Growth condition optimization and mobility enhancement through inserting AlAs monolayer in the InP-based In_xGa_(1-x)As/In_(0.52)Al_(0.48)As HEMT structures

The structure of In P-based In_xGa_(1-x) As/In0.52Al0.48 As pseudomorphic high electron mobility transistor(PHEMT)was optimized in detail.Effects of growth temperature,growth interruption time,Si δ-doping condition,channel thickness and In content,and inserted Al As monolayer(ML) on the two-dimensional electron gas(2DEG) performance were investigated carefully.It was found that the use of the inserted Al As monolayer has an enhancement effect on the mobility due to the reduction of interface roughness and the suppression of Si movement.With optimization of the growth parameters,the structures composed of a 10 nm thick In0.75Ga0.25 As channel layer and a 3 nm thick Al As/In0.52Al0.48 As superlattices spacer layer exhibited electron mobilities as high as 12500 cm~2·V-1·s~(-1)(300 K) and 53500 cm~2·V~(-1_·s~(-1)(77 K) and the corresponding sheet carrier concentrations(Ns) of 2.8×10~(12)cm~(-2)and 2.9×1012cm~(-2),respectively.To the best of the authors' knowledge,this is the highest reported room temperature mobility for In P-based HEMTs with a spacer of 3 nm to date.     

磷化铟高电子迁移率晶体管外延结构材料抗电子辐照加固设计

为研究磷化铟高电子迁移率晶体管(InP HEMT)外延结构材料的抗电子辐照加固设计的效果,本文采用气态源分子束外延法制备了系列InP HEMT外延结构材料.针对不同外延结构材料开展了1.5 MeV电子束辐照试验,在辐照注量为2×10¹⁵ cm^-2条件下,并测试了InP HEMT外延结构材料二维电子气辐照前后的电学特性,获得了辐照前后不同外延结构InP HEMT材料二维电子气归一化浓度和电子迁移率随外延参数的变化规律,分析了InP HEMT二维电子气辐射损伤与Si-δ掺杂浓度、InGaAs沟道厚度和沟道In组分以及隔离层厚度等结构参数的关系.结果表明:Si-δ掺杂浓度越大,隔离层厚度较薄,InGaAs沟道厚度较大,沟道In组分低的InP HEMT外延结构二维电子气辐射损伤相对较低,具有更强的抗电子辐照能力.经分析原因如下:1)电子束与材料晶格发生能量传递,破坏晶格完整性,且在沟道异质界面引入辐射诱导缺陷,增加复合中心密度,散射增强导致二维电子气迁移率和浓度降低;2)高浓度Si-δ掺杂和薄隔离层有利于提高量子阱二维电子气浓度,降低二维电子气受辐射...     

Effects of growth conditions on optical quality and surface morphology of InGaAsBi

The effects of Bi flux and pressure of AsH_3 on Bi incorporation,surface morphology and optical properties of InGa As Bi grown by gas source molecular beam epitaxy are studied.It is found that using relatively low pressure of AsH_3 and high Bi flux can strengthen the effect on the incorporation of Bi and increase its content linearly with Bi flux until it nearly reaches a saturation value.The result from Rutherford backscattering spectroscopy(RBS) confirms that the Bi incorporation can increase up to 1.13%.By adjusting Bi and As flux,we could improve the surface morphology of In Ga As Bi sample.Room temperature photoluminescence shows strong and broad light emission at energy levels much smaller than the In Ga As bandgap.     

Characterization of low-resistance ohmic contacts to heavily carbon-doped n-type InGaAsBi films treated by rapid thermal annealing

Carbon-doped In Ga As Bi films on In P:Fe(100)substrates have been grown by gas source molecular beam epitaxy(GSMBE).The electrical properties and non-alloyed Ti/Pt/Au contact resistance of n-type carbon-doped In Ga As Bi films were characterized by Van der Pauw-Hall measurement and transmission line method(TLM)with and without rapid thermal annealing(RTA).It was found that the specific contact resistance decreases gradually with the increase of carrier concentration.The electron concentration exhibits a sharp increase,and the specific contact resistance shows a noticeable reduction after RTA.With RTA,the In Ga As Bi film grown under CBr4 supply pressure of 0.18 Torr exhibited a high electron concentration of 1.6×10²¹ cm^-3 and achieved an ultra-low specific contact resistance of 1×10^-8Ω·cm²,revealing that contact resistance depends greatly on the tunneling effect.