Thermal analysis of GaN-based laser diode mini-array

Thermal characteristics of multiple laser stripes integrated into one chip is investigated theoretically in this paper. The temperature pattern of the laser diode mini-array packaged in a TO-can is analyzed and optimized to achieve a uniform temperature distribution among the laser stripes and along the cavity direction. The temperature among the laser stripes varies by more than 5 K if the stripes are equally arranged, and can be reduced to less than 0.4 K if proper arrangement is designed. For conventional submount structure, the temperature variation along the cavity direction is as high as 7 K, while for an optimized trapezoid submount structure, the temperature varies only within 0.5 K.     

Thermal analysis of GaN laser diodes in a package structure

Using the finite-element method,the thermal resistances of GaN laser diode devices in a TO 56 package for both epi-up configuration and epi-down configuration are calculated.The effects of various parameters on the thermal characteristics are analysed,and the thicknesses of the AlN submount for both epi-up configuration and epi-down configuration are optimized.The obtained result provides a reference for the parameter selection of the package materials.