Experimental study of surface crystallization on integrated circuit chips |
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| Authors: | Zhang Xin Liu Meng-Xin Gao Yong Wang Cai-Lin Wang Zhi-Wei and Zhang Xian |
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| Affiliation: | Xi'an University of Technology, Xi'an 710048, China; East China Institute of Photo-Electron IC, Bengbu 233042, China |
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| Abstract: | A surface crystallization phenomenon on bonding pads and wires of integrated circuit
chip is reported in this paper. Through a lot of experiments, an unknown failure
effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine
contamination cannot cause the failure of bonding pads. By experiments combined with
infrared spectroscopy analysis, the surface crystallization effect is studied. The
conclusion of the study can provide the guidance for IC fabrication, modelling and
analysis. |
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| Keywords: | infrared spectrum technology bonding pad crystallization failure |
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