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A surface crystallization phenomenon on bonding pads and wires of integrated circuit
chip is reported in this paper. Through a lot of experiments, an unknown failure
effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine
contamination cannot cause the failure of bonding pads. By experiments combined with
infrared spectroscopy analysis, the surface crystallization effect is studied. The
conclusion of the study can provide the guidance for IC fabrication, modelling and
analysis. 相似文献
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