射半导体激光器研究进展

近年来,水平腔面发射半导体激光器具有高功率、高光束质量及易封装集成等优良性能,已成为激光器领域的研究热点。本文详细阐述了几种水平腔面发射半导体激光器的结构设计、工作原理以及激光输出特性,并对该激光器国内外最新研究进展与发展现状进行了总结和论述。在此基础上,对该激光器的研究方向和发展趋势进行了分析与展望。目前,水平腔面发射半导体激光器的激光输出功率可达瓦级,美国Alfalight公司引入曲线形光栅的单一发射器输出功率可达73 W。随着应用领域的不断拓展,中远红外波段水平腔面发射激光器将成为未来的研究焦点。     

侧向微结构宽脊波导分布反馈1.06μm半导体激光器

为了改善宽脊波导半导体激光器侧模特性和光谱特性,提出了一种具有侧向微结构脊波导和高阶脊表面光栅的分布反馈半导体激光器.该激光器在宽脊波导的两侧刻蚀微结构区,基于各阶侧模光场分布不同的特性,增大了谐振腔内基侧模与高阶侧模的损耗差,消除了远场光斑"多瓣"现象并且输出功率有所提升;同时,借助高阶脊表面光栅,器件的线宽得到了进...