Tuning the thermal conductivity of strontium titanate through annealing treatments

Strontium titanate(SrTiO_3) is a promising n-type material for thermoelectric applications. However, its relatively high thermal conductivity limits its performance in efficiently converting heat into electrical power through thermoelectric effect.This work shows that the thermal conductivity of SrTiO_3 can be effectively reduced by annealing treatments, through an integrated study of laser flash measurement, scanning electron microscopy, Fourier transform infrared spectroscopy, x-ray absorption fine structure, and first-principles calculations. A phonon scattering model is proposed to explain the reduction of thermal conductivity after annealing. This work suggests a promising means to characterize and optimize the material for thermoelectric applications.     

带有不完全信息随机截尾试验下参数MLE的重对数律

在条件(Ψ)下,证明了带有不完全信息随机截尾试验中参数MLE的收敛速度符合重对数律,并且验证了指数分布、Weibull分布、对数正态分布满足条件(Ψ).     

具有p-GaN岛状埋层耐压结构的横向AlGaN/GaN高电子迁移率晶体管

GaN基高电子迁移率晶体管(HEMT)相对较低的击穿电压严重限制了其大功率应用.为了进一步改善器件的击穿特性,通过在n-GaN外延缓冲层中引入六个等间距p-GaN岛掩埋缓冲层(PIBL)构成p-n结,提出一种基于p-GaN埋层结构的新型高耐压AlGaN/GaN HEMT器件结构.Sentaurus TCAD仿真结果表明,在关态高漏极电压状态下,p-GaN埋层引入的多个反向p-n结不仅能够有效调制PIBL AlGaN/GaN HEMT的表面电场和体电场分布,而且对于缓冲层泄漏电流有一定的抑制作用,这保证了栅漏间距为10μm的PIBL HEMT能够达到超过1700 V的高击穿电压(BV),是常规结构AlGaN/GaN HEMT击穿电压(580 V)的3倍.同时,PIBL结构AlGaN/GaN HEMT的特征导通电阻仅为1.47 m?·cm~2,因此获得了高达1966 MW·cm~(-2)的品质因数(FOM=BV~2/R_(on,sp)).相比于常规的AlGaN/GaN HEMT,基于新型p-GaN埋岛结构的HEMT器件在保持较低特征导通电阻的同时具有更高的击穿电压,这使得该结构在高功率电力电子器件领域具有很好的应用前景.