High uniformity and forming-free ZnO-based transparent RRAM with HfO_x inserting layer

The impacts of HfO_x inserting layer thickness on the electrical properties of the ZnO-based transparent resistance random access memory(TRRAM) device were investigated in this paper. The bipolar resistive switching behavior of a single ZnO film and bilayer HfO_x/ZnO films as active layers for TRRAM devices was demonstrated. It was revealed that the bilayer TRRAM device with a 10-nm HfO_x inserted layer had a more stable resistive switching behavior than other devices including the single layer device, as well as being forming free, and the transmittance was more than 80% in the visible region. For the HfO_x/ZnO devices, the current conduction behavior was dominated by the space-charge-limited current mechanism in the low resistive state(LRS) and Schottky emission in the high resistive state(HRS), while the mechanism for single layer devices was controlled by ohmic conduction in the LRS and Poole–Frenkel emission in the HRS.     

氧分压对Ni/HfO_x/TiN阻变存储单元阻变特性的影响

采用射频磁控溅射的方法,基于不同氧分压制备的氧化铪构建了Ni/HfO_x/TiN结构阻变存储单元.研究发现,随着氧分压的增加,薄膜表面粗糙度略有降低;另一方面,阻变单元功耗降低,循环耐受性能可达10~3次,且转变电压分布的一致性得到改善.结合电流-电压曲线线性拟合结果及外加温度测试探究了器件的转变机理,得出在低阻态的传导机理为欧姆传导机理,在高阻态的传导机理为肖特基发射机理,并根据氧空位导电细丝理论,对高低阻态的阻变机理进行了详细的理论分析.