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概述了天然宇宙空间的辐射环境,简要地分析了辐射效应机制,在辐射效应的蒙特-卡罗模拟中对靶材料作了无定形假设,入射粒子在靶材料中的弹性能量损失采用经典二体散射公式,非弹性能量损失高能时采用Beth-Bloch公式,低能时采用Lindhard-Scharff公式,中能时采用插值公式,撞出晶格原子引起的次级损伤用Kinchin-Pease模型计算,最后对100KeV硼离子入射于硅材料引起的辐射效应进行了模拟计算,并给出了计算结果和分析。 相似文献
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A versatile metal-organic chemical vapor deposition (MOCVD) system was designed and constructed. Copper films were deposited on silicon (100) substrates by chemical vapor deposition (CVD) using Cu(hfac)2 as a precursor. The growth of Cu nucleus on silicon substrates by H2 reduction of Cu(hfac)2 was studied by atomic force microscopy and scanning electron microscopy. The growth mode of Cu nucleus is initially Volmer-Weber mode (island), and then transforms to Stranski-Rastanov mode (layer-by-layer plus island).The mechanism of Cu nucleation on silicon (100) substrates was further investigated by X-ray photoelectron spectroscopy. From Cu2p, O1s, F1s, Si2p patterns, the observed C=O, OH and CF3/CF2 should belong to Cu(hfac) formed by the thermal dissociation of Cu(hfac)2. H2 reacts with hfac on the surface, producing OH. With its accumulation, OH reacts with hfac, forming HO-hfac, and desorbs, meanwhile, the copper oxide is reduced, and thus the redox reaction between Cu(hafc)2 and H2 occurs. 相似文献
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在自行设计、建立的MOCVD系统上,以Cu(hfac)2为反应前驱物在单晶硅上进行铜薄膜的化学气相沉积,并用AFM、SEM对铜核的成长机理进行了研究.结果表明,反应初期,单晶硅上铜核的成长为岛状,反应后期为先层状后岛状.利用XPS对铜薄膜成长的反应机理进行了探讨,由薄膜的Cu2p、Ols、Fls、Si2p谱可推论出,XPS谱中所出现的C=O、OH及CF3/CF2可能为Cu(hfac),当Cu(hfac)2在高温下分解成Cu(hfac)及hfac后,H2还原表面的hfac生成OH基,反应进行一段时间,OH基浓度大到一定的程度后,与Cu(hfac)2热裂解产生的hfac作用生成HO-hfac并脱附,使表面的铜的氧化物被还原以及发生Cu(hfac)2与H2的氧化还原反应. 相似文献
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