用于中子位置灵敏探测器的SiPM性能研究

为满足中国散裂中子源(China Spallation Neutron Source,CSNS)工程材料衍射谱仪的探测器需求,CSNS探测器组设计并研制了基于硅光电倍增管(Silicon Photomultiplier,SiPM)读出的闪烁体探测器。本工作针对该探测器,选取了Sensl MicroFJ-30035-TSV和Hamamatsu S13363-3050NE-16两种型号的SiPM,开展了其击穿电压、增益、温度特性、暗计数率等关键性能的测试。测试结果显示,两者单光子分辨能力,增益、暗计数率等性能均可满足当前闪烁体探测器需求,相同过偏压下,前者增益高于后者,且Hamamatsu SiPM增益对温度更敏感。测试了两SiPM的温度补偿系数分别为22.0 mV/℃(Sens1)和53.6 mV/℃(Hamamatsu),为后续SiPM温度补偿电路设计奠定了基础。利用研制的探测器工程样机,在CSNS BL09下测试了两种SiPM读出的探测器对2.8 ?中子探测效率分别为76%和68%,为目标探测器及同类型探测器的SiPM选型提供了参考。     

Synthesis of hexagonal boron nitride films by dual temperature zone low-pressure chemical vapor deposition

Hexagonal boron nitride (h-BN) films are synthesized by dual temperature zone low-pressure chemical vapor deposition (LPCVD) through using a single ammonia borane precursor on non-catalytic c-plane Al₂O₃ substrates. The grown films are confirmed to be h-BN films by various characterization methods. Meanwhile, the growth rates and crystal quality of h-BN films at different positions in the dual temperature zone are studied. It is found that the growth rates and crystal quality of the h-BN films at different positions on the substrate are significantly different. The growth rates of the h-BN thin films show their decreasing trends with the rearward position, while the crystal quality is improved. This work provides an experimental basis for the preparation of large area wafer thick h-BN films by LPCVD.